In a circuit card chassis, a backplane system includes card guides that are slideable on rails to provide any selected spacing between adjacent circuit cards. A backplane connector assembly extends between each pair of slideable top and bottom card guides. Signal cables can be configured to connect any two backplane connector assemblies to each other.

A rack-mounted electronic device, which is mounted in a rack, includes a housing; a first aperture formed on a first surface of the housing; a first connector configured to protrude from the first aperture; a second aperture formed on a second surface which faces the first surface in the housing; and a second connector arranged in the second aperture.

High-density rack unit systems and methods are described for telecommunication and data communication systems that utilize novel airflow mechanisms thereby enabling modularity and high-density in small-form factor units. The high-density rack unit systems and methods offer novel airflow mechanisms via right-angle backplane connectors to enable more airflow in a rack unit as well as novel field replaceable fans in these high-density rack units. Further, the high-density rack unit systems and methods include a baffle structure to keep power-supply-related airflow separate from the airflow over other components in the 1U or 2U rack unit. In this manner, the high-density rack unit systems and methods enable system vendors and network operators to realize significant density improvements.

Apparatuses and associated methods of manufacturing are described that provide a cage receptacle assembly configured to receive a cable connector. An illustrative cage receptacle assembly is described to include a cage body, a first heat dissipation unit disposed proximate to a bottom side of the cage body and configured to remove heat from the bottom side of the cage body, and a second heat dissipation unit disposed proximate to a top side of the cage body and configured to remove heat from the top side of the cage body.

A rack includes first to fourth column members and first and second guide members. A case of an electric device has first and second side surfaces in a width direction that are supported by the first and second guide members, respectively. First and second restriction members are attached to inner surfaces of the first and second side surfaces of the case, respectively, for restricting the case from moving in a front direction of the rack. Second restriction member is attached to face the first restriction member in the width direction. In a state where the electric device is housed within the rack, the first restriction member is located between the first and third column members in a front-back direction. The second restriction member is located between the second and fourth column members in the front-back direction.

An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45 to 90. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.

A cage divider that is adaptable for different E3.S modules for insertion in a slot of a computing device is disclosed. The cage divider is one of a pair of cage dividers that define a cage enclosure for insertion of the E3.S modules. Each of the cage dividers includes a first side component plate attachable to the backplane of the cage enclosure. Each of the dividers includes a second side component parallel to the first side component and attached to the first side component. Each of the dividers includes an adjustable accessory held between the first side component and the second side component. The adjustable accessory is configured to be attached in a first position allowing accommodation of a first E3.S module or a second position allowing accommodation of a second E3.S module.

A support device for mounting electronic equipment is provided. The support device includes a panel assembly, an electromagnetic shielding assembly, a housing assembly disposed between the panel assembly and the electromagnetic shielding assembly, and a bracket assembly. The electromagnetic shielding assembly is disposed between the housing assembly and the bracket assembly. The bracket assembly includes an extension structure extending toward the housing assembly and at least partially disposed within the housing assembly.

A support device for mounting electronic equipment is provided. The support device includes a panel assembly including a hole, an electromagnetic shielding assembly, a housing assembly disposed between the panel assembly and the electromagnetic shielding assembly and including a housing bulge part, a bracket assembly and an accommodation assembly on the bracket assembly and for accommodating the electronic equipment. The housing bulge part is disposed in the hole of the panel assembly. The housing bulge part is exposed by the hole of the panel assembly. The electromagnetic shielding assembly is disposed between the housing assembly and the bracket assembly.

An apparatus includes a rackmount device, in which the rackmount device includes a housing configured to be installed in a server rack, in which the housing has a width in a range from 16 to 20 inches and a height in a range from 1 to 12 inches, the housing includes a front panel, a rear panel, and a bottom surface. The rackmount device includes a first circuit board or substrate having a first surface that defines a length and a width of the first circuit board or substrate, in which the first circuit board or substrate is positioned relative to the housing such that the first surface of the first circuit board or substrate is at an angle relative to the bottom surface of the housing, and the angle is in a range from 45 to 90. At least one of (i) the front panel of the housing is formed at least in part by the first circuit board or substrate, (ii) the first circuit board or substrate is attached to the front panel of the housing, or (iii) the first circuit board or substrate is substantially parallel to the front panel of the housing. The rackmount device includes at least one data processor electrically coupled to the first circuit board or substrate and configured to process data; and at least one optical/electrical communication interface coupled to the first circuit board or substrate and configured to convert received optical signals to electrical signals that are provide to the at least one data processor. The rackmount device includes at least one of (i) at least one inlet fan attached to the front panel of the housing, or (ii) at least one fan positioned near the front panel in which at least a portion of a fan blade of the at least one fan is within a first distance from the front panel for at least some time period during operation of the at least one fan, and the first distance is less than one-fourth of a second distance between the front panel and the rear panel.