Embodiments of the disclosure provide a cable connection structure, including: a bearing member, the bearing member being provided with at least one cable connector, and each cable connector having a first port connected to a cable and a second port electrically connected to the first port; and a sliding structure connected to the bearing member, the bearing member being configured to be connected to a single board through the sliding structure, the bearing member enabling the single board connected to the bearing member to slide in a first direction which is a direction close to or away from the second port. Embodiments of the disclosure also provide a single-board assembly and a single-board assembly connection structure.

A storage module is configured to store data segments, such as error-correcting code (ECC) codewords, within an array comprising two or more solid-state storage elements. The data segments may be arranged in a horizontal arrangement, a vertical arrangement, a hybrid channel arrangement, and/or vertical stripe arrangement within the array. The data arrangement may determine input/output performance characteristics. An optimal adaptive data storage configuration may be based on read and/or write patterns of storage clients, read time, stream time, and so on. Data of failed storage elements may be reconstructed by use of parity data and/or other ECC codewords stored within the array.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for duster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A communication system includes a first circuit card assembly having a first PCB and a first electrical connector with first contacts and a second circuit card assembly having a second PCB and a second electrical connector with second contacts. At least one of the PCBs include a slot configured to receive the other PCB when mated in a board mating direction. The first electrical connector is mated to the second electrical connector in a connector mating direction perpendicular to the board mating direction. The first contacts are mated to the second contacts in a contact mating direction as the first PCB and the second PCB are mated in the board mating direction and as the first electrical connector and the second electrical connector are mated in the connector mating direction. The contact mating direction is non-parallel to the board mating axis and non-parallel to the connector mating axis.

A storage module is configured to store data segments, such as error-correcting code (ECC) codewords, within an array comprising two or more solid-state storage elements. The data segments may be arranged in a horizontal arrangement, a vertical arrangement, a hybrid channel arrangement, and/or vertical stripe arrangement within the array. The data arrangement may determine input/output performance characteristics. An optimal adaptive data storage configuration may be based on read and/or write patterns of storage clients, read time, stream time, and so on. Data of failed storage elements may be reconstructed by use of parity data and/or other ECC codewords stored within the array.

Configurable smart object systems with methods of making modules and contactors are provided. Example systems implement machine learning based on neural networks that draw low power for use in smart phones, watches, drones, automobiles, and medical devices. Example assemblies can be configured from pluggable, interchangeable modules that have compatible ports for interconnecting and integrating functionally dissimilar sensor systems. An example method includes mounting an element of a configurable machine learning assembly on a substrate, creating at least one fold in the substrate, folding the substrate at the fold into a housing of a module of the configurable machine learning assembly, and adding a molding material to the housing to at least partially fill the module of the configurable machine learning assembly. The example module construction may also form contactors on folded edges of the module for making physical and electrical contact with other modules of the smart object machine learning assembly.

A backplane system for a high-speed network element includes a main backplane including a plurality of traces for data and control connectivity, high-speed data connectors, and a power connector, wherein the high-speed data connectors and the power connector are configured to engage one or more modules; and a power backplane for power connectivity separate from the main backplane connected to the power connector, wherein the power backplane is coupled to a power source to provide supply and return current to the one or more modules through the power connector.

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

This application discloses a communication device and a service signal scheduling method, and relates to the field of communication technologies. The communication device includes a cabinet, a plurality of subracks, and a plurality of switch boards. Each subrack includes a backplane and a plurality of service boards, the backplane is located in the subrack, the plurality of service boards are pluggably installed in the subrack, and each service board is electrically connected to the backplane. Each subrack and each switch board are pluggably installed in the cabinet, the backplane of each subrack is electrically connected to at least one of the switch boards, and each switch board is electrically connected to at least one backplane.

One apparatus includes a storage division selection module configured to select a storage division of a solid-state storage medium for recovery. The solid-state storage medium includes a plurality of storage divisions. Each storage division includes a plurality of storage locations. The apparatus also includes an erase module configured to erase the selected storage division. The apparatus includes a storage division recovery module configured to store a sequence indicator in the erased storage division. The sequence indicator is indicative of an ordered sequence of the plurality of storage divisions, and the sequence indicator is determined by reading information stored with data on the plurality of storage divisions.