An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

An electronic apparatus includes: a board accommodating portion that accommodates a board in a horizontally placed state, the board accommodating portion provided inside a housing; an intake opening provided in a right side plate of the housing and communicating with the board accommodating portion; an exhaust opening provided in a rear plate of the housing; a cooling fan provided in such a way as to face the exhaust opening; and a backboard that is a partition between the board accommodating portion and a fan accommodating portion that accommodates the cooling fan, in which a left side portion and a right side portion of the backboard have a left side vent and a right side vent through which the board accommodating portion and the fan accommodating portion communicate with each other.

An electronic device cover is configured to accommodate an electronic device. A first air intake window and a first air exhaust window are disposed on the electronic device cover. The first air intake window is configured to communicate with an air intake vent of the electronic device to form an air intake channel, and the first air exhaust window is configured to communicate with an air exhaust vent of the electronic device to form an air exhaust channel. An air return channel is disposed inside the electronic device, and the air return channel is configured to communicate the air exhaust channel and the air intake channel.

An electrical device with buoyancy-enhanced cooling is provided. The electrical device includes a housing having a first portion including a heat sink and a second portion coupled to the first portion. The heat sink includes a plurality of hollow fins. A cover plate is positioned within the housing and is coupled to the first portion of the housing. The cover plate defines openings between an interior of the housing and the plurality of hollow fins and the openings are located at each end of each hollow fin. Further, an electrical component is positioned within the interior of the housing. Air heated by the electrical component is permitted to circulate within the housing and is directed through the hollow fins based on buoyancy forces (e.g., such that the air is permitted to cool within the hollow fins based on conduction, convection, and/or radiation).

A power supply system for a computer system having a fan module that protects the power supply system from backflow from the fan module is disclosed. A power supply unit has an internal fan emitting an airflow from one end of the power supply unit. The power supply unit is mountable next to the fan module. The power supply system is mountable in proximity to an air baffle that diverts the airflow generated by the internal fan. An air tunnel is located on one side of the power supply unit. The air tunnel has an opening on one end for receiving the airflow diverted by the air baffle from the internal fan. The air tunnel has an opposite end in proximity to a second opening to divert the received airflow under the power supply unit.

An electronics equipment cabinet includes one or more cabinet walls defining an interior enclosure space for housing electronic equipment and an air management box coupled to an interior surface of one of the one or more cabinet walls. The air management box includes a wall and a plurality of plates detachably coupled to the wall. The plates include a first plate having one or more perforations defining a first perforation pattern and a second plate having one or more perforations defining a second perforation pattern to control the direction and/or volume of airflow to the electronic equipment in the interior enclosure space or from the electronic equipment in the interior enclosure space to the air management box. The first perforation pattern is different than the second perforation pattern. Other example electronics equipment cabinets, electronics equipment cabinet kits, and methods of controlling airflow in electronic equipment cabinets are also disclosed.

An air duct for cooling dual socket information handling systems divides airflow into two parallel paths. Inner walls, a chassis divider and a top surface form a main channel. An intermediate divider and intermediate wall are positioned between the sockets, wherein airflow exiting the first socket is prevented from flowing through the second socket. Lower lateral channels and upper lateral channels are formed between each inner wall and a corresponding outer wall, wherein lower lateral channels allow airflow to bypass the first socket to cool the second socket and the upper lateral channels allow heated airflow exiting the first socket to bypass the second socket.

A heat dissipation device, a heat dissipating method, and a terminal are described. In an embodiment, the heat dissipation device, a heat dissipating method, and a terminal are configured to correspondingly form at least one ventilation wall that is configured to dissipate heat on different heat source positions of the terminal, and form a flow path of the heat dissipation airflow generated by the at least one ventilation wall, based on different heat source positions of the terminal in different applications. In an embodiment, the entire heat dissipation of the terminal can be achieved by the flexible and variable flow path to provide a good user experience.

The present disclosure provides a driving part of a warm air heater and the warm air heater, wherein the driving part comprises a driving circuit board, and a silicon-controlled element is arranged on the driving circuit board; the driving circuit board is arranged in an air duct of the warm air heater, and the driving circuit board is positioned at the upstream of the heating part or is flush with the heating part, wherein the upstream or the flush is based on the direction of air flow in the air duct. The driving part of the present disclosure utilizes the fan to cool the silicon-controlled element without adding large-area radiating fins, thus reducing the cost of the driving part, and the driving circuit board is not arranged on the main control circuit board anymore, thus realizing the miniaturization of the main control part.

An air baffle structure is provided for installing a motherboard and inside a case. The case includes an opening. The air baffle structure includes a pair of brackets and an air baffle cover. The pair of brackets are fixed on the case and disposed on two sides of the opening, and the motherboard is pluggably disposed between the pair of brackets. The air baffle cover is connected to tops of the pair of brackets and straddles the pair of brackets. Therefore, the air baffle cover may effectively guide the air to pass through the motherboard to dissipate heat of the motherboard, and the quantity of fans in the case is reduced.