A heat sink for a semiconductor switching device. The heat sink has a contact surface for producing planar contact with one or more elements of a power module of the semiconductor switching device that are to be cooled. The heat sink additionally has measures for positioning the power module on and fastening it to the heat sink in a preferred position, and a fastening plate with molded-on mountings for positioning and mounting the heat sink on a carrier device. The heat sink, including the contact surface and the fastening plate, is manufactured in one piece from electrically insulating, thermally conductive plastics material having a thermal conductivity of at least 2 W/(m.Math.K).

Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.

A modular control apparatus, having a head module, and at least one supply module and peripheral module arranged on the head module and having a bus structure. The supply module and the peripheral module have a base module part, an electronic module part and a connection module part. The base module parts are arranged next to one another and provide the bus structure that electrically couples the head module, the supply module and the peripheral module to one another. The supply module additionally comprises an electrical line that runs from the connection module part through the electronic module part to the base module part and connects the supply connection of the supply module to the bus structure. An overload identification unit is arranged at the electrical line and determines a parameter of the electrical line and produces a warning signal if the parameter exceeds a threshold value.

Methods, devices, and systems for a hardware adapter device are described herein. One device includes housing, a plurality of printed circuit boards (PCBs) housed by the housing, where each of the plurality of PCBs include traces, and a switch to select a bus address corresponding to the hardware adapter device, where the housing receives an input/output (I/O) module such that the traces of the PCBs provide an electrical path from a wiring baseboard to the I/O module.

An expansion module of a programmable logic controller is provided. The expansion module comprises a function body and an expansion base. The function body comprises a housing, a circuit board and a first connector. The circuit board is disposed in the housing. The first connector is connected with the circuit board and is partially exposed from the housing. The expansion base is detachably assembled with the function body and comprises a bracket and a three-way connector. The three-way connector is detachably disposed in the bracket and comprises three conducting terminals. The first conducting terminal and the second conducting terminal are at least partially exposed from the bracket. The third conducting terminal is configured to connect with the first connector. When there are plural expansion modules, two adjacent function bodies can be detachably assembled with each other, and two adjacent expansion bases can be detachably assembled with each other.

A modular actuator control system comprising first and second actuator control modules configured to control first and second actuators and each having a housing, control and power electronics, power and communication connections, an actuator power connection, a flow path in each housing between an inlet and outlet port that is configured to provide a liquid coolant to the power electronics in the housing, an attachment connecting the first and second housings of the first and second actuator control modules, and a coolant inlet port of the first actuator control module configured to connect to a fluid coolant source and a coolant outlet port of the first actuator control module connected to a coolant inlet port of the second actuator control module, wherein the first actuator control module and the second actuator control module are stacked in coolant fluid communication with each other.

A modular control apparatus, having a head module, and at least one supply module and peripheral module arranged on the head module and having a bus structure. The supply module and the peripheral module have a base module part, an electronic module part and a connection module part. The base module parts are arranged next to one another and provide the bus structure that electrically couples the head module, the supply module and the peripheral module to one another. The supply module additionally comprises an electrical line that runs from the connection module part through the electronic module part to the base module part and connects the supply connection of the supply module to the bus structure. An overload identification unit is arranged at the electrical line and determines a parameter of the electrical line and produces a warning signal if the parameter exceeds a threshold value.

A modular control apparatus, having a head module, and at least one supply module and peripheral module arranged on the head module and having a bus structure. The supply module and the peripheral module have a base module part, an electronic module part and a connection module part. The base module parts are arranged next to one another and provide the bus structure that electrically couples the head module, the supply module and the peripheral module to one another. The supply module additionally comprises an electrical line that runs from the connection module part through the electronic module part to the base module part and connects the supply connection of the supply module to the bus structure. An overload identification unit is arranged at the electrical line and determines a parameter of the electrical line and produces a warning signal if the parameter exceeds a threshold value.

A detachable industrial network module, including: a housing in which a plurality of through holes are formed; and a communication module embedded in the housing and including a plurality of terminal portions to be electrically connected to an external device, wherein the through holes of the housing are provided in a lattice pattern and the housing is selectively detachable from or attachable to an outer surface of the actuator module, at least one guide groove is provided in the housing to prevent wiring bundles coupled to the terminal portions of the communication module from interfering with each other, and the communication module is electrically connected to the actuator module by a sub-connector as a medium.

In a connection unit for an electrical device, an electrical device system, and a production method, the connection unit has an electrically insulating receiving part, which includes a first receiving section, a second receiving section, and at least one electrically conductive connection device, in particular a bus bar. The receiving part is arranged to accommodate connection device(s) with the aid of the first and second receiving sections. A connection device is accommodated in the first receiving section, and, for example, no connection devices are accommodated in the second receiving section.