An apparatus comprises at least one processing device comprising a processor coupled to a memory and a drive bay enclosure of a storage system comprising a housing with one or more drive bays, the housing of the drive bay enclosure comprising one or more status indicators proximate an opening for at least a given one of the one or more drive bays. The at least one processing device is configured to perform steps of determining status information for the given drive bay, and controlling the one or more status indicators proximate the opening for the given drive bay based at least in part on the determined status information.

[Problem] To suppress the number of man-hours required to handle design changes accompanying a change in heat generation in an internal unit stored inside an electric device.

[Solution] The present invention includes: at least one internal unit, which is a heat generating body and has a prescribed cross-sectional external shape; at least one heat conduction unit, which is a good conductor of heat and has a prescribed cross-sectional external shape; and a device housing in which two or more of the internal unit and the heat conduction unit can be stored in a state of being adjacent to each other with the prescribed cross-sectional external shapes thereof overlapping each other, the device housing thermally connecting to the stored internal unit or the stored heat conduction unit.

An antenna assembly according to the invention includes a universal whip mount for mounting one of a variety of antenna whips to the antenna assembly, a loading coil inductor and a circuit board having a combination of both fixed and variable capacitors. The antenna assembly of the invention can be tuned to a wide range of frequencies with minimal disassembly and without soldering.

A deep-water submersible system is disclosed. The system can include a pressure vessel and an internal assembly. The internal assembly can include a housing and a wedge lock assembly coupleable to the housing. The wedge lock assembly can include a plurality of wedge members arranged along a longitudinal axis and including end wedge members at each end and one or more intermediate wedge members between the end wedge members. The wedge lock assembly can also include a displacement device along the longitudinal axis and connecting the end wedge members. The displacement device can be actuatable in one direction to move the end wedge members toward one another to displace adjacent wedge members relative to one another in a direction transverse to the longitudinal axis to engage and apply a clamping force to the housing and the pressure vessel. In addition, the wedge lock assembly can include a variable gap compensation mechanism operable to exert a biasing force on the plurality of wedge members to accommodate the relative transverse movement of the adjacent wedge members and maintain the clamping force on the housing and the pressure vessel within a predetermined range as a distance between the housing and the pressure vessel varies.

Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of >5,000 times Earth's gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.

A system includes a first slice and a second slice coupled to each other. Each slice includes a housing formed of an electrically-insulative material, a ceramic plate disposed at each end of the housing, and an end plate disposed over each of the ceramic plates. Each end plate is formed of a thermally-conductive material. The system also includes a backplane assembly coupled to the first slice and the second slice.

Thermal structures and, more particularly, improved thermal structures for heat transfer devices and spatial power-combining devices are disclosed. A spatial power-combining device may include a plurality of amplifier assemblies and each amplifier assembly includes a body structure that supports an input antenna structure, an amplifier, and an output antenna structure. One or more heat sinks may be partially or completely embedded within a body structure of such amplifier assemblies to provide effective heat dissipation paths away from amplifiers. Heat sinks may include single-phase or two-phase materials and may include pre-fabricated complex thermal structures. Embedded heat sinks may be provided by progressively forming unitary body structures around heat sinks by additive manufacturing techniques.