A modular data centre unit is provided comprising: at least one module, each module defining an interior space, intended to house computing equipment mounted on racks or cabinets; and at least one cooling module configured to cool the inner space of the at least one module, wherein the at least one module is configured to enable horizontal and/or vertical arrangement in which a plurality of modules are arranged adjacent to one another.

An electronic device is provided. The electronic device includes a housing having an insertion slot, a connecting interface, and an adaptor card. The connecting interface is disposed in the housing for connecting with a first electronic module or a second electronic module separately and has a first connecting part and a second connecting part. The adaptor card is detachably disposed in the housing and includes a flow guide. When the electronic device is in a first mode, the first electronic module is connected to the first connecting part, and the adaptor card is disposed between the insertion slot and the connecting interface. The flow guide directs an airflow toward the first electronic module. When the electronic device is in a second mode, the adaptor card is removed from the housing, and the second electronic module is connected to the first connecting part and the second connecting part.

A method and system for controlling operation of an immersion cooling system having an immersion cooling tank adapted to contain a heat transfer fluid used to immersion cool a heat-generating object contained therein, the method including: sampling a volume of the heat transfer fluid while the object remains in an operating state; measuring at least one property or parameter of the sampled heat transfer fluid; generating and transmitting measurement data to a control unit; comparing measurement data with respective threshold data using the control unit; and controlling operation of the immersion cooling system with the control unit based on the comparison.

An electric range that may include a case, a cover plate coupled to an upper end of the case and having an upper surface on which a heating target is disposed, at least one heater disposed under the cover plate and configured to heat the heating target, an upper bracket that is disposed under the at least one heater and supports the at least one heater, a base bracket that is disposed under the upper bracket and on which a printed circuit board is installed, a heat sink installed on the printed circuit board, a blower fan installed on the base bracket and configured to discharge air toward the heat sink, and an air guide that communicates with the blower fan and surrounds the heat sink to form a flow path of air which cools the heat sink.

A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Disclosed is a heat dissipation subrack, including a cabinet body defining an accommodating space. The cabinet body defines an air inlet, two air supplementing openings, and an air outlet. The accommodating space has an air inlet region, and a heat source region communicatively coupled to the air inlet region. An opening direction of the air inlet and an opening direction of each of the air supplementing openings intersect in the air inlet region. The cabinet body includes multiple baffles, each of the baffles includes two wind shielding surfaces, and airflow passages are defined between each two adjacent baffles and between one of inner walls of the cabinet body and an baffle adjacent to the one of the inner walls of the cabinet body.

An electronic device includes a housing, a heat conductive portion, a circuit board, a fin set, and a fan. The housing has an accommodating space. The heat conductive portion is disposed in the accommodating space, and divides the accommodating space into a first space and a second space. The circuit board is disposed in the first space and includes a heat source. The heat source generates heat and is thermally coupled to the heat conductive portion. The fin set is disposed in the second space and thermally coupled to the heat conductive portion. The fan is disposed in the second space and located on one side of the fin set. The fan is adapted to guide an airflow through the fin set to discharge the heat generated by the heat source from the housing.

An electric range is provided that may include a case, a cover plate coupled to an upper end of the case and having an upper surface on which a heating target is disposed, and an air guide forming a flow path of air, wherein the air guide includes a element installation portion which is disposed in a portion of the air guide.

An electric range is provided that may include a case, a cover plate coupled to an upper side of the case, and on which an object to be heated is placed, an air blowing fan discharging air, and an air guide that communicates with the air blowing fan, and forms a flow path of air. The air guide comprises a first air guide that communicates with the air blowing fan and guides the air discharged from the air blow fan substantially horizontally, and an expansion protrusion that protrudes from the first air guide in a lengthwise direction of the air guide or in a direction perpendicular to the lengthwise direction of the air guide such that a cross section of the air guide expands.

A home appliance is provided in which electronic elements are attached to an outer surface of a heat sink, allowing air to directly contacting the electronic elements. More specifically, the electronic elements are attached to an outer slanted surface of the heat sink, an air guide is disposed to surround the heat sink to which the electronic elements are attached, and an air blowing fan is used to allow air to flow in the air guide, enabling the flowing air to directly contact the electronic elements.