The present invention provides a water-cooled radiator internally provided with a semiconductor refrigeration system and a fan, the water-cooled radiator comprising: a radiation fin, a water tank structure, water-cooled pipes, a water pump, a water-cooled gear, a semiconductor refrigeration structure and a radiator fan assembly, wherein the radiation fin, the water tank structure, the semiconductor refrigeration structure and the radiator fan assembly are connected into an integrated structure. By means of the semiconductor refrigeration structure, the water temperature of a water storage tank can be rapidly lowered, and the radiator fan assembly can dissipate the heat of and cool a semiconductor, and can dissipate the heat of and cool electronic components around a main board.

A thermal module with a heat pipe configured on a first portion having a constant cross-section thickness and a tapered second end configured for contact with a fin stack. The heat pipe is tapered along a length of the second portion such that the cross-section thickness of the heat pipe decreases toward the end of the heat pipe. A fin stack coupled to the tapered portion comprises a plurality of fins of different heights, wherein the fin heights increase such that the combined fin height and heat pipe cross-section thickness remains approximately constant over the width of the fin stack. The tapered heat pipe and fin stack with fins with increasing fin heights provide increased cooling and decreased airflow impedance through the fin stack.

An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.

A power supply device includes at least one magnetic member, a first circuit board and a second circuit board. The first circuit board is disposed over the magnetic member and is electrically connected to the magnetic member. The first circuit board has an opening. The second circuit board is electrically connected to the first circuit board. The second circuit board is disposed over the first circuit board and faces the opening of the first circuit board.

The present disclosure provides a cooling system. The cooling system includes: a first set of fans mounted on an inward-facing side of an air inlet on an outer shell of a case; a second set of fans mounted on an inward-facing side of an air outlet on the outer shell of the case, for generating, in cooperation with the first set of fans, a high-pressure airflow from the air inlet to the air outlet; a first heat sink connected to heat generating component in the case, for absorbing heat from the heat generating component and transferring the absorbed heat to a second heat sink; and the second heat sink mounted on an inward-facing side of the second set of fans and cooled by the high-pressure airflow.

Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a peripheral cooling unit (PCU) is to be located at a periphery of a datacenter, so that it can suction air from a hot aisle that is between at least two rows of racks and can cool at least one part of such air using a primary coolant, with at least one part of cooled air to be circulated to such racks, and with a primary coolant to cool secondary coolant that is to be distributed to at least one cold plate.

An electronic device includes a base, a circuit board and a heat dissipating module. The base includes a bottom cover and a frame. The frame is disposed on the bottom cover. An accommodating space is between the bottom cover and the frame. The bottom cover has an air inlet. The circuit board is disposed in the accommodating space. The circuit board has a through hole. The through hole corresponds to the air inlet. The heat dissipating module is disposed in the accommodating space and located above the circuit board. The heat dissipating module includes a fan. The fan corresponds to the through hole. The fan drives airflow to flow into the accommodating space from the air inlet and the through hole along an axial direction of the fan and then flow out of the base from the accommodating space along the axial direction of the fan.

An electronic device is provided. The electronic device includes a rear cover including an air inlet and an air outlet; a middle frame which is assembled with the rear cover to define a containing cavity in communication with the air inlet and the air outlet; a heat source arranged in the containing cavity; a heat transfer assembly arranged on a side of the middle frame facing towards the rear cover, and including first and a second ends; and a fan arranged opposite to the second end in the containing cavity. The first end and the heat source are stacked in a thickness direction of the electronic device. The heat transfer assembly is configured to transfer heat of the heat source to the second end. The fan draws air flow through the air inlet and discharges the air flow through the air outlet.

An immersion cooling system including a rack and at least one immersion cooling module is provided. The immersion cooling module includes a chassis and a condensation pipeline. The chassis is slidably disposed on the rack and is adapted to accommodate a coolant. At least one heat generating component is adapted to be disposed in the chassis to be immersed in the liquid coolant. The condensation pipeline is disposed in the chassis and is located above the liquid coolant. In addition, an electronic apparatus having the immersion cooling system is also provided.

An image capturing apparatus that realizes both of efficient heat dissipation and size reduction of an image capturing apparatus body. The image capturing apparatus includes an imaging board having an image sensor mounted thereon, a main circuit board that has heat generating devices mounted thereon and is arranged substantially in parallel to an imaging surface of the image sensor on a rear side of the imaging board, a duct unit disposed on a rear side of the main circuit board, and a cooling fan that draws outside air into the duct unit. The duct unit has a duct base opposed to the main circuit board and disposed substantially in parallel to the main circuit board, and a duct plate disposed obliquely to the duct base at a predetermined angle. The cooling fan is mounted on the duct plate.