In one or more embodiments, a fan circuit may be configured with an input of a first amplifier coupled to a revolution indicator associated with a fan; an output of the first amplifier coupled to an input of a second amplifier; and a power supply input of the second amplifier coupled to a first contact of a first connector. In one or more embodiments, the first contact of the first connector may be coupled to a first contact of a second connector to drive a resistive load coupled to the first contact of the second connector; a second contact of the first connector may be coupled to a second contact of the second connector to provide a reference voltage to the second amplifier; and the second amplifier may provide amplified signals to the first contact of the first connector based at least on signals received from the revolution indicator.

A fan receiver assembly (1200) includes a fan receiver (101). The fan receiver includes a rear wall (128) and at least one sidewall (112). At least one deformable clasp (105) is coupled to, and translatable along, the sidewall. The deformable clasp includes at least one latching arm (142) that is pivotable between an axially displaced open position occurring when the latching arm extends beyond a terminal end sidewall and a parallel position occurring when the latching arm is situated between the terminal end and the rear wall. The sidewall defines a d-track (111) having a terminal end (125) and an outward notch (126). A follower situates within the d-track between the deformable clasp and the sidewall. A fan module (102) latches to the fan receiver assembly when the follower situates within the outward notch.

An imaging device includes an imaging main body; a fan accommodation portion provided in an upper portion of the imaging main body; and a cooling fan disposed in the fan accommodation portion, wherein the fan accommodation portion includes an upper surface, a pair of side surfaces, and a front surface that cover the cooling fan, and an intake port and an exhaust port for the cooling fan to perform intake and exhaust are provided on a surface of the fan accommodation portion different from the upper surface.

A fan cage, a fan module, and an electronic device are provided, where the fan cage includes a cage body having two surfaces and at least two ventilation ports and a latching mechanism arranged at the cage body, the two surfaces are located opposite to each other, the two ventilation ports are respectively located at the two surfaces, the latching mechanism is arranged at the cage body and comprises at least one latch movably protruding outwardly from one of the two surfaces.

Methods and apparatus to manage noise in computing systems are disclosed. An example server includes a housing to at least partially contain components of the server, a transducer to output an indication of noise detected outside of the housing, machine readable instructions, and programmable circuitry to at least one of instantiate or execute the machine readable instructions to adjust the operation of the server based on the output of the transducer to reduce noise.

The present application discloses a sound absorbing device to be placed in an airflow that is in a first direction. The sound absorbing device includes a housing; a plurality of sound absorbing units disposed in the housing to be passed by the airflow, the plurality of sound absorbing units being arranged in a direction perpendicular to the first direction, any two adjacent sound absorbing units being separated by a gap; and a plurality of supports fixed in the housing. The plurality of sound absorbing units are fixed to the housing through the plurality of supports.

A fan and an electronic device are provided. The fan includes a hub, an outer frame surrounding the hub, and a plurality of blades connected between the hub and the outer frame. The outer frame includes a first side facing an air inlet of the fan, a second side facing an air outlet of the fan, and an inner wall between the first side and the second side. Each of the plurality of blades includes a first end connected to the hub and a second end connected to the outer frame. The second end includes a first region and a second region, the second region is connected to the inner wall. The first region extends from the second region and is disposed above the first side. A first notch is defined among the first regions of two adjacent blades and the first side.

A thermal management system includes an ionic motion generator to direct fluid flow towards a heated component (e.g., equipment to be cooled or a heatsink mounted thereat). In certain systems, the fluid is directed through a conduit arrangement. In certain systems, the fluid is directed past the heated component to a heat exchanger. Certain types of thermal management systems have no moving components to create the fluid flow.

Information handling system (IHS) component immersion cooling systems and methods may employ a cold plate disposed on one or more IHS components of an IHS disposed in an immersion cooling tank and an immersible immersion fluid pump adapted to be deployed in the immersion cooling tank, the immersible immersion fluid pump in fluid flow communication with the cold plate, directing flow of immersion fluid in the immersion cooling tank to the cold plate. The immersible immersion fluid pump may be disposed on the cold plate or in an equipment bay of the IHS. A manifold may distribute flow from first and/or second immersible immersion fluid pump(s) to first and second cold plates. Power, etc. may be provided to the immersible immersion fluid pump via (a) fan connection(s) provided by the IHS. Tubing may extend from an outlet of the cold plate away from other components of the IHS.

A set of electronic package elements intended to be mounted on an electronic board having a component to be cooled including: a chassis, a heatsink fixed by a retaining piece inside the chassis, a cover configured to be fixed on the chassis so as to retain the electronic board in the package. The heatsink is configured to be fixed on the electronic board while maintaining a predetermined distance between a lower face of the heatsink and the component. The cover is configured to be able to be fixed by a fixing point to the heatsink. The retaining piece is connected to the heatsink so as to allow the heatsink a translational movement relative to the chassis in three orthogonal directions.