A home appliance is provided in which electronic elements are attached to an outer surface of a heat sink, allowing air to directly contacting the electronic elements. More specifically, the electronic elements are attached to an outer slanted surface of the heat sink, an air guide is disposed to surround the heat sink to which the electronic elements are attached, and an air blowing fan is used to allow air to flow in the air guide, enabling the flowing air to directly contact the electronic elements.

Provided is a generator that includes a housing, a high-power circuit including a power amplifier, and a low-power circuit. An air flow guidance plate divides the housing into at least two compartments including a high-power compartment and a low-power compartment. The high-power circuit is disposed within the high-power compartment and the low-power circuit is disposed within the low-power compartment.

This document describes a cooling device for cooling a heatsink having a plurality of cooling fins provided on a heatsink base. The cooling device includes a centrifugal fan having a fan inlet and a fan outlet, a support for mounting the fan above the heatsink, and a baffle locatable between the support and the heatsink base. The baffle defines an inlet pathway for feeding air between the cooling fins over the heatsink base to the fan inlet and an outlet pathway for expelling air from the fan outlet.

A power conversion device includes a power conversion module, a phase change material, a heat dissipation member, a cooling mechanism, and a controller. A semiconductor switching element and a freewheeling diode configure a power conversion circuit. The phase change material is provided on a principal plane of a casing. The heat dissipation member includes a heat dissipation surface. The heat dissipation surface is overlapped with the principal plane to sandwich the phase change material. The cooling mechanism cools the heat dissipation member. The controller generates a driving signal for driving the power conversion circuit and controls the cooling mechanism. The controller includes a predetermined heating operation. The heating operation may drive the power conversion circuit, in a state that the cooling mechanism is stopped or intermittently operated, such that heat generation occurs in both the semiconductor switching element and the freewheeling diode.

A heat dissipation device includes a case, a first board, a second board, a curved supporting structure, and a fan. The first board is disposed in the case. The curved supporting structure has a curved slot which is located on an inner surface of the curved supporting structure, and the curved slot extends radially with respect to a center of the curved supporting structure. The second board is inserted in the curved slot, and the first board, the second board, and the curved supporting structure collectively form an accommodating space. The fan is fixed to the second board and disposed within the accommodating space.

A fan-equipped heatsink includes: a heat receiving substrate made of metal; a centrifugal fan disposed on an upper surface side of the heat receiving substrate; a plate-shaped wall that is made of metal, is provided so as to stand at a position, on the upper surface of the heat receiving substrate, which is around and opposed to an outer peripheral portion having an air discharge opening of the centrifugal fan, and are provided with a plurality of through-holes that are open in a plate surface opposed to the centrifugal fan; and a lid member fixed to an upper end of the plate-shaped wall 4 and configured to close a space on the inner side of the plate-shaped wall.

Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element (60) installed in a casing (C); a heat dissipation means (70) causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (95). The heat dissipation bridge (95) exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element (60) and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element (60) to the heat sink. Accordingly, two means of the heat dissipation means (70) and the heat dissipation bridge (95) simultaneously cool the heating element (60), so cooling efficiency is improved.

A projection device includes a heat source and a heat dissipation module, including a heat dissipation base, a heat dissipation fin set, at least one heat conductor, a first fan and a second fan. The heat dissipation fin set has first and second regions adjacent to each other. The first region is located between the heat dissipation base and the second region. The first region has two opposite first ventilation surfaces. The second region has two opposite second ventilation surfaces. There is an angle between a normal direction of the first ventilation surface and a normal direction of the second ventilation surface. The heat conductor is connected between the heat dissipation base and the heat dissipation fin set. The first fan generates a first airflow flowing through the first ventilation surfaces. The second fan generates a second airflow flowing through the second ventilation surfaces.

A board structure includes: a board provided with a heat generating element; a heat sink including a plate-shaped base member having one face being in contact with the heat generating element, and plural fins arranged side by side in a fin arrangement direction on an other face of the base member, the fins each extending in a flow direction in which cooling air flows, the fins each having a distal end at a downstream end in the flow direction; a first resisting member provided on a downstream side in the flow direction with respect to the heat sink, the first resisting member acting as a resistor for the cooling air to be exhausted; and a second resisting member provided on the downstream side in the flow direction and on a first side in the fin arrangement direction with respect to the heat sink, the second resisting member acting as a resistor for the cooling air to be exhausted. The distal ends of the fins provided on a second side in the fin arrangement direction reside on an upstream side in the flow direction with respect to the distal ends of the fins provided on the first side.