An apparatus is disclosed that comprises a first structure configured to be connected to a chassis, a second structure configured to be attached to the first structure, the second structure including at least one first connector and a damper disposed between the first structure and the second structure, the damper configured to allow the second structure to move in one dimension relative to the first structure when the first connector is moved in a direction to be coupled to a second connector that is not aligned with the first connector.

A rack adapted for receiving one or more components is disclosed. The rack includes a backplane, a pair of side panels extending from the backplane and internal support members on each side to receive and mechanically guide an initial alignment of components upon their initial insertion in the rack. A pair of male connectors mounted to the backplane is configured to mate with a corresponding pair of female connectors of each component to mechanically guide a final alignment of each component when the component is further inserted in the rack. Mechanical guidance may also be provided by, or supplemented with, a connection capable of providing liquid cooling to the rack. A system including the rack and the component inserted in the rack is also disclosed.

In one embodiment, an apparatus includes a module adapter comprising a first connector for connection to a modular electronic system and a second connector for connection to a module inserted into a chassis of the modular electronic system to couple the module with the modular electronic system. The module adapter is removably inserted into the chassis of the modular electronic system with an adapter tool operable to lock the module adapter in place in the chassis. A method for insertion of the module adapter is also disclosed herein.

Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.

An apparatus is disclosed that comprises a first structure configured to be connected to a chassis, a second structure configured to be attached to the first structure, the second structure including at least one first connector and a damper disposed between the first structure and the second structure, the damper configured to allow the second structure to move in one dimension relative to the first structure when the first connector is moved in a direction to be coupled to a second connector that is not aligned with the first connector.

In one embodiment, an apparatus includes a module adapter comprising a first connector for connection to a modular electronic system and a second connector for connection to a module inserted into a chassis of the modular electronic system to couple the module with the modular electronic system. The module adapter is removably inserted into the chassis of the modular electronic system with an adapter tool operable to lock the module adapter in place in the chassis. A method for insertion of the module adapter is also disclosed herein.

An electronic apparatus includes a housing, a first substrate, and at least one substrate module. The housing includes side plates and a bottom plate. The side plates define the inside space having a bottom opening. The side plates include a first side plate and a second side plate connected to the first side plate. The first side plate has a protrusion protruding toward the inside space of the housing. The bottom plate is connected to the side plates to close the bottom opening. The first substrate is provided in the inside space to face the bottom plate. The at least one substrate module is provided on the first substrate in the inside space. The substrate connecting member is provided on the first substrate to face the second side plate and has a hole into which the protrusion of the first side plate is inserted.

A server node is provided that includes a processor and a network interface controller mounted in a chassis configured to be inserted into a server node slot of a server node grid. The chassis includes a blind-mate connector system on a back side that includes a blind-mate power connector and a blind-mate network connector configured to blind-mate with a corresponding blind-mate power connector and a corresponding blind-mate network connector of the server node slot of the server node grid. As the server node is inserted into the server node slot, the blind-mate power connector is configured to blind-mate with the corresponding blind-mate power connector of the server node slot before the blind-mate network connector blind-mates with the corresponding blind-mate network connector of the server node slot, such that the blind-mate power connector provides alignment guidance for the blind-mate network connector.

The present invention provides a device for aligning a plurality of line card connectors with a plurality of fabric card connectors using a lattice having a plurality of intersecting strips defining an array of framed slots.

An electrical device includes a connection part and a cover part connected to the connection part. A mounting part is accommodated and situated in the connection part, and a first circuit board is connected to the mounting part in a coded manner. A second circuit board is situated in the cover part, which is connected to a frame part in a coded manner. The first circuit board is connected to a plug connector part, and the second circuit board is connected to a mating plug connector part. A leading guide for a plug connection is provided on the mounting part, which becomes active when the cover part is connected to the connection part. The frame part being able to be connected to the mounting part in a coded manner.