A modular satellite chassis includes frame rails having at least two front frame rails and two back frame rails. Transverse parallel ribs are disposed on the interiors of the front and back frame rails. The ribs on the front frame rails correspond in location to one another and to the ribs on the back frame rails. Each rib has a central longitudinal axis and a narrow first slot disposed along the central longitudinal axis. The ribs are spaced apart by wider second slots. Trays are slidingly received by the second slots on the front frame rails and the corresponding second slots on the back frame rails. A left side panel is connected to an outside of one of the front frame rails and one of the back frame rails. A right side panel is connected to an outside of the other front frame rail and the other back frame rail.

An antenna assembly according to the invention includes a universal whip mount for mounting one of a variety of antenna whips to the antenna assembly, a loading coil inductor and a circuit board having a combination of both fixed and variable capacitors. The antenna assembly of the invention can be tuned to a wide range of frequencies with minimal disassembly and without soldering.

An apparatus comprises at least one processing device comprising a processor coupled to a memory and a drive bay enclosure of a storage system comprising a housing with one or more drive bays, the housing of the drive bay enclosure comprising one or more status indicators proximate an opening for at least a given one of the one or more drive bays. The at least one processing device is configured to perform steps of determining status information for the given drive bay, and controlling the one or more status indicators proximate the opening for the given drive bay based at least in part on the determined status information.

Systems (100) and methods (1500) for using a pressure vessel. The methods comprise: obtaining the pressure vessel comprising a shell and an insert having an interference fit with the shell whereby the insert is locked in place within the shell via interfacial pressure; inserting at least one electronic component in a first hollow cavity formed in the insert; mechanically supporting the at least one electronic component using a structural feature of the insert; and transferring heat from the electronic component to an external environment via a heat transfer path that comprises a full surface area of the insert's outer surface abutting the shell's inner surface.

A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.

The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.

A canister system having a cylindrical housing and a modular electronic rack system disposed within the cylindrical housing. The modular electronic rack system includes a thermal contact member that is in at least selective physical contact with an interior surface of the cylindrical housing to permit conductive heat transfer there through. An input/output device extends along at least a portion of the modular electronic rack system and includes a power input and a signal output electrically coupled thereto. A plurality of electronic slots disposed at a position generally along the modular electronic rack system is provided.

A system, device and method for stress-sensitive component isolation in severe environments are disclosed. For example, a device for stress-sensitive component isolation is disclosed, which includes a circuit board assembly, a plurality of electronic components mounted onto a surface of the circuit board assembly, and a protective cap disposed over at least one electronic component and mounted onto the surface of the circuit board assembly. The protective cap can be filled with a low modulus material if additional structural support is desired for the electronic component.

A deep-water submersible system is disclosed. The system can include a pressure vessel and an internal assembly. The internal assembly can include a housing and a wedge lock assembly coupleable to the housing. The wedge lock assembly can include a plurality of wedge members arranged along a longitudinal axis and including end wedge members at each end and one or more intermediate wedge members between the end wedge members. The wedge lock assembly can also include a displacement device along the longitudinal axis and connecting the end wedge members. The displacement device can be actuatable in one direction to move the end wedge members toward one another to displace adjacent wedge members relative to one another in a direction transverse to the longitudinal axis to engage and apply a clamping force to the housing and the pressure vessel. In addition, the wedge lock assembly can include a variable gap compensation mechanism operable to exert a biasing force on the plurality of wedge members to accommodate the relative transverse movement of the adjacent wedge members and maintain the clamping force on the housing and the pressure vessel within a predetermined range as a distance between the housing and the pressure vessel varies.

An electronic unit for a missile comprising a potted electronics in a housing: the unit being adapted to compensate for a difference in coefficient of thermal expansion between the potted electronics and the housing, the unit further comprising: a first ramp; and a second ramp slidably arranged against the first ramp, wherein the first and second ramps are disposed within the housing, the first or the second ramp abutting the potted electronics so as to provide an interference fit between the potted electronics and the housing; wherein the first ramp and second ramp each comprise a coefficient of thermal expansion selected to maintain the interference fit between the potted electronics and the housing throughout a temperature range.