The disclosure provides a server including a housing, a plurality of hash boards, a power module and an electrical connection board. Each hash board is slidably arranged in a first accommodating space. The plurality of hash boards and the power module are respectively connected to the electrical connection board. The power module supplies power to the plurality of hash boards through the electrical connection board. The electrical connection board includes two conductive connection boards, each of which is provided with a plurality of conductive pins. The pins form multiple pairs of conductive pins in one-to-one correspondence. Each pair of conductive pins corresponds to each hash board and is electrically connected to supply power to the hash board. Each pair of conductive pins is detachably matched with each hash board to connect or disconnect the power supply path of the hash board.

A dual connect switch module may include a first set of pluggable panel connectors on a first side of a substrate of the switch and a second set of pluggable panel connectors on an opposing second side of the substrate. The switch module further includes a switch Integrated Circuit (IC) mounted between the first side and the second side, where the switch IC is connected to the first set of pluggable panel connectors and to the second set of pluggable panel connectors. A cable can be used to connect at least one pluggable panel connector of the first set of pluggable panel connectors and/or of the second set of pluggable panel connectors with a port of an external network device. In some examples, the switch and substrate may further include a management module that manages one or more on-board functions of the switch module.

A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

The invention relates to a modular assembly that comprises at least two housing parts (1), in which in each case a circuit board (L) is received, at least one internal connecting means (17), one cover element and one closing element. Each housing part (1) is formed from a base plate (3), a rear wall (5) and side walls (4) that are connected to said rear wall. The housing parts (1) are stacked in such a manner that the side walls (4) combine to form a first (6) and a second complete side wall (7), and that the rear walls (5) combine to form a complete rear wall (8). At least two of the housing parts (1) are stacked in such a manner that the base plate (3) of the one housing part (1) is connected to the side walls (4) of the other housing part (1). The at least one internal connecting means (17) extends in a direction perpendicular to the base plates (3) and connects multiple circuit boards (L) by way of first connectors (18). The cover element lies on the side walls (4) of precisely one housing part (1). The closing element is attached to a front side on the housing parts (1), said front side lying opposite the complete rear wall (8).

A main unit of a director-class switch including a wire-based backplane located in a chassis, having a plurality of slots configured to receive switch boards. The wire-based backplane includes a plurality of harnesses each including first and second cartridges, a plurality of interface port units mounted on each of the first and second cartridges and cables connecting each of the interface port units of the first cartridge to each of the interface port units of the second cartridge. The harnesses are mounted in the chassis such that the interface port units face ends of the slots in a manner configured to mate with corresponding connectors of switch boards inserted into the slots. A plurality of interface port units are mounted in each slot. Each cartridge includes interface port units which are located in a plurality of different slots.

A backplane and a communications device are disclosed. In one example, the backplane includes at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by the flexible cables. Each of the connectors is provided with a housing, and multiple signal pins are installed on the housing. The housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device. One end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable.

An enclosure for protecting electronic devices. The enclosure has a rear base defining a cavity for holding different interchangeable electronic devices. The enclosure has a front cover coupled to the rear base. The enclosure has a backplane within the cavity of the rear base and a drawer chest. The drawer chest has a drawer chest has multiple drawers. The backplane connects to any of the different interchangeable electronic devices when an electronic device of the different interchangeable electronic devices is inserted into any drawer of the plurality of drawers.

A backplane and a communications device are disclosed. The backplane includes: at least one fixing plate, multiple connectors, and multiple flexible cables, where signal connection is implemented between corresponding connectors by means of the flexible cables, each of the connectors is provided with a housing and multiple signal pins installed on the housing, and the housing is installed on the fixing plate and is provided with a jack for insertion of a connector of a subcard in the communications device; one end of each signal pin is inserted into the jack, and the other end is connected to each flexible cable. When the communications device provided with the backplane transmits a high-rate signal, transmission quality and a transmission rate are relatively high.

Architectural tiled panel systems composed of at least one sensory output tile module and a plurality of non-sensory-output tile modules. Each sensory output tile module includes any one or more of a variety of electronic devices, such as a video display device, an audio speaker, and an illumination device (e.g., an LED or light bulb), among others. Each non-sensory-output module includes a presentation face that is visually appealing. The non-sensory-output tile modules can be used to provide aesthetic surrounds for each of one or more sensory output tile modules and/or groups of sensory output tile modules. In some embodiments, a plurality of video display type sensory output tile modules are grouped together and controlled to provide a larger mosaicked video display. In some embodiments, abutting tile modules are secured together using connectors having a latch mechanism for each tile module connected thereby.

Mounting assembly for a backplane communication system. The mounting assembly includes a retention collet that has a collet base and a coupling arm that extends from the collet base. The collet base includes a passage therethrough. The collet base is configured to be mounted to a backplane such that the passage extends through the backplane and the coupling arm extends from the collet base away from the backplane. The mounting assembly also includes a spacer member having a member cavity that receives the coupling arm when the spacer member is mounted to the backplane. The coupling arm is held in a locked position when engaged by a guide pin that has been inserted through the passage of the collet base and into the member cavity. The retention collet and the spacer member are interlocked when the coupling arm is in the locked position.