Patent classifications
H05K7/1444
SYSTEMS AND METHODS FOR STORAGE PARALLELISM
One method includes streaming a data segment to a write buffer corresponding to a virtual page including at least two physical pages. Each physical page is defined within a respective solid-state storage element. The method also includes programming contents of the write buffer to the virtual page, such that a first portion of the data segment is programmed to a first one of the physical pages, and a second portion of the data segment is programmed to a second one of the physical pages.
DEVICE FOR HIGH DENSITY CONNECTIONS
A device is described. The device includes a daughterboard having a first distinct side and a second distinct side. A first connector on the first distinct side is attached to a first baseboard. A second connector on the second distinct side is attached to a second baseboard. A method for attaching a daughterboard to a second device is described. Connectors are included on opposing distinct sides of the daughterboard. The second device includes baseboards mechanically secured in parallel by lead screw actuators. As part of the method, the lead screw actuators are actuated so as to move the baseboards away from each other. A first connector is attached to one of the baseboards. The lead screw actuators are again actuated so as to move the baseboards toward each other until a second connector is brought into attachment with the other of the baseboards.
BACKPLANE SYSTEM, FABRICATION METHOD THEREFOR, AND CABINET
The backplane system includes a cable box, a plurality of terminal connecting members, and a plurality of first cables, where the cable box comprises an accommodating cavity, each terminal connecting member includes a circuit board, a plurality of first conductive terminals and a plurality of second conductive terminals, and the circuit board includes a first end portion and a second end portion. The circuit board is mounted in the cable box, the first end portion protrudes relative to the cable box, and the second end portion is located in the accommodating cavity. The plurality of first conductive terminals are mounted on the first end portion and spaced apart from each other, and are configured to be electrically connected an electronic device. The plurality of second conductive terminals are mounted on the second end portion and spaced apart from each other.