A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

A sled is provided to facilitate connection of the electrical components housed therein to a backplane located in a chassis. The sled includes a housing with a front portion and a rear portion connected by a base portion. The base portion includes a plurality of electronic unit modules. The sled also includes a connector laterally slidable with respect to the front portion of the housing. The connector is slidably configured to connect the electronic unit modules to a backplane located in the server rack.

A guide assembly an enclosure-based device such as a computer provided in a rack-mountable chassis. The guide assembly is configured to facilitate blind connector mating such as electrical interconnection between a receiving connector on a previously-mounted board and an edge connector on a circuit board supported in a housing of a module that is slid or inserted into the interior space of the enclosure or chassis. The guide assembly (and devices that include a guide assembly) address the two design challenges discussed above of increasing numbers of circuits in devices that need to be connected and of decreasing pitch between the connectors. The guide assembly is configured, with its mechanical features, to decouple the degrees of freedom (DOFs) between the module being inserted into the chassis and the receiving/mating connector on the previously-mounted board. The guide assembly constrains five out of the six DOFs, which effectively ensures proper connector mating.

A mechanism to mitigate assembly torsion on an electronics assembly is provided. The mechanism including an electronics assembly and a first connector, mounted to the electronics assembly with a lower portion of the first connector proximal to the electronics assembly and an upper portion of the first connector distal to the electronics assembly. The mechanism includes a spring, mounted so as to press the upper portion of the first connector and preload the first connector against assembly force imparted by assembly of the first connector to a second connector. A method to mitigate assembly torsion on an electronics assembly is also provided.

A system and method of mounting and electrically contacting a first printed circuit board perpendicularly onto a second printed circuit board within a housing includes inserting the first printed circuit board into an upper part of the housing using a stop surface arranged on an inner side surface of the upper part of the housing and arranged to support the electrical contacting and assembly, locking the first printed circuit board in the upper part of the housing using a locking system, and mounting the upper part of the housing with the locked printed circuit board on a lower part of the housing in which the second printed circuit board is mounted.

A guiding connection structure is configured to implement mutual guiding connection between a plug-in part installed on a first object and a plug-in part installed on a second object. The guiding connection structure includes a guide pin and a guide sleeve for guiding insertion of the guide pin. The guide pin is installed on the first object, and the guide sleeve is installed on the second object. An inner hole path of the guide sleeve includes a variable-diameter section. A hole diameter of the variable-diameter section gradually increases from one end of the variable-diameter section to the other end of the variable-diameter section. When the guide pin is inserted into the guide sleeve, the guide pin is inserted into the other end of the variable-diameter section from the one end of the variable-diameter section.

A split backplane for a telecommunication, networking, or computing device includes a power backplane comprising power connectors; a signal backplane comprising signal connectors, wherein the signal backplane is separate from the power backplane, and wherein one or more modules are adapted to selectively connect to the power connectors and the signal connectors simultaneously; and an alignment bar connected between the power backplane and the signal backplane for alignment and stiffening of the power backplane and the signal backplane together for signal integrity and to prevent connector pins from bending or failing between the one or more modules, the power connectors, and the signal connectors.

A cable limiting device is for connecting to a connection device of a server. The connection device includes a motherboard, a bridgeboard, and a port disposed on the bridgeboard and coupled to the motherboard. The cable limiting device includes a side plate having a longitudinal opening and a transverse slot communicated with each other, a casing, and a cable fixed in the casing. A pillar of the casing passes through the longitudinal opening to be slidably disposed through the transverse slot and be movable relative to the transverse slot for making the casing away from or close to the side plate. When the cable is connected to the port, the casing is away from or close to the side plate with movement of the pillar in the transverse slot for guiding a gold-plated terminal of the cable to be inserted into the port and establishing signal transmission via the bridgeboard.

A blade includes both a motherboard and daughter card to allow the combined functionality to be incorporated into a single black for size reduction. Standoffs couple the daughter card to the motherboard. Cantilever portions of the motherboard and daughter card exist between the standoffs and terminals of the motherboard and daughter card. The cantilever portions bend to accommodate any misalignment between the terminals of the motherboard and the daughter card and mating connectors of a bulkhead or printed circuit board backplane.

A split backplane for a telecommunication, networking, or computing device includes a power backplane comprising power connectors; a signal backplane comprising signal connectors, wherein the signal backplane is separate from the power backplane, and wherein one or more modules are adapted to selectively connect to the power connectors and the signal connectors simultaneously; and an alignment bar connected between the power backplane and the signal backplane for alignment and stiffening of the power backplane and the signal backplane together for signal integrity and to prevent connector pins from bending or failing between the one or more modules, the power connectors, and the signal connectors.