A fixing assembly and an electronic device including same are disclosed. The fixing assembly includes a supporting member, a locking member, and a latching member. The supporting member includes a first supporting portion and a second supporting portion connected with each other, and the second supporting portion defines a sliding slot. The locking member includes a locking portion and a connecting portion connected with each other, the connecting portion includes a protrusion and a latching hole. The protrusion is slidably arranged in the sliding slot. When the protrusion slides along the sliding slot, the locking member slides and then rotates relative to the supporting member. The latching member is arranged on the second supporting portion and is adapted to be inserted into the latching hole. When the latching member is inserted into the latching hole, the fan is sandwiched and held between the first supporting portion and the locking portion.

A cooling system for an information handling system in a portable chassis comprises a fan housing containing two counterrotating impellers, wherein the axes of rotation of the two impellers are aligned with an axis of orientation relative to a rear surface of the portable chassis. By changing the angle of the axis of orientation, impellers with larger diameters may be positioned in the same fan area for increased volumetric airflow. The shape of the fan housing, the diameter of each impeller and the angle of the axis of orientation may be selected to direct and distribute a greater volumetric airflow for improved cooling of components in the portable chassis.

A cooling system for cooling components in an information handling system contained in a portable chassis comprises a die plate for receiving heat from a component, a heat pipe for transferring heat from the die plate to a single heat exchanger, a fan for generating an airflow across the heat exchanger and a thermal battery. The heat pipe comprises at least one curvature and the thermal battery is coupled to the die plate and has a length and a width such that the thermal battery is in contact with the heat pipe from the die plate to a point past the at least one curvature. The thermal battery may be formed from a thermally conductive material, be a vapor chamber or otherwise facilitate heat transfer to a heat pipe from the die plate to a point past the curvature for improved cooling.

Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

The present utility model relates to the technical field of heat dissipation devices, and in particular to an adjustable heat exchanger. The adjustable heat exchanger includes a fan assembly, a heatsink assembly, a semiconductor chilling plate and a conduction cooling unit connected in sequence, the conduction cooling unit includes a main conduction cooling plate and a conduction cooling fin, and the conduction cooling fin includes at least one conduction cooling sub-fin. The main conduction cooling plate is connected to the semiconductor chilling plate, the conduction cooling fin is movably connected to an outer peripheral wall of the main conduction cooling plate, the conduction cooling fin extends outward along the center of the main conduction cooling plate, and the conduction cooling fin and the main conduction cooling plate jointly form a contact surface for adapting to a heat-dispersing surface. The heat exchanger of the present utility model can adapt to hot surfaces with different curved surface radians, and form a surrounded fixed structure with the hot surface, thereby making the conduction cooling unit well contact surfaces with different radians.

A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.

An information handling system may include a chassis configured to house components of the information handling system and a modular power supply module configured to be readily removable from the chassis. The modular power supply module may include an enclosure, power supply components housed within the enclosure, an air mover configured to drive airflow to cool one or more components of the information handling system, and a mechanical assembly configured to mechanically couple the air mover to the enclosure that enables a user to remove the air mover from the enclosure while still coupled to the enclosure via the mechanical assembly, rotate the air mover 180 degrees relative to the enclosure while still coupled to the enclosure via the mechanical assembly, and reinsert the air mover into the enclosure, in order to modify a direction of airflow driven by the air mover.

An electronic control device includes: an electronic component; a base thermally coupled to the electronic component; a first fan and a second fan provided on one surface of the base; a plurality of first heat-dissipating fins provided on the one surface of the base and provided in a first region including a region between the first fan and the second fan; and a plurality of second heat-dissipating fins provided on the one surface of the base and provided in a second region farther from the first and second fans than the first region. The plurality of first heat-dissipating fins have a structure for guiding a refrigerant sent by one of the first fan and the second fan toward a remaining one of the first fan and the second fan in the first region. The plurality of second heat-dissipating fins formed in the second region have a structure for guiding a refrigerant flowing in from the first fan or the second fan to a side away from each of the first fan and the second fan.

An uninterruptible power supply (UPS) includes: a housing defining an interior space; a door operatively connected to the housing, the door being configured to be selectively opened and closed for accessing the interior space of the housing; san electrical system enclosed within the housing; at least one liquid cooling device mounted to a target component of the UPS disposed within the housing for cooling thereof, the at least one liquid cooling device defining a fluid conduit for circulating fluid therethrough; and a pumping module including at least one pump fluidly connected to the at least one liquid cooling device for circulating fluid therethrough, each of the at least one pump and the fluid conduit of the at least one liquid cooling device defining in part a liquid cooling circuit, the pumping module being mounted to the door and disposed on an exterior side thereof.

A component carrier includes a baseboard, two sidewalls, and an ejector. The two sidewalls extend from opposite sides of the baseboard. The ejector includes a side plate, a handle, and a tab. The side plate is positioned in proximity to a first sidewall of the two sidewalls of the component carrier. The handle extends from a first end of the side plate in a first direction that is generally perpendicular to the side plate. The tab is positioned in proximity to the baseboard, and extends from a second opposing end of the side plate in a second direction that is generally perpendicular to the side plate and opposite to the first direction, the tab coupled to a first connector extending from the baseboard. The baseboard includes a first opening such that a portion of the tab of the ejector is configured to directly contact the electronic component therethrough.