The electrical connector is equipped with a retention mechanism for securing mounting a heat sink upon a CPU which is received within an insulative housing of the connector. The retention mechanism includes a pair of seats, a pair of towers fixed to the pair of seats, respectively, a pressing device retained between the pair of towers in a deformable manner. The pressing device is intimately seated upon the heat sink to significantly press the heat sink against the CPU when the pressing device is deformed in a tensional status.

An electrical connector includes a fastener, a rail frame pivotally mounted to one end of the fastener, a carrier frame assembled to the rail frame in a sliding manner, and a load plate pivotally mounted to the end of the fastener outside of the rail frame. The carrier frame includes latches to retain the CPU thereon. The rail frame includes a pair of opposite sliding channels extending in the front-to-back direction, along which the carrier frame is moveable. A front transverse bar is located in front of the sliding channels. A pair of protection blocks are located in front of the pair of sliding channels for protecting the latches of the carrier frame or the CPU.

An electrical connector includes an insulative housing retaining a plurality of contacts therein and surrounded by a metallic seat. A clip includes a frame with corresponding four walls to commonly form a receiving cavity to receive the electronic package therein, and each wall forms a pressing section to downwardly press an upward surface of the electronic package. A pair of latches are formed on a lower side of the frame to cooperate with the pressing sections of the walls to retain electronic package within the receiving cavity to be wholly a sub-assembly for being commonly received within the electrical connector. The clip includes a releasing handle to actuate the corresponding latch, and the releasing handle is positioned in an opening of the seat and intimately above the printed circuit board to function as a foolproof mechanism for loading the electronic package in a right orientation.

A processor socket assembly includes a processor socket, a base frame, a guide member and a carrier. The processor socket is located on a circuit board. The base frame surrounds the processor socket. The guide member is pivoted to an edge of the bottom frame to be rotatable relative to the processor socket, and the guide member has a slot. The carrier detachably engages the slot of the guide member after being combined with a processor and is capable of being rotated with the guide member.

An electrical connector, configured to electrically connect to a chip module, includes: a body, used to carry upward the chip module, and provided with multiple accommodating holes; and a plurality of terminals, respectively correspondingly accommodated in the accommodating holes. Each terminal includes a base, a first arm and a second arm, the base is configured to be connected to a strip, the first arm is formed by extending upward from the base, and the second arm is formed by extending upward from the first arm and is configured to abut the chip module. One side of the first arm is formed by tearing from the strip, and two opposite sides of the second arm are both formed by blanking the strip.

A retainer assembly includes a CPU and a retaining clip assemble together along an insertion/withdrawal direction perpendicular to a vertical direction of the CPU wherein the CPU forms a pair of sliding grooves, and the retaining clip forms a receiving space, an opening communicating the receiving space with an exterior, and a pair of retaining arms located by two sides of the receiving space and moveable along the pair of sliding grooves for allow the CPU to be received within the receiving space via said opening. The retaining arm may further optimally form a recess to receive a block of the CPU for retaining the CPU with regard to the retaining clip in the insertion/withdrawal direction. The retaining clip may or may not be mounted to the printed circuit board on which an electrical connector is mounted.

Techniques and mechanisms for providing socket connection to a substrate. In an embodiment, a socket device includes a first socket body portion that is to provide for signal exchanges as part of a socket connector including the first socket body portion and a second socket body portion. The first socket body portion and the second socket body portion comprise respective zones, wherein, of the two zones, only one such zone has a first electro-mechanical characteristic. The first electro-mechanical characteristic is selected from the group consisting of an interconnect dimension, an interconnect material, an interconnect structure, a socket body material, and a shielding structure. In another embodiment, modular socket sub-assemblies each comprise a respective one of the first zone and the second zone.

An electrical connector assembly for connecting a CPU to a printed circuit board, includes an insulative housing, a fixing device and a retainer. The fixing device is located by one end side, and the retainer is used to load the CPU into the housing. The fixing device includes a stationary part and a moveable insertion part wherein the retainer with the CPU therein is retained to the insertion part to commonly rotate about the stationary part for positioning the retainer with the CPU therein within the housing.

A contacting device having a carrier and at least one contacting unit, wherein the carrier has a bottom side and a top side, the top side of the carrier having a plurality of mutually insulated conductive tracks, the contacting unit having a plurality of contact elements that at least partially are formed of an electrically conductive material and in each case are mutually electrically insulated, each contact element along a longitudinal axis being composed of at least one fixing section and a contacting portion adjoining the fixing section, each fixing section being supported on the top side of the carrier, having a first contact surface and being positively and conductively connected to one of the conductive tracks, each contacting portion having a distance to the top side varying between zero and a maximum distance.

A surface-mountable socket has a wiping function. A socket 100 of the present technology can be surface-mounted to a board 210. The socket 100 includes a plurality of contacts 110, and each contact 110 includes a contact portion 112 that can contact a terminal of a semiconductor device, a locking portion 116 connected to the contact portion 112, and a board-side contact portion 118 that extends from the locking portion 116 and can contact a conductive region formed on a board surface. The socket 100 further includes a stopper member 120 that holds the locking portion 116 of the plurality of contacts 110 and a guide member 180 that is disposed so as to oppose the stopper member 120, and the guide member 180 is formed with a plurality of through holes 184 that houses a board-side contact 118 protruding from the stopper member.