A heat dissipation assembly and an electronic assembly, wherein the heat dissipation assembly includes condensers and fan, the condensers each include first chamber body, second chamber body, and pipes. Two opposite ends of each pipe are respectively in fluid communication with the first and second chamber bodies, every two of the pipes located adjacent to each other define a heat dissipation gap therebetween. The first and second chamber bodies and the pipes together define a heat dissipation channel which is in air communication with the heat dissipation gaps. The fan is disposed on the condensers and in air communication with the heat dissipation channel and configured to guide an airflow flowing through the heat dissipation channel and the heat dissipation gaps so as to cool the working fluid flowing through the pipes.

A scalable graphics card assembly support system for a desktop chassis comprises an end support for coupling to an end of a graphics card assembly and a side support for coupling to a side of the card assembly. The side support can be coupled to any of several positions in a retention guide and the end support may couple to the card assembly or an extension coupled to the graphics card assembly, allowing the graphics card assembly support system to support graphic card assemblies of different lengths, widths and thicknesses. The graphics card assembly support system couples to one or more selected points within the chassis such that a chassis panel can be easily removed for servicing the information handling system. Cable parking connectors and conduit couplers provide better cable and conduit management for a more aesthetically pleasing appearance of an information handling system in the chassis.

A heat dissipation device of server cabinet heat dissipation device of server cabinet, comprising an outer case and a plurality of heat dissipation devices, the outer case is provided with a plurality of vents on one side, and a plurality of fans are installed on the other side, each of the heat dissipation devices is installed in the outer case, and each of the heat dissipation devices has an included angle toward each of the vents or the directions of the fans, so that the wind can pass through continuously after the fans are activated. Each of the heat dissipation devices is directly discharged after that. Since the heat dissipation devices do not overlap on the air circulation path, even if there is more than one heat dissipation device, it can still ensure that there is no temperature difference between each air, so that the heat dissipation effect is better so as the effect of stabilizing the overall heat dissipation temperature.

Apparatuses, systems, and methods to move end connectors. In at least one embodiment, a linkage system to move an end connector between at least a first position and a second position is driven by an actuator in a first direction to drive movement of the end connector in a second direction, perpendicular to the first direction.

In some examples, the disclosure describes a device that includes heat generating devices, a fan, and a processor to: determine a temperature within an area of the heat generating devices, activate the fan in a pulse width modulation (PWM) mode in response to the temperature being above a temperature threshold, activate the fan in a direct current (DC) mode in response to the temperature being below the temperature threshold.

Techniques for fan mechanisms with adjustable side vents are disclosed. In one embodiment, a fan housing has several side vents that can direct airflow to components around the fan housing. Vent covers can block the vents, directing the airflow to the primary vent and the heatsink for the processor and other components. When the speed of a fan in the fan housing is increased, the vent covers open, directing airflow to components around the fan housing. In another embodiment, several vent channels are defined in the vent housing. A motor connected to a vent barrier can move the vent barrier to block or unblock the vent channels, allowing for control of airflow. In another embodiment, a fan channel module with one or more vent channels can be attached to the fan housing, allowing for a flexible array of airflow patterns for the same fan housing.

A multi-parameter patient monitoring device rack can dock a plurality of patient monitor modules and can communicate with a separate display unit. A signal processing unit can be incorporated into the device rack. A graphics processing unit can be attached to the display unit. The device rack and the graphic display unit can have improved heat dissipation and drip-proof features. The multi-parameter patient monitoring device rack can provide interchangeability and versatility to a multi-parameter patient monitoring system by allowing use of different display units and monitoring of different combinations of parameters. A dual-use patient monitor module can have its own display unit configured for displaying one or more parameters when used as a stand-alone device, and can be docked into the device rack when a handle on the module is folded down.

Some embodiments include a high voltage pulsing power supply. A high voltage pulsing power supply may include: a high voltage pulser having an output that provides pulses with an amplitude greater than about 1 kV, a pulse width greater than about 1 μs, and a pulse repetition frequency greater than about 20 kHz; a plasma chamber; and an electrode disposed within the plasma chamber that is electrically coupled with the output of the high voltage pulser to produce a pulsing an electric field within the chamber.

Systems, methods, apparatuses for fan type identification are disclosed. A predetermined pulse width modulation duty cycle is used to obtain a sequence of fan speeds from a fan over a time period. A fan type of the fan is determined based on the sequence of fan speeds.

The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.