A thermal management system includes an ionic motion generator to direct fluid flow towards a heated component (e.g., equipment to be cooled or a heatsink mounted thereat). In certain systems, the fluid is directed through a conduit arrangement. In certain systems, the fluid is directed past the heated component to a heat exchanger. Certain types of thermal management systems have no moving components to create the fluid flow.

Information handling system (IHS) component immersion cooling systems and methods employ an apparatus having an IHS component immersion cooling flow passage housing disposed at (a) IHS component(s) of an IHS disposed in an immersion cooling tank. The IHS component immersion cooling flow passage housing has an immersion fluid inlet open to immersion fluid within tank and an immersion fluid outlet connected to a return line of an immersion fluid pump. The IHS component cooling apparatus flow passage housing may be a cold plate or a ducted heatsink disposed on, or about, the IHS component(s) of the IHS disposed in the immersion cooling tank. The immersion fluid pump may be the pump that also circulates the immersion fluid within the tank. The tank may include a manifold in fluid flow communication with the pump. This manifold may receive a plurality of return lines, each from an IHS component cooling apparatus.

Apparatus cools electronic circuitry. An enclosure surrounds the circuitry. Air intake holes are only in a portion of a first panel that faces a first direction. Air exhaust holes are only in a portion of a second panel that faces a second direction opposite the first. Air plenum piece is disposed within the enclosure, and a substantially planar portion extends from a first panel inner wall and ends a distance from a second panel inner wall. At least one tab extends from the substantially planar portion to an upper panel inner wall. The air plenum piece divides an enclosure interior into a first volume, enclosed by the first panel inner wall, substantially planar portion, at least one tab, and upper panel inner wall, into which the air intake holes open and a second volume into which the air exhaust holes open. The second volume is a remaining interior volume.

A cooler includes: a cooling wall including a first surface and a second surface; a first path extending in a first direction and having an inlet for a refrigerant; a second path extending in the first direction and having an outlet for the refrigerant; a cooling path causing the first path to communicate with the second path in a second direction intersecting the first direction; a partition spaced from the cooling wall in a third direction perpendicular to the first surface, separating the first and second paths from the cooling paths, and including a third surface constituting a part of a wall surface of the first path, the third surface including a first portion and a second portion differing from the first portion in position in the third direction. The first path includes a first gas retaining space defined by the first and second portions.

One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.

A computing chassis, including hard disk drives positioned at a first end of the chassis; a fan module positioned at a second end of the chassis; a first baffle having acoustic absorbing material, the first baffle extending between a first and a second side of the chassis, wherein the first and second sides of the chassis extend between the first and the second ends of the chassis, the first baffle spaced-apart from the fan module a first distance; a second baffle having acoustic absorbing material, the second baffle extending between the first and the second side of the chassis, the second baffle spaced-apart from the fan module a second distance greater than the first distance, wherein the first and the second baffle extend between the first and second sides of the chassis perpendicular to an airflow, and the acoustic absorbing material of the baffles attenuate acoustic waves.

A compressor may include a compressor shell, a motor, a compression mechanism, an enclosure, a control module, a fan, and an airflow deflector. The compression mechanism is disposed within the compressor shell. The motor drives the compression mechanism. The enclosure defines an internal cavity. The control module is in communication with the motor and is configured to control operation of the motor. The fan may be disposed within the internal cavity. The airflow deflector may include a base portion, a first leg, and a second leg. The first and second legs may be spaced apart from each other and may extend from the base portion. The fan may force air against the base portion. A first portion of the air may flow from the base portion along the first leg, and a second portion of the air may flow from the base portion along the second leg.

Embodiments of this application provide a wireless charger, and relate to the field of charging device technologies. The wireless charger includes a wireless charging module, a first fan, a housing including a contact plate used for contact with the rear surface of the terminal device, and an air intake vent disposed at a position that is of the housing and that is close to the first fan, and an airflow guide structure disposed on a side that is of the housing and that is adjacent to the contact plate. The airflow guide structure extends toward the display surface of the terminal device.

Examples of back covers for devices are described. In an example, the back cover includes an air-vent, and a region of a surface of the back cover directing air dispensed by a cooling unit of the device toward the air-vent.

A data center configured to be positioned in an environment (e.g., an open space) has a plurality of modules. Among other things, each module has a housing forming an interior configured to contain a plurality of processing devices that generate heat during operation. To manage the temperature within the interior, each module has an air inlet configured to receive air from the environment, and an air outlet configured to exhaust air from the housing. At least three of the modules are spaced apart to form at least one lateral space between adjacent modules. The plurality of modules preferably are arranged so that the at least three modules form an interior region configured to receive the exhaust air of the at least three modules.