The application discloses a power supply device, including: a circuit board having a first side and a second side opposite to each other, the circuit board at least mounted with a first heating element disposed close to the second side; a fan disposed on the first side of the circuit board for providing an air-cooled airflow for heat dissipation, wherein an airflow direction is defined from the first side to the second side; a first airflow guide member disposed in parallel to the first heating element; and a second airflow guide member at least partially disposed above the first heating element, and adjacent to the first airflow guide member, wherein the first airflow guide member, the second airflow guide member and the first heating element form a first auxiliary air channel; wherein a direction of the first auxiliary air channel is the same as the airflow direction.

A thermal management solution in a mobile computing system is bonded to an integrated circuit component by a thermal interface material layer (TIM layer) that does not require the application of a permanent force to ensure a reliable thermally conductive connection. A leaf spring or other loading mechanism that can apply a permanent force to a TIM layer can be secured to a printed circuit board by fasteners that extend through holes in the board in the vicinity of the integrated circuit component. These holes consume area that could otherwise be used for signal routing. In devices that use a TIM layer that does not require the application of a permanent force, the thermal management solution can be attached to a printed circuit board or chassis at a location remote to the integrated circuit component, where the attachment mechanism does not or minimally interferes with integrated circuit component signal routing.

An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.

Provided is a cooling device including: a container that is sealed and accommodates a first heating element; a first radiator disposed outside the container; a first air blower that blows wind to the first radiator; and a heat dissipator that is disposed outside the container to receive the wind from the first air blower and dissipates heat of the first heating element.

Exemplary embodiments include an electronic display assembly for back to back electronic image assemblies. A first closed gaseous loop may encircle the first electronic image assembly while a second closed gaseous loop may encircle the second electronic image assembly. A heat exchanger is preferably positioned within the path of the first and second closed gaseous loop along with an open loop of ambient air. A circulating fan(s) may be used to force circulating gas around the closed gaseous loops. An open loop fan may be used to force ambient air through the heat exchanger and through an optional channel behind each electronic image assembly.

An electronic apparatus includes a chassis, a heating element in the chassis, and a cooling module in the chassis to cool the heating element. The cooling module includes: a blower fan; a heat sink having a plurality of fins spaced to have a gap therebetween, a first face with a first gap from the first cover member, and a second face with a second gap from the second cover member; a seal member attached to the first face of the heat sink so as to surround the first face; and a cover sheet attached to a surface of the seal member so as to cover the first face of the heat sink, thus defining a duct between the cover sheet and the first face to let air from the blower fan pass through the duct.

An interconnect for electrically coupling pads formed on adjacent chips or on packaging material adjacent the chips, with an electrically conductive heat sink being disposed between the pads, the interconnect comprising a metallic membrane layer disposed between two adjacent pads and disposed or bridging over the electrically conductive heat sink so as to avoid making electrical contact with the electrically conductive heat sink. An electroplated metallic layer is disposed on the metallic membrane layer. Fabrication of interconnect permits multiple interconnects to be formed in parallel using fabrication techniques compatible with wafer level fabrication of the interconnects. The interconnects preferably follow a smooth curve to electrically connect adjacent pads and following that smooth curve they bridge over the intervening electrically conductive heat sink material in a predictable fashion.

An electronic apparatus includes: a chassis; a heating element; a cooling module having a fan, a heat sink, and a heat transport device, the cooling module being configured to cool the heating element. The heat sink includes: a base plate; a plurality of fins standing from the base plate and placed with a gap between the fins to define an air channel through which air from the air outlet flows; and an inclined plate dividing the air channel in two stages in the standing direction of the fins and being gradually inclined from upstream to downstream of the air channel.