An expansion card holder assembly that accepts different size expansion cards is disclosed. The expansion card holder assembly includes a metal base with grooves that roller features of a metal slide bracket fit into. The metal slide bracket is positioned along the metal base for different size expansion cards. The metal slide bracket is connected with a metal cover that is opened to accept expansions cards. A connector is provided for the expansion card to connect with printed circuit board.

A busbar assembly includes a base having a width and a length. The base has a first surface and a second surface and has a first side and a second side. A distance between the first side and the second side comprises the width, and the base defines a slot centered between approximately 75% and approximately 79% of the width.

A card connector that is removably fixable to a main body of a carrier system. For example, an outer flange of the card connector may be removably fixed (e.g., with fasteners, such as bolts) to the main body of the carrier system. A protrusion of the card connector may include a connector configured to electrically couple to the plugin card. The protrusion may extend into an interior of the main body when the card connector is removably fixed to the main body, such that the plugin card is disposed entirely within the main body. The card connector provides for a user to easily remove the card connector from the main body (e.g. by unfastening bolts and sliding the card connector out of the main body) and removably fix a new card connector to the main body. The new card connector may include different internal electronics or external porting than the original card connector.

A system may be configured to provide a main body, configured to house a plugin card, and a card connector, including a first printed circuit board (PCB) having a backplane configured to electrically couple to the plugin card, a third PCB having a plurality of ruggedized connectors configured to couple to an external system, and a second PCB interposed between the first and third PCBs. The processor may be mounted on the second PCB and may determine a state of at least a portion of the system based on a sensor output, an input signal and/or an output signal, and an internal data value. The state may comprise at least one of operational, less than operational, tampered, needing maintenance, needing repair, and not working. And the determination may be performed via one or more criteria being satisfied.

A control device includes a casing and a control circuit substrate arranged inside the casing. The control circuit substrate includes: a control circuit mounted on the control circuit substrate; an internal connector connectable to a communication cable inside the casing, the communication cable being connected to an expansion circuit substrate; and an external connector connectable to another communication cable outside the casing, the another communication cable being connected to another expansion circuit substrate. The control circuit is connected to the internal connector and the external connector in parallel.

A method of manufacturing a display substrate and a display substrate motherboard. The method of manufacturing the display substrate includes: providing a base substrate including a first main surface and a second main surface opposite to each other and divided into at least one active region and a dummy region located around the active region; forming a magnetic layer on at least one of the first main surface within the dummy region and the second main surface; and forming an element layer on the first main surface.

An apparatus is described. The apparatus includes a DIMM socket having a seating floor that is to meet both longer length contacts and shorter length contacts of a DIMM when the DIMM is fully seated in the socket.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A method of manufacturing a display substrate and a display substrate motherboard. The method of manufacturing the display substrate includes: providing a base substrate including a first main surface and a second main surface opposite to each other and divided into at least one active region and a dummy region located around the active region; forming a magnetic layer on at least one of the first main surface within the dummy region and the second main surface; and forming an element layer on the first main surface.

A server includes an adapter device, multiple storage modules and multiple controllers. The adapter device includes a base circuit board having opposite first and second surfaces, multiple first connectors disposed on the first surface along a first direction and connected to the base circuit board, and multiple second connectors disposed on the second surface along the first direction in pairs, each of which is arranged along a second direction, is connected to the base circuit board and is disposed between adjacent two of the first connectors. Each of the storage modules is connected to a corresponding first connector. Each of the controllers is connected to a corresponding second connector.