Methods, systems, and devices for designing and implementing power and cooling fluid in a computing environment such as an electronics rack are disclosed. The disclosed methods and systems may provide for a high degree of power distribution and cooling fluid distribution reliability. To provide for a high degree of reliability, the system may include a number of protective features that may reduce the likelihood of connectors used for power and cooling fluid distribution from being damaged. The system may also provide for segregation of power distribution components from cooling fluid distribution components. The rack configurations include codesign of the server and rack to form the physical segregation. The segregation may reduce the chance of these components impacting the operation of other components.

A rack device having a cabinet and power modules stacked in the cabinet is provided. The power module has a frame, an insulative plate, an insulative cover and transformers. The insulative plate is arranged in the frame. The insulative cover is arranged in the frame and disposed spacedly from and parallel with the insulative plate. Each transformer arranged in the frame has a high-voltage set and a low-voltage set electrically connected with each other. The low-voltage sets are arranged on one surface of the insulative plate and do not protrude from the frame, and the high-voltage sets are arranged on another surface of the insulative plate and between the insulative plate and the insulative cover. The frame of each power module is connected with the frame of adjacent power module, and the frame of at least one of the power modules is connected to the cabinet.

An apparatus comprising an ac/dc power supply for providing power to power consumers in an internet data center or to a stand-alone server includes power-handling circuitry and a passive heat-dissipation system that passively dissipates heat generated by the power-handling circuitry. The passive heat-dissipation system comprises a housing that encloses that power-handling circuitry and a thermal network that provides thermal communication between the power-handling circuitry and faces of the housing.

A data center power system includes an electrical power conductor that includes a live conductor surface and is configured to carry direct current (DC) power from a power source through a human-occupiable workspace of a data center; a grounded conductor positioned in the human-occupiable workspace apart from the electrical power conductor; a first electrical connector configured to mount to a data center rack that supports a plurality of electronic devices, the first electrical connector moveable to electrically contact the live conductor surface of the electrical power conductor; and a second electrical conductor positioned on the rack and configured to electrically contact the grounded conductor.

A system includes a turbine configured to exhaust an air stream. The system also includes a first coil configured to transfer thermal energy to the air stream when the air stream passes by or through the first coil, wherein the first coil is downstream of the turbine. The system also includes a second coil configured to transfer thermal energy to the air stream when the air stream passes by or through the second coil, wherein the second coil is downstream of the first coil. The system also includes a third coil configured to transfer thermal energy to the air stream when the air stream passes by or through the third coil, wherein the third coil is downstream of the second coil. The air stream is configured to cool one or more electronic components of a data center that is downstream of the third coil.

A service system and a server capable of increasing an operation rate of a production base are provided. The server acquires operation information of a component mounter in a mounting work from a host computer in the production base. The server generates analyzed result data obtained by analyzing the operation information based on the types of the manufacturers (component manufacturer and the package manufacturer) of electronic component and the package. The server transmits the generated analyzed result data to host computers in the other production bases.

Technologies for switching network traffic include a network switch. The network switch includes one or more processors and communication circuitry coupled to the one or more processors. The communication circuity is capable of switching network traffic of multiple link layer protocols. Additionally, the network switch includes one or more memory devices storing instructions that, when executed, cause the network switch to receive, with the communication circuitry through an optical connection, network traffic to be forwarded, and determine a link layer protocol of the received network traffic. The instructions additionally cause the network switch to forward the network traffic as a function of the determined link layer protocol. Other embodiments are also described and claimed.

A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.

Embodiments are disclosed of a power delivery module that includes a power delivery board rotatable about a first axis between a first orientation and a second orientation. A first pair of electrical contacts, one positive and one negative, is on a first side of the board, and a second pair of electrical contacts, one positive and one negative, is on a second side of the board. The second positive contact is directly opposite the first negative contact and the second negative contact is directly opposite the first positive contact. A clip module is coupled to the power delivery board and includes a pair of power clips to engage with and electrically couple to the first or the second pairs of contacts. The clip module is rotatable about a second axis parallel to and spaced apart from the first axis between a first position where the power clips engage the first pair of contacts and a second position where the power clips engage the second pair of contacts.

Deployment of arrangements of physical computing components coupled over a communication fabric are presented herein. In one example, a method includes coupling into a communication fabric a plurality of communication interfaces provided by a baseboard hosting a plurality data processing devices. The method includes establishing a one-hop latency in the communication fabric between the plurality of data processing devices and peripheral card slots, and establishing a two-hop latency in the communication fabric between the plurality of data processing devices and additional peripheral card slots. The method also includes establishing interconnect pathways between a plurality of communication switches that provide the one-hop latency through one or more cross-connect communication switches that provide the two-hop latency.