Patent classifications
H05K7/1479
In-place retrofit of PLC control systems
A method for upgrading a portion of a process control system from a legacy programmable logic controller (PLC) to a non-PLC process controller is disclosed. A mounting rack sized to fit into a space occupied by legacy hardware is assembled and populated with replacement hardware that includes an I/O card, an I/O terminal block, and a custom interface module. The custom interface module is coupled to the I/O card via the I/O terminal block and to a plurality of process control field devices via a legacy wiring mechanism coupled to legacy wiring of the process control system, without requiring modification or re-termination of the legacy wiring. The legacy wiring mechanism is disconnected from the legacy hardware, the rack containing the legacy hardware is removed and replaced with the mounting rack, and the legacy wiring mechanism is coupled to the custom interface module.
A VALVE MANIFOLD SERIALLY MOUNTED TO A DISTRIBUTED CONTROL SYSTEM ASSEMBLY
A control system has an I/O bank with a communication module controlling a plurality of Input/Output modules operably connected to its communication backplane and a valve manifold having a communication module serially connected to the backplane of the I/O bank. The I/O bank with a plurality of Input/Output modules is constructed to be connected to a plurality of field sensors or loads. The valve manifold with a plurality of solenoid valves is constructed to be pneumatically connected to a plurality of field devices.
IN-PLACE RETROFIT OF PLC CONTROL SYSTEMS
A method for upgrading a portion of a process control system from a legacy programmable logic controller (PLC) to a non-PLC process controller is disclosed. A mounting rack sized to fit into a space occupied by legacy hardware is assembled and populated with replacement hardware that includes an I/O card, an I/O terminal block, and a custom interface module. The custom interface module is coupled to the I/O card via the I/O terminal block and to a plurality of process control field devices via a legacy wiring mechanism coupled to legacy wiring of the process control system, without requiring modification or re-termination of the legacy wiring. The legacy wiring mechanism is disconnected from the legacy hardware, the rack containing the legacy hardware is removed and replaced with the mounting rack, and the legacy wiring mechanism is coupled to the custom interface module.
Devices, Systems, and Methods for Providing and Using Crop Control Hardware In a Master Controller in an Assembly Line Grow Pod
Devices, systems, and methods for providing and operating crop control hardware are provided herein. Some embodiments include an assembly line grow pod having a master controller with a plurality of bays and being communicatively coupled to components of the grow pod, a crop control module within one of the bays such that the crop control module is communicatively coupled to the master controller and the components of the grow pod, and a second control module in one of the bays, which is removably insertable such that it is removable from the bay without altering the assembly line grow pod functionality. The crop control module is programmed to sense a removal of the second control module, determine control signals necessary to maintain an operation of the grow pod and the components of the grow pod, and provide the control signals to the grow pod or the components of the grow pod.
DISTRIBUTED CONTROL SYSTEMS AND METHODS FOR USE IN AN ASSEMBLY LINE GROW POD
A distributed control system for use in an assembly line grow pod includes a master controller and a hardware controller device. The master controller includes a first processor and a first memory for storing a first set of instructions that dictates plant growing operations and a second set of instructions that dictates a plurality of distributed control functions. The hardware controller device is coupled to the master controller via a plug-in network interface. The hardware controller device includes a second processor and a second memory for storing a third set of instructions that dictate a selected control function of the plurality of distributed control functions. Upon the plug-in connection, the master controller identifies an address of the hardware controller device and sends a set of parameters defining a plurality of tasks relating to the selected control function.
In-place retrofit of PLC control systems
A method for upgrading a portion of a process control system from a legacy programmable logic controller (PLC) to a non-PLC process controller is disclosed. A mounting rack sized to fit into a space occupied by legacy hardware is assembled and populated with replacement hardware that includes an I/O card, an I/O terminal block, and a custom interface module. The custom interface module is coupled to the I/O card via the I/O terminal block and to a plurality of process control field devices via a legacy wiring mechanism coupled to legacy wiring of the process control system, without requiring modification or re-termination of the legacy wiring. The legacy wiring mechanism is disconnected from the legacy hardware, the rack containing the legacy hardware is removed and replaced with the mounting rack, and the legacy wiring mechanism is coupled to the custom interface module.
Remote terminal unit (RTU) supporting elevated operating temperature and reduced power consumption
An apparatus includes a remote terminal unit (RTU) having a housing, where at least a portion of the housing includes a shell of thermally-conductive material. The RTU also includes at least one circuit board assembly having at least one processing device configured to communicate with one or more industrial control and automation field devices via one or more input/output (I/O) channels. The at least one circuit board assembly is positioned within the shell. The RTU further includes a heat sink configured to remove thermal energy from the at least one processing device. In addition, the RTU includes a thermal pad configured to receive the thermal energy from the heat sink and to provide the thermal energy to the shell.