A cooling system includes a diaphragm, at least one conductor layer disposed on the diaphragm, at least one dielectric film layer, and a controller. The controller is programmed to operate the cooling system in a contact mode and in a non-contact mode. In the contact mode, the diaphragm is controlled to oscillate at a first amplitude such that the conductor layer contacts the dielectric film layer. In the non-contact mode, the diaphragm is controlled to oscillate at a second amplitude such that the conductor layer does not contact the dielectric film layer while the diaphragm oscillates.

This disclosure describes systems for arranging racks within a data center for a smaller and/or more flexible footprint, more efficient and/or resilient cooling, and/or easier installation. In some examples, this disclosure describes a data center rack system that includes an aisle and a plurality of rack stations adjacent to the aisle. The aisle includes an aisle guidance track defining an aisle axis. Each rack station of the plurality of rack stations includes a station guidance track defining a station axis. The station guidance track is configured to receive a rack from the aisle guidance track and position the rack in the respective rack station at a rack angle formed between the aisle axis and the station axis that is less than 90 degrees.

A cooling module includes: a fan having a fan housing with an intake port and an exhaust port; a fin that faces the exhaust port of the fan; a heat pipe connected to a surface of the fin; and a plate-shaped vapor chamber having a first surface and a second surface, the heat pipe being connected to the first surface while straddling one edge of the vapor chamber, the second surface at the one edge being connected to the surface of the fin to be parallel with the heat pipe, so that the one edge is disposed between the heat pipe and the fin.

An electronic apparatus includes: a chassis; a first and a second heat generating elements which are placed with a step between surfaces thereof; and a cooling module that absorbs heat generated by the first and the second heat generating elements. The cooling module has: a first heat pipe having a first surface thereof connected to a surface of the first heat generating element; a plate-shaped vapor chamber having a first surface thereof connected to a surface of the second heat generating element and a second surface of the first heat pipe; a second heat pipe which is connected to a second surface of the vapor chamber and overlaps the second heat generating element; a first fin connected to the first heat pipe; and a second fin connected to the second heat pipe.

The application discloses a power supply device, including: a circuit board having a first side and a second side opposite to each other, the circuit board at least mounted with a first heating element disposed close to the second side; a fan disposed on the first side of the circuit board for providing an air-cooled airflow for heat dissipation, wherein an airflow direction is defined from the first side to the second side; a first airflow guide member disposed in parallel to the first heating element; and a second airflow guide member at least partially disposed above the first heating element, and adjacent to the first airflow guide member, wherein the first airflow guide member, the second airflow guide member and the first heating element form a first auxiliary air channel; wherein a direction of the first auxiliary air channel is the same as the airflow direction.

Fracturing equipment includes an electric-driven apparatus and an electric-power supply apparatus. The electric-driven apparatus includes at least one motor, at least one lubrication module, and at least one heat dissipation module. The electric-power supply apparatus includes a first electric-power supply and a second electric-power supply, where the at least one motor is powered by the first electric-power supply, and the at least one lubrication module and the at least one heat dissipation module are powered by at least one of the first electric-power supply or the second electric-power supply.

An external function extension device includes a casing, a transition circuit board, a liquid cooling system, at least one connecting member and a power supply unit. The transition circuit board, the liquid cooling system and the power supply unit are disposed in the casing. The transition circuit board has a transition slot. The connecting member is connected to the liquid cooling system. The connecting member is used for connecting an external device, such that the liquid cooling system performs liquid cooling function for dissipating heat of the external device. The power supply unit is electrically connected to the transition circuit board and the liquid cooling system. The power supply unit includes an electric connector. The electric connector is used for connecting the external device, such that the power supply unit supplies power to the external device.

A fluid flow system is described. The fluid flow system includes an actuator and a chamber having a feature therein. The actuator is configured to vibrate in response to a driving signal. The chamber is in communication with the actuator. The chamber is characterized by a fluidic resonant frequency. Vibration of the actuator tends to drive a fluid through the chamber. The feature is within the chamber and obstructs direct flow of the fluid within the chamber such that the fluidic resonant frequency is less than a nominal fluidic resonant frequency that would exist without the feature.

A server system is described. The server system includes a vapor chamber in thermal communication with a plurality of heat sources and an array of microelectromechanical system (MEMS) jets arranged to cause a fluid to impinge on a surface of the vapor chamber.

An Electro Hydro Dynamic, EHD, thruster (105) comprising a first set of electrodes (210), a second set of electrodes (220) and a supporting structure (103) for supporting the first set of electrodes (210) and the second set of electrodes (220). The EHD thruster (105) is configured to generate airflow of ionized air for cooling a heat sink (101). Further, the EHD thruster (105) is electrically isolated from the heat sink (101).