An opening/closing mechanism that allows a cover member to be biased according with the degree of opening. A solution is that an opening/closing mechanism of an opening/closing body, comprises: a cover member 15 opening and closing around a shaft center of a third shaft 33 and disposed on a base portion 23, and an opening/closing body 10 in which the cover member 15 is biased toward an opening direction by a biasing force of a spring member 21 wherein a spring support portion 35 is provided on the base portion 23, and a spring receiver 37 is provided on the cover member 15, and in accordance with more opening of the cover member 15, a distance from the spring base portion 41b of the spring member 21 to an abutting position in the spring extending portion 41a with the spring receiver 37 becomes longer and the biasing force decreases.

An electrical connector assembly includes a carrier having an upper surface and a lower surface. The carrier includes a plurality of contact openings therethrough. The electrical connector assembly includes contacts coupled to the carrier and passing through the corresponding contact openings. Each contact has a conductive polymer column extending between an upper mating interface and a lower mating interface. The conductive polymer column includes an inner core manufactured from a first material and an outer shell manufactured from a second material. The second material has a higher electrical conductivity than the first material. The first material has a lower compression set than the second material.

A disclosed socket may include (1) a base that is arched to match a degree of warpage experienced by an electrical component and (2) an array of contact pins arranged across the base. A first side of the contact pins may be electrically coupled to a circuit board, and a second side of the contact pins may protrude from the base opposite the circuit board to establish contact with the electrical component despite the degree of warpage experienced by the electrical component. Various other apparatuses, systems, and methods are also disclosed.

An independent loading mechanism for use with a CPU connector includes a metallic frame cooperating with a back plate module to sandwich a printed circuit board therebetween. A plurality of screw nut units are provided around the four corners of the frame. A plurality of hollow spacers are secured to the corresponding through holes of the frame so as to allow the corresponding screw nut units moveable relative to the frame along the vertical direction within a range larger than a thickness of the frame, thus avoiding improper interference between the screw nut units and the corresponding screw posts of the back plate module during sequential screwing.

A component insertion device including a robot and a control portion is provided. The control portion is configured to control the operation of the robot. The robot includes a gripper, a dummy component and a force sensor. The gripper is configured for gripping a workpiece component. The dummy component is mounted protruding outward on a location in the gripper and away from the gripped workpiece component. The dummy component has a corresponding part with the same shape as that of a specific part of the workpiece component and exhibits rigidity. The force sensor is configured for detecting, through the gripper, a contact reaction force received by the dummy component from the surrounding of a slot or hole of a receiving portion by which the specific part of the workpiece comment is to be inserted via using the device. Component insertion method and program of using the device are also provided.

A socket actuation mechanism for package insertion and package-socket alignment, including: a socket frame comprising a plurality of first hinge portions; a carrier frame comprising: a center portion comprising one or more package interlocks; and a tab extending from a first end of the carrier frame, the tab comprising a second hinge portion couplable with the plurality of first hinge portions to form a hinge coupling the carrier frame to the socket frame.

Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.

An electronic assembly includes an electronic package connected to a host circuit board. The electronic assembly includes interposer assemblies electrically connected to the electronic package. The electronic assembly includes cable modules coupled to upper separable interface of the interposer assemblies. The electronic assembly includes carrier assemblies configured to be coupled to an upper surface of the electronic package. Each carrier assembly includes a carrier base block and a carrier lid configured to hold at least one interposer assembly and at least one cable module. The carrier assemblies hold the cable modules with the module contacts in electrical connection with upper mating interfaces of the interposer contacts. The carrier assemblies hold lower mating interfaces of the interposer contacts in electrical connection with upper package contacts of the electronic package. The carrier assemblies are separately removable from the electronic package to separate the interposer assemblies from the electronic package.

An electronic module includes a module substrate has an upper surface and a lower surface. The module substrate has a package pad array having package contact pads at the upper surface. The module substrate has a socket pad array having socket contact pads at the upper surface. The module substrate has guide pin locating pads associated with the socket pad array. The electronic module has an electronic package coupled to the package contact pads at the package pad array. The electronic module has guide pins surface mounted to the guide pin locating pads. The electronic module has a socket assembly coupled to the module substrate. The socket assembly has a socket housing holding socket contacts. The socket contacts are coupled to the socket contact pads at the socket pad array. The socket frame including pockets receiving the guide pins to locate the socket assembly relative to the module substrate.

An electrical connector includes a connection main part surrounded by the seat frame, and a CPU carrier for carrying the CPU and a load plate for downwardly pressing the CPU respectively pivotally located at two opposite ends of the seat frame in the front-to-back direction. A set of rotation mechanism is rotatably assembled upon one end to receive the CPU carrier. A pair of supporting arms are unitarily formed with one end of the seat frame, forming a pair of locking recesses having one open side. The seat frame includes a stopper opposite to the pair of locking recesses in the lengthwise direction. The rotation mechanism is pre-assembled as one piece and successively assembled upon the seat frame along the lengthwise direction with the pivot engaged within the pair of locking recesses and a middle section of the torsion spring engaged with the stopper.