This document describes a cooling device for cooling a heatsink having a plurality of cooling fins provided on a heatsink base. The cooling device includes a centrifugal fan having a fan inlet and a fan outlet, a support for mounting the fan above the heatsink, and a baffle locatable between the support and the heatsink base. The baffle defines an inlet pathway for feeding air between the cooling fins over the heatsink base to the fan inlet and an outlet pathway for expelling air from the fan outlet.

A heat dissipation device includes a case, a first board, a second board, a curved supporting structure, and a fan. The first board is disposed in the case. The curved supporting structure has a curved slot which is located on an inner surface of the curved supporting structure, and the curved slot extends radially with respect to a center of the curved supporting structure. The second board is inserted in the curved slot, and the first board, the second board, and the curved supporting structure collectively form an accommodating space. The fan is fixed to the second board and disposed within the accommodating space.

Various embodiments of an adapted cooling system for a printer are disclosed herein. The adapted cooling system includes a panel for installment along a housing of the printer and further includes a manifold that couples a more powerful fan to the printer.

Tool-less apparatus and methods are provided for sealing flow of cooling air from the outlet of a cooling fan blower to the inlet of a heat exchanger within a chassis enclosure of an information handling system. The disclosed apparatus and methods may be implemented in a tool-less manner by employing tool-less chassis mounting features that mate with tool-less cooling fan mounting features to mechanically align and secure an air outlet of a cooling fan blower in sealing relationship with an air inlet of a heat exchanger within a chassis enclosure of an information handling system by properly aligning the axes of a cooling fan in relation to the inlet of the heat exchanger so that in on embodiment no gap exists between the cooling air outlet of the cooling fan and the cooing air inlet of the heat exchanger.

A thermal module with a heat pipe configured with a first portion configured for contact with an edge of a plurality of fins in a fin stack, a second portion configured for contact with a side of one fin in the fin stack and a sharp angled bend is formed between the first portion and the second portion to fluidly isolate the first portion from the second portion. The first portion comprises a usable length of the heat pipe that efficiently transfers heat based on phase transitioning by the fluid. The second portion is formed from at least some of the unusable length of the heat pipe. By configuring the heat pipe such that more fins contact the usable length of the heat pipe, heat transfer from the heat pipe to the fin stack is increased.

A system and method for cooling components and a chassis in a portable information handling system includes a pressure barrier that divides the chassis into a plurality of zones, an evacuative fan in a first zone to generate airflow across components to cool the components and a hyperbaric fan in a second zone to increase air pressure in the second zone. The pressure barrier may provide thermal isolation, acoustic dampening and electromagnetic insulation. A controller communicatively coupled to the fans can operate each fan independently to cool components for improved performance and maintain a surface temperature of the chassis below a temperature for user comfort.

The invention provides a chassis structure, a server, and a method of dissipating heat from server. The chassis structure comprises chassis body, two fan components, two tray components, and a power supply. The chassis body defines a receiving space bounded by two spaced partitions, the two partitions divide the receiving space into a middle cavity and two side cavities. The fan components are at one end of each side cavity and are connected to the chassis body. The two tray components carry slots for inserting hard disks. The power supply is arranged in the middle cavity and supplies power to the hard disks inserted in the slots, the power supply also has a fan, the power supply positioned at one end of the middle cavity.

An electronic apparatus cooling device is provided with a water-cooling cold plate unit that is disposed in contact with a heat-generating element and that cools the heat-generating element directly by means of a liquid refrigerant that circulates in an inner flow path; an air-cooling fin disposed adjacent or in proximity to the water-cooling cold plate unit and having a fin tube through which the liquid refrigerant is circulated; and a refrigerant supply means that supplies the liquid refrigerant to the inner flow path of the water-cooling cold plate unit and to the fin tube in the air-cooling fin in a distributed manner.

A heat dissipation module and a dynamic random access memory device are provided. The heat dissipation module includes a main body, a fan, and an electrical connection component. The main body is fixedly disposed on a substrate of a memory component that includes a dynamic random access memory. The main body includes a receiving through-hole, a plurality of guide through-holes, and a plurality of exhaust through-holes. The fan is fixedly disposed on the main body and configured to allow air outside the substrate to enter the substrate through the receiving through-hole and the guide through-holes, and the air entering the substrate through the receiving through-hole and the guide through-holes is discharged outwardly through the exhaust through-holes. The electrical connection component is configured for an external power supply module to supply power to the fan.

Some embodiments include a thermal management system for a nanosecond pulser. In some embodiments, the thermal management system may include a switch cold plates coupled with switches, a core cold plate coupled with one or more transformers, resistor cold plates coupled with resistors, or tubing coupled with the switch cold plates, the core cold plates, and the resistor cold plates. The thermal management system may include a heat exchanger coupled with the resistor cold plates, the core cold plate, the switch cold plate, and the tubing. The heat exchanger may also be coupled with a facility fluid supply.