An electrical connector and a clamping member thereof. The electrical connector includes an insulating body, multiple terminals fixed to the insulating body, a stiffener surrounding a periphery of the insulating body, a load plate, and a clamping member located between the load plate and the stiffener. A grasping portion protrudes forward from the clamping member. The grasping portion has two first sections provided at each of two opposite sides thereof, two second sections formed by respectively turning and extending forward from the two first sections to be close to each other, two third sections formed by respectively turning and extending forward from the two second sections, and a head formed by extending from the third sections. A distance between the two first sections is greater than a distance between the two third sections, and a width of the head is greater than the distance between the two third sections.

An electrical connector for electrically connecting a chip module, including an insulating body, multiple terminals fixed to the insulating body, a stiffener surrounding the periphery of the insulating body, a carrier for carrying the chip module onto the insulating body, and a load plate for pressing the chip module. The terminals are used for electrically connecting the chip module. The stiffener has a first pivoting portion and a second pivoting portion. The first pivoting portion is located in front of the second pivoting portion, and the first pivoting portion and the second pivoting portion are located on the same side of the insulating body. A rear end of the carrier is pivoted to the first pivoting portion, and a rear end of the load plate is pivoted to the second pivoting portion.

A component loading system includes a board having a socket. A first base member is secured to the board through a plurality of first heat dissipater coupling posts. A first securing member is moveably coupled to the first base member. A second base member is secured to the board through a plurality of second heat dissipater coupling posts. A second securing member is moveably coupled to the second base member. A loading member is moveably coupled to the first base member. A heat dissipater is operable to be coupled to the plurality of first heat dissipater coupling posts and the plurality of second heat dissipater coupling posts. The loading member is operable to be secured to the board by moving the first securing member into engagement with the second base member and moving the second securing member into engagement with the first base member.

Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.

An electrical connector assembly, comprises a first connector, and a second connector mounted onto the first connector, a frame surrounding the connectors, a locking member, an actuator, a first lever assemble the locking member to the frame, and a second lever assemble the actuator to the frame. The locking member locks the second lever, a user must firstly press the first lever to make the locking member release the second lever, and next press the second lever to bring the actuator rotate, and then the actuator upwardly push the second connector to apart the second connector from the first connector.

In one embodiment, a load frame and an integrated circuit device are aligned, with a base frame carried on a substrate, along a first alignment axis defined by a first alignment post extending from the base frame to the load frame, in a direction transverse to the substrate, and a first biasing device carried on the base frame is actuated to engage and bias the load frame toward the base frame aligned with the load frame, and to bias the integrated circuit toward the substrate. A latch latches the load and base frames together, aligned with and biased towards each other with the integrated circuit device and the substrate aligned with, and biased toward each other. Other aspects and features are also described.

The electrical connector includes a frame to assemble a plurality of socket thereto. Each socket includes a plurality of contacts, two inner sides in confrontation with the neighboring sockets, and two outer sides in confrontation with the frame. The frame includes an exterior peripheral structure and an interior cross structure. The outer sides are attached to the exterior peripheral structure while the inner sides are attached to the interior cross structure.

An adapter apparatus and method includes using an adapter body defining a socket cavity configured to receive a packaged device and a torque applicator configured to apply an axial force. A bearing structure positioned between the torque applicator and a packaged device may be used to transfer a force (e.g., an axial force) applied using the torque applicator to the packaged device.

A pressing member is used for downwardly pressing on a chip module. The pressing member has a main body and a central opening going through the main body. The main body has an upper surface and a lower surface opposite to the upper surface. The central opening is provided for a part portion of the chip module going through. The pressing member has a pressing portion protrudes upwardly from the upper surface and provided for an external device pressing downwardly on to make the main body press downwardly on the chip module so as to prevent the chip module from warping.

A clip is used for carrying a chip module to assemble to an electrical connector along a vertical direction. The clip includes a retaining mechanism retaining the chip module and a central opening provided for a part portion of the chip module going through. The clip has an anti-mismating member. When the clip is assembled to the electrical connector by itself disposed in a right-to-left direction perpendicular to the vertical direction or reversely relative to a front-to-back direction perpendicular to the vertical direction, the anti-mismating member stops the clip to be assembled to the electrical connector.