A lifting structure in the form of a release hook configured to conveniently and easily release computer components from their supporting structure by a simple pivoting action in response to lifting of thumbscrews. A typical computer component would be a PCIe card within a GPU tray. The lifting structure does not require the use of tools to release the computer components, and can be used where computer components ordinarily cannot be released by human fingers due to limitations of space. The lifting structure lifts the computer component to a height where the computer component can then be easily grasped by human fingers for removal of the component.

A liquid cooling subsystem and method of manufacturing a liquid cooling subsystem in an information handling system that includes a base plate, a heat exchanger mounted on the base plate, and an inlet coolant tube and outlet coolant tube operatively connected to the heat exchanger. The liquid cooling subsystem includes a liquid leak sensor disposed on the base plate that includes a main body and secondary body that each contain a plurality of sensing areas. The liquid cooling subsystem also includes electronic components for connecting and electrically detecting fluid on the plurality of sensing areas disposed on the main body. The liquid cooling subsystem also includes an opening in the main body that accommodates the heat exchanger and a split feature in the main body. The secondary body is connected to the main body along a foldable edge on an opposite side of the split feature.

An electronic device includes: a housing which has two side walls which are spaced apart from one another along an apposition direction and form an accommodation space between them; a printed circuit board which is insertable into the accommodating space of the housing along an insertion direction pointing transversely to the apposition direction and, in a mounting position, is accommodated in the accommodating space in a position perpendicular to the apposition direction and has a side edge extending along the insertion direction; and at least one attachment part which has at least one engagement receptacle by which the at least one attachment part is attachable to the side edge of the printed circuit board and, in an attached position, is connected to the printed circuit board.

A modular system for producing an electronic device includes: a housing, which forms an accommodating space; a printed circuit board which is insertable along an insertion direction into the accommodating space of the housing and, in a mounting position, is accommodated in the accommodating space; and a plurality of attachment parts, which are connectable to the printed circuit board and which, when viewed along the insertion direction, each have a division corresponding to a predetermined smallest dividing unit or an integral multiple of the predetermined smallest dividing unit. Each attachment part has a first guide device for guiding on a second guide device of the housing and a combination of attachment parts is connectable to the printed circuit board in a manner arranged next to one another along the insertion direction such that when the printed circuit board is inserted into the accommodating space, the combination is guided.

An I/O device includes an I/O base, at least two I/O modules supported on the I/O base, and a duplex terminal block assembly supported on the I/O base. The at least two I/O modules include a first I/O module and a second I/O module coupled to the duplex terminal block assembly in parallel. The duplex terminal block assembly can include connectors for connecting to a field device. The duplex terminal block assembly can include conductive structures for coupling the connectors with each of the first and second I/O modules. The duplex terminal block can be installed in a pair of ports in an I/O base to connect two I/O modules in parallel.

An electronic device includes: a housing which has two side walls which are spaced apart from one another along an apposition direction and form an accommodation space between them; a printed circuit board which is insertable into the accommodating space of the housing along an insertion direction pointing transversely to the apposition direction and, in a mounting position, is accommodated in the accommodating space in a position perpendicular to the apposition direction and has a side edge extending along the insertion direction; and at least one attachment part which has at least one engagement receptacle by which the at least one attachment part is attachable to the side edge of the printed circuit board and, in an attached position, is connected to the printed circuit board.

A modular system for producing an electronic device includes: a housing, which forms an accommodating space; a printed circuit board which is insertable along an insertion direction into the accommodating space of the housing and, in a mounting position, is accommodated in the accommodating space; and a plurality of attachment parts, which are connectable to the printed circuit board and which, when viewed along the insertion direction, each have a division corresponding to a predetermined smallest dividing unit or an integral multiple of the predetermined smallest dividing unit. Each attachment part has a first guide device for guiding on a second guide device of the housing and a combination of attachment parts is connectable to the printed circuit board in a manner arranged next to one another along the insertion direction such that when the printed circuit board is inserted into the accommodating space, the combination is guided.

An I/O device includes an I/O base, at least two I/O modules supported on the I/O base, and a duplex terminal block assembly supported on the I/O base. The at least two I/O modules include a first I/O module and a second I/O module coupled to the duplex terminal block assembly in parallel. The duplex terminal block assembly can include connectors for connecting to a field device. The duplex terminal block assembly can include conductive structures for coupling the connectors with each of the first and second I/O modules. The duplex terminal block can be installed in a pair of ports in an I/O base to connect two I/O modules in parallel.

An I/O device includes an I/O base, at least two I/O modules supported on the I/O base, and a duplex terminal block assembly supported on the I/O base. The at least two I/O modules include a first I/O module and a second I/O module coupled to the duplex terminal block assembly in parallel. The duplex terminal block assembly can include connectors for connecting to a field device. The duplex terminal block assembly can include conductive structures for coupling the connectors with each of the first and second I/O modules. The duplex terminal block can be installed in a pair of ports in an I/O base to connect two I/O modules in parallel.

Disclosed is a field device of automation technology, comprising: a housing having a wall; a data transmission means arranged on an outside of the housing wall; and an electronic operating circuit arranged in a housing chamber and is adapted to operate the data transmission means, wherein the data transmission means and the electronic operating circuit are connected via an electrical signal line having a plurality of electrical conductors, wherein a first electrical conductor is adapted to lead a data signal and wherein at least a second electrical conductor is adapted to shield the first electrical conductor, wherein the signal line has an isolation device adapted to isolate a first signal line section galvanically from a second signal line section, wherein the isolation device includes an electromagnetically transparent plate having a first lateral surface and a second lateral surface parallel to the first lateral surface.