A cooling device for use with circuit interrupters includes a housing structured to be coupled to a terminal of the circuit interrupter and formed with several ventilation openings, as well as a permanent magnet, a torque converter and a fan blade all contained within the housing. When the cooling device is coupled to a terminal of a circuit interrupter and current flows through the terminals of the circuit interrupter, parasitic magnetic fields are generated and induce oscillatory motion of the permanent magnet. The torque converter is coupled to the permanent magnet and converts the oscillatory motion of the magnet to rotational motion that rotates the fan blade. The fan blade is disposed near the ventilation openings of the housing so that air flow produced by rotation of the fan blade travels across the surface of the circuit interrupter terminal nearest the ventilation openings to increase convection.

A cooling system including a support structure and a cooling element are described. The cooling element has a central region, a first cantilevered arm, a second cantilevered arm, and a piezoelectric. The cooling element is supported by the support structure at the central region. The piezoelectric extends across at least half of a length of the first cantilevered arm. The first and second cantilevered arms are configured to undergo vibrational motion when actuated to drive a fluid toward a heat-generating structure.

A gantry for a computed tomography device has a support structure, a pivot bearing, a rotating frame, a first braking resistor configured to electromotively brake a rotational movement of the rotating frame, and a heat conductor configured to dissipate heat from the first braking resistor. A heat conductor and a pressure duct wall are interconnected to form a heat-conductor-to-pressure-duct-wall connection that is detachable, form-fitting, planar, and thermally conductive. The heat is transferrable from the first braking resistor to the airflow via the heat conductor, the heat-conductor-to-pressure-duct-wall connection and the pressure duct wall.

A single rail control system with receiver modules associated with a motherboard of a personal computer and a power supply, comprises a transmitter module, a connector module, and at least one receiver module. One of the first microcontrollers of the transmitter module is controlled by the motherboard or software running on the system/CPU. The connector module is associated with the transmitter module, the power supply, and the receiver module. The connector module is able to be connected in series to increase the number of the receiver module. The receiver module is able to simultaneously receive the control instruction of the first microcontroller and the power provided from the power supply through the connector module, so that a plurality of RGB LEDs are controlled by one of the second microcontrollers of the receiver module to emit light to the outside. Since the receiver module does not require additional power cables, the unnecessary wires can be effectively reduced.

The present invention provides a heat management arrangement for an electronic device, in particular for a handheld electronic device. The heat management arrangement comprises an active cooling means comprising a heat sink and at least one airflow channel configured for convective heat transport to an environment by an airflow. Furthermore, the heat management arrangement comprises a passive cooling means configured to be arranged between the heatsink and a surface of the electronic device and comprising a highly heat conductive substance. The passive cooling means is configured to contact the surface of the electronic device and to enhance heat conduction between the surface of the electronic device and the heat sink. In addition or alternatively, the passive cooling means is configured to enhance heat conduction between the surface of the electronic device and the airflow channel. Furthermore, the invention provides a corresponding method of manufacturing such a heat management arrangement on an electronic device and a corresponding electronic device.

A series fan frame body structure includes a first fan frame body, a second fan frame body and a serial connection frame body. The serial connection frame body has a first opening and a second opening. The first and second openings arranged in nonparallel to each other. The first and second fan frame bodies are respectively disposed at the first and second openings. The first and second fan frame bodies are inclined from each other. The first and second fan frame bodies are serially connected in a nonparallel form. Therefore, in the system, due to the resistance of the structure with such configuration, the audio frequency dipole structure is destructed so that the periodical noise and vibration characteristic are lowered.

A frequency changer cabinet includes a transformer cabinet to accommodate a transformer, a first air outlet being disposed at a top of the transformer cabinet, and a first air inlet being disposed at a side wall; and a power unit cabinet to accommodate at least one power unit, a second air inlet being disposed at a front side wall, and a rear side of the being connected to the transformer cabinet. In an embodiment, a first air passage baffle and a second air passage baffle are respectively disposed at an upper end and a lower end of a secondary coil, such that air entering from the power unit cabinet to the transformer cabinet can be directly sent to the secondary coil. Further, air entering from the first air inlet can pass through a primary coil and the secondary coil, and then flow out of the transformer cabinet.

A fan assembly includes a socket to receive a fan module, a fan flap coupled to a first side wall of the socket, and an anti-reflow device coupled to a second side wall of the socket. The fan flap moves in a curved path between a first position and a second position. The anti-reflow device has an attachment feature, an embossed feature, and a stopping feature. The attachment feature attaches the anti-reflow device to the second side wall. The embossed feature extends through a first aperture in the second side wall. The stopping feature extends through a second aperture in the second side wall and contacts the fan flap. When the fan module is removed, the stopping feature retains the fan flap in the first position to block the socket and prevent air from reflowing through the socket.

Several transportable datacenters are described. The transportable datacenters include transport systems allowing them to be transported between an assembly location and an operating location. The transportable datacenters also include a ventilation system for cooling processors positioned in racks in the datacenters. The ventilation system draws cold air from the environment, through processor bays containing the processors and then exhausts the air back to the environment.

A heat exchanger package for a dry-type transformer is provided. The heat exchanger package includes a package housing including an air inlet and an air outlet and adapted to fix to the dry-type transformer; and a first heat exchanger located in the package housing and between the air inlet and the air outlet, the first heat exchanger arranged at a first angle of inclination with respect to a first inner surface of the package housing.