A circuit card assembly for a vehicle chassis is provided. The circuit card assembly may include a circuit card unit, a wedge-lock retainer unit, and a support bracket. The circuit card unit has a printed circuit board (PCB) defining a first fastener aperture. The wedge-lock retainer unit may define a second fastener aperture. The support bracket includes first and second elements. The first element may define a third fastener aperture and the second element may define a fourth fastener aperture. The PCB, the wedge-lock retainer unit, and the support bracket may be arranged with one another such that the first fastener aperture, the second fastener aperture, and the third fastener aperture are aligned with one another and such that the fourth aperture is oriented in alignment with a chassis aperture of a chassis.

The present invention relates to a fixing apparatus for fixing one or more printed circuit boards to a housing wall having a frame part that comprises at least one locking means for fixing the frame part to the housing wall and at least one wedge body displaceably supported within the frame part, wherein the wedge body is displaceable into a position relative to the frame part in which a compressive force applied to the frame part by the wedge body deforms the outer frame wall at least regionally outwardly.

A fastener includes a base having a joint plate extended therefrom toward a first direction, a joint plate extended from the joint plate toward a second direction and configured to secure to an electronic base board, and a fastening member protruded thereon toward a third direction. The fastener includes an elastic compressive unit connected to the joint plate and including a pushing part configured to abut with a circuit board downwardly rotated. Subject to the stress in the first direction and applied by the circuit board, the pushing part is moved back and the elastically-compressive unit is compressed to make the circuit board rotate to the bottom side of the pushing part, and an edge of the circuit board can be inserted into and abutted thereon the fastening member, and the circuit board is accommodated in a fastening space formed on the outside of the fastening member.

A heat transfer assembly includes a movable heat transfer device in contact with a heat sink and a conduction card in contact with the heat sink, the conduction card being thermally connected to the movable heat transfer device. The movable heat transfer device contacts at least two surfaces of the heat sink, is a condenser, includes at least one non-perpendicular angle, or a combination thereof. The conduction card contacts at least one surface of the heat sink, includes at least one non-perpendicular angle, or a combination thereof. The heat transfer assembly contacts at least three surfaces of the heat sink.

A circuit retaining system can include a contact monitoring system configured to determine if a retainer is providing at least a selected force and/or pressure to a circuit board when the retainer is retaining the circuit board. The contact monitoring system can include a force and/or pressure sensor configured to be disposed between the retainer and the circuit board and to output a force and/or pressure sensor signal indicating a contact force and/or pressure.

A housing that can be used for a power module in a power system is disclosed. The housing includes features to improve the insulating properties and to reduce or eliminate a mechanical stress on a housing that could crack or break a substrate contained within the housing. The insulating properties are improved by protrusions that surround apertures for press-fit pins. Each protrusion can increase a creepage for the housing by extending the surface of the housing along a press-fit pin. The mechanical stress is reduced by a mounting flange that includes a wedge surface and a flexible structure that react to a force applied when the mounting flange is fastened to a surface by a fastener.

Systems (300) and methods (1200) for inserting an electronic module in a structure. The methods comprise: sliding at least one glide mechanism on a rail of the structure or a surface of the electronic module as the electronic module is being inserted into the structure; actuating a coupler to secure the electronic module to the rail and compress a thermal interface material between the electronic module and the rail; thus causing the glide mechanism to be retracted into the electronic module or rail while the coupler is being actuated. The thermal interface material first comes in contact with the rail while the coupler is being actuated. The glide mechanism is integrated with the electronic module or the rail and is resiliently biased in a direction away from the electronic module or rail so as to partially extend out from the electronic module in a direction towards the electronic module or rail.

A faceplate that is attached to a circuit board on the side of an extraction direction in which the circuit board is extracted from a slot includes: a main body that covers an opening of the slot; and two handle portions that are disposed respectively at both ends of the main body with respect to a width direction of the circuit board and that extend in the extraction direction. The two handle portions have respective distal ends shifted from each other in a thickness direction of the circuit board. Multiple slots are formed in a casing of an electronic device along a width direction thereof.

A modular electronic housing includes: a housing series body whose receiving chamber houses an electronic component; and a maintaining device for maintaining the electronic component on the housing series body, the maintaining device having at least one holding body for the electronic component, which holding body is materially bonded to the housing series body in a bonding position.

A releasable clamping device is provided. The device includes a plurality of wedge members that slidably are disposed upon a carrier, with an input disposed in conjunction with a first wedge member. The input interacts with a projection and when the input is moved the first wedge members slides along the carrier. Motion of the first wedge member causes vertical motion of the second and fourth wedge members, which in combination cause the thickness of the releasable clamping device to increase, which frictionally retains the carrier and associated components thereon (such as a PCB) within a housing. The input may be moved in an opposite direction which causes the first wedge member to slide along the carrier in an opposite direction and causes the second and fourth wedge members to vertically move toward the carrier thereby narrowing the overall thickness of the device to allow removal of the carrier.