H05K7/1434

APPARATUS AND METHOD FOR UTILIZING COMMERCIAL OFF THE SHELF CIRCUIT BOARDS IN A HIGHLY KINEMATIC ENVIRONMENT
20180042149 · 2018-02-08 ·

A system is disclosed which utilizes a stabilization disk 30 or rigid cup containing adhesive which is bonded to an underside of a circuit board and then bolted to a chassis of a piece of military electronic equipment, so as to create a mounting location between the circuit board and the chassis where the circuit board is lacking a regular fastener receiving mounting hole therethrough.

BACK-PLANE CONNECTOR FOR CUBESAT
20170242064 · 2017-08-24 · ·

A back-plane connector connects component boards for a cubesat with a processing unit and a board connector electrically connected to the back-plane connector. The board connector mates with complimentary connectors on the component boards. The arrangement facilitates assembly, testing and operational reliability. An image capture system may be included and has an image capture device with a multiplexer for interactive collection and storage of image and video data.

MOUNTING AND COMPONENT HOLDER APPARATUSES AND ASSEMBLIES FOR HOLDING RIGID COMPONENTS
20170208701 · 2017-07-20 ·

A component mounting apparatus for holding a rigid component in a downhole bore or a downhole collar based application includes a first body including first and second parallel spaced apart component holders disposed in a first common plane and a first support connecting the component holders together. The first and second parallel spaced apart component holders are operable to receive and grip a rigid component between the first and second parallel spaced apart component holders. Various component mounting assemblies and configurations may be realized using the component mounting apparatus described. The component mounting apparatus and various mounting assemblies may be used to mount a printed circuit board in a cylindrical enclosure or tubular housing, for example.

Transportable electronic device
09706025 · 2017-07-11 · ·

There is provided a transportable electronic device in which a configuration related to a protective cover can be simplified. A transportable digital photo frame includes a cylindrical main unit that is divided into four areas along the circumferential direction, and a tubular cover that houses at least a part of the main unit to protect the circumferential surface of the main unit, the tubular cover having an opening formed in its circumferential surface for exposing one area to the outside. The tubular cover is rotatable relative to the main unit so that the areas protected by the tubular cover can be switched.

Back-plane connector for cubesat
09678136 · 2017-06-13 · ·

A back-plane connector connects component boards for a cubesat with a processing unit and a board connector electrically connected to the back-plane connector. The board connector mates with complimentary connectors on the component boards. The arrangement facilitates assembly, testing and operational reliability. An image capture system may be included and has an image capture device with a multiplexer for interactive collection and storage of image and video data.

SOUNDBOX
20170156231 · 2017-06-01 ·

A soundbox is disclosed in the embodiments of the disclosure, wherein the soundbox comprises a soundbox main body, an easily-easily-detachable guiding device is arranged on the soundbox main body (1), the easily-detachable guiding device comprises PCB plate fixed mount (3) and PCB plates (2), the PCB plates (2) are fixed in the inner side of the PCB plate fixed mount (3), and the PCB plates (2) are placed within the soundbox main body (1) by connecting the PCB plate fixed mount (3) and soundbox main body (1).

Satellite communication system

A cubesat design includes selected subsystems for managing communications to other satellites and ground stations. In one embodiment, the subsystem includes a deployable antenna having compact size and low weight that reliably releases and detects an extended antenna after launch.

Arrangement system

An arrangement system composed of a plurality of electrical/electronic components particularly of a voltage converter device of a power supply system for use in oil/natural gas production composed of at least one support member that is provided on at least one side with a surrounded accommodating recess, a circuit carrier which is arranged in the accommodating recess and electrically connected to the components, and a holding member fixing the circuit carrier and/or the components in the accommodating recess. An insulating material is arranged at least in part between the circuit carrier and/or components and the support member. Such an arrangement system permits an adequate electrical insulation of the corresponding components and optionally also of the circuit carrier in relation to the support member together with an adequately high heat conduction. At the same time an arrangement system for components is provided that is mechanically stable and permits a good electrical insulation of the components with heat transfer to the outside with respect to the arrangement system.

Electronics unit
12267974 · 2025-04-01 · ·

An electronic unit for a missile comprising a potted electronics in a housing: the unit being adapted to compensate for a difference in coefficient of thermal expansion between the potted electronics and the housing, the unit further comprising: a first ramp; and a second ramp slidably arranged against the first ramp, wherein the first and second ramps are disposed within the housing, the first or the second ramp abutting the potted electronics so as to provide an interference fit between the potted electronics and the housing; wherein the first ramp and second ramp each comprise a coefficient of thermal expansion selected to maintain the interference fit between the potted electronics and the housing throughout a temperature range.

SHAPE MEMORY MATERIAL BASED THERMAL COUPLER/DECOUPLER AND METHOD
20170038159 · 2017-02-09 ·

A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.