Patent classifications
H05K7/1432
HIGH VOLTAGE ISOLATION USING DISCRETE NON-ISOLATED DEVICES AND ELECTRICALLY ISOLATING, THERMALLY CONDUCTIVE SUBSTRATE
Various examples are provided for high voltage isolation. The isolation can be provided for discrete non-isolated devices using an electrically isolating substrate that is thermally conductive. In one example, a module includes a plurality of switching devices connected in series; one or more rubber buffer disposed between switching device pairs of the plurality of switching devices; and thermal interfaces disposed between switching devices of the switching device pairs and cooling surfaces of the module, the thermal interfaces electrically isolating the switching devices from the cooling surface. In another example, an extreme fast charger (EFC) station includes an active front end (AFE) module that includes at least one module, where the module is a half-bridge power module. The EFC station can include a dual-active-bridge (DAB) high voltage (HV) module that includes at least one module, where the module is a half-bridge power module.
POWER CONVERSION APPARATUS
A power conversion apparatus includes a plurality of power conversion units each including a power conversion module, the plurality of power conversion units being arranged at an interval in a lateral direction orthogonal to a vertical direction, and at least one support body that extends from one side toward the other side of the plurality of power conversion units in the lateral direction, on which the plurality of power conversion units are placed from above. The support body is formed from an insulating member.
Electrical power unit
An electrical power unit or electronic data unit includes an outer housing, a circuit board positioned inside the outer housing, a frame inserted inside the outer housing, and a face plate fitted over the outer housing. The circuit board supports, for example, a high voltage AC electrical receptacle, a low voltage DC electrical receptacle, and a switch, each of which is electrically connected to the circuit board. The frame defines a plurality of outlet openings for receiving respective one of the AC electrical receptacle, the DC electrical receptacle, and the switch. The face plate defines outer receptacle openings that align with respective outlet openings of the frame to provide access to the respective AC electrical receptacle, DC electrical receptacle, and switch.
Inverter assembly
A vehicle includes a vehicle body, a vehicle seat, an inverter and an inverter cover. The vehicle body defines a vehicle interior. The vehicle seat is disposed on a floor of the vehicle interior. The inverter has a housing fixed to the floor of the vehicle interior at a location underneath the vehicle seat. The inverter cover is detachably attached to the inverter housing.
FLEXIBLY CONFIGURABLE CONVERTER UNITS
A converter unit has a main printed circuit board (MPCB) on which at least one functional module is arranged. By the functional module, at least one AC voltage supplied to the functional module via first power connections of the functional module can be converted into at least two DC voltage potentials output via second power connections. The MPCB has conductor paths via which control signals can be supplied to control connections, and the MPCB has conductor paths which extend from a control unit to first and second control connections of the MPCB and via which the first and second control signals can be supplied to the first and second control connections. The functional module is at least mechanically connected to the MPCB at least in the region of the first and second control connections such that the functional module does not use the first and/or the second control signals.
SEALED INTERFACE POWER MODULE HOUSING
A number of different sealed interfaces for power modules are described. In one example, a sealed interface includes a printed circuit board including a contact pad for power conduction to a bus bar of the printed circuit board, a semiconductor module including at least one power transistor, a terminal pin electrically coupled to the power module, and a housing for the power module. The housing includes an open terminal aperture that extends through the housing. The printed circuit board is seated upon the open terminal aperture, to close and seal the open terminal aperture, with the contact pad positioned within the open terminal aperture. The terminal pin contacts the contact pad of the printed circuit board within the open terminal aperture, and the open terminal aperture comprises a transitional feature to abate electric field intensity around an interface between the open terminal aperture and the printed circuit board.
HIGH POWER MULTILAYER MODULE HAVING LOW INDUCTANCE AND FAST SWITCHING FOR PARALLELING POWER DEVICES
A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.
Power electronics unit having integrated current sensor for forming a module; and drive train
A power electronics unit (1) for an electric drive unit, having an electrically conductive carrier element (2) and a power semiconductor module (3) arranged on the carrier element (2). The power semiconductor module (3) is designed to convert a direct current into a three-phase alternating current, and a current sensor (4) used to determine the alternating current is integrated such that it forms a main module (5) with the carrier element (2) and the power semiconductor module (3). A drive train for a motor vehicle having such a power electronics unit (1) is also provided.
Power module for operating an electric vehicle drive with improved thermal conduction for drive electronics
A power module for operating an electric vehicle drive, comprising power switches for generating an output current based on an input current; control electronics for controlling the power switches including a first region, to which a first electric potential is applied, and a second region, to which a second electric potential is applied, wherein the second electric potential is higher than the first electric potential; a heatsink for discharging heat generated by the power switches and the control electronics; a shielding layer for electrically shielding the control electronics placed between the heatsink and the control electronics, such that the control electronics lies on the shielding layer, and the shielding layer lies on the heatsink; wherein the shielding layer is designed to connect the heatsink thermally and electrically to the first region, and thermally to the second region, and electrically insulate it therefrom.
POWER CONVERSION APPARATUS
To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.