A fastening device for expansion cards that is capable of connecting to a slot on a normal motherboard and fastening an expansion card in the slot is disclosed. The fastening device includes a top pressing unit and two side fastening units, wherein the two side fastening units are connected to two ends of the top pressing unit, respectively, and each side fastening unit is provided with an opening. When two clip units disposed on the two ends of the slot pass through the openings of the two side fixing units respectively, the top pressing unit presses the top edge of the expansion card inserted into the slot and the two side fastening units respectively press and fasten the two clip units so as to restrain the clip units from unlocking and to prevent the expansion card from becoming loose in the slot.

A modular high density communications chassis, comprising a chassis and slidable carrier module is provided. The chassis comprises a second track having a first and second stage access fixing recess and a sectional sliding mechanism having a moveable squeeze-release latching rail mechanism. The slidable carrier module comprises a push-pull tab and a snap-fit mechanism, and is slidably mounted to the second track and squeeze-release latching rail mechanism. The slidable carrier module is slidably mounted to the chassis vertically. The snap-fit mechanism is configured to secure and release the slidable carrier module in and from a first stage position when corresponding to the first stage access fixing recess, and in and from a second stage position when corresponding to the second stage access fixing recess, via pulling and pushing of the at least a push-pull tab, respectively, providing staged access to the slidable carrier module and staged management of the connector cables extending to and therefrom.

A variety of methods and arrangements for latching a transceiver to a host printed circuit board (PCB) are described. The transceiver is secured to its electrical sockets by a latch that does not extend or only minimally extends beyond the transceiver footprint and height. In some embodiments the latch includes a thermal bridge that provides a heat transfer path between the transceiver and host substrate.

Heat dissipation device for an electronic board comprising a support body connected to the electronic board, said electronic board being provided with an electric connection interface which can be inserted into/extracted from an electric connector provided in a direction orthogonal with respect to the lying plane of a support plate, having a heat dissipation surface configured to dissipate the heat transmitted to it by thermal conduction, wherein said heat dissipation device comprises at least one holding element and a levelling member, coordinated with respect to each other in order to position a surface of the support body in contact with the heat dissipation surface of the support plate.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A device casing is configured to include a first casing member provided with a hole including a guide hole and a fitting hole that communicates with the guide hole, and a second casing member provided with a protrusion at a position corresponding to the hole, the second casing member being configured to be fixed with respect to the first casing member by fitting the protrusion to the fitting hole. The guide hole guides movement of the protrusion that entered within the guide hole in an oblique direction when fixing the second casing member with respect to the first casing member so that the second casing member can get close to the first casing member in a state where the second casing member is guided in the oblique direction. The protrusion that moved in the oblique direction along the guide hole, passed through the guide hole and reached inside the fitting hole fits to the fitting hole. The second casing member is fixed with respect to the first casing member by the fitting of the protrusion to the fitting hole.

A power distribution bus bar is provided for distributing power to surface mount connectors. In use, the power distribution bus bar includes a circuit board and at least two add-in card connectors each mounted to a first surface of the circuit board. Additionally, at least one power supply connector distributing a power supply to the add-in card connectors is provided. The at least one power supply connector may be mounted to a second surface of the circuit board and connected to the at least two add-in card connectors.

An apparatus and method for engaging a mounting panel of a computer device includes a bracket, as well as a lever and slider mechanism connected to the bracket. The lever and slider mechanism includes a base, a wedge slider, a lever, a geared bar, and a biasing element. The base is connected to the bracket. The wedge slider is connected to the bracket and disposed immediately below the base. Rotating the lever from a first position to a second position causes a gear to engage the geared bar, causing the geared bar to move vertically. The rotating allows movement along the contact between an angled end of the geared bar and a wedged end protrusion of the wedge slider such that the biasing element pushes the wedge slider away from the bracket and allows the wedge slider to engage an opening in a mounting panel.

Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

A modular high density communications chassis, comprising a chassis and slidable carrier module is provided. The chassis comprises a second track having a first and second stage access fixing recess and a sectional sliding mechanism having a moveable squeeze-release latching rail mechanism. The slidable carrier module comprises a push-pull tab and a snap-fit mechanism, and is slidably mounted to the second track and squeeze-release latching rail mechanism. The slidable carrier module is slidably mounted to the chassis vertically. The snap-fit mechanism is configured to secure and release the slidable carrier module in and from a first stage position when corresponding to the first stage access fixing recess, and in and from a second stage position when corresponding to the second stage access fixing recess, via pulling and pushing of the at least a push-pull tab, respectively, providing staged access to the slidable carrier module and staged management of the connector cables extending to and therefrom.