A modular cooling system includes a fluid pump in fluid communication with one or more cooling elements to cool electronics components; a heat exchanger in fluid communication with the fluid pump; a heat exchanger valve upstream of the heat exchanger; and a fluid supply valve positioned between a cooling fluid supply and the one or more cooling elements. When the heat exchanger valve and the fluid supply valve are in a first position, fluid is directed from the cooling fluid supply to the one or more cooling elements, bypassing the heat exchanger and the fluid pump. When the heat exchanger valve and the fluid supply valve are in a second position, fluid is cut off from the cooling fluid supply and a cooling fluid return and circulated through the heat exchanger and the fluid pump.

Apparatuses and methods are provided for blocking removal of an air-moving assembly from a housing when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the housing, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

Provided are devices and methods relating to temperature control in a solid state drive (SSD). A SSD (10, 110, 210, 310, 410, 510, 610, 710) including a housing (12, 112, 212, 312, 412, 512, 612, 712) including a plurality of sides surrounding an interior region. The SSD (10, 110, 210, 310, 410, 510, 610, 710) includes at least one vent (14, 114, 214, 314, 414, 514, 614, 714) on the housing (12, 112, 212, 312, 412, 512, 612, 712), the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) configured to be opened and closed in response to a signal. The SSD (10, 110, 210, 310, 410, 510, 610, 710) also includes a temperature sensor and a controller, the controller configured to send a signal to open the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a first temperature, and the controller configured to close the at least one vent (14, 114, 214, 314, 414, 514, 614, 714) when a temperature sensed inside the interior region reaches a second temperature, wherein the first temperature is greater than the second temperature.

A fan module includes a fan body and metal plates. The fan body has a fan seat, and the fan seat is provided with coupling holes. The metal plates enclose the fan body and expose an outlet side. The position assembly includes a position frame and position members. The position frame has an air outlet and is fixed on the outlet side. The airflow shielding structure includes shutter plates and a connection rod. One side of the shutter plates are pivoted at the position frame, and the shuttle plates are capable of turning simultaneously for opening and closing the air outlet so as to maintain the normal operation of the server fan.

Cooling arrangement of data center configured for backup operation, the arrangement including an active cooling system having: fluid cooling systems. The arrangement further including an intake louvers assuming a closed position separating interior space of the data center from the exterior environment during normal mode of operation and an open position enabling free flow of outside air into the interior space during backup operation; exhaust louvers assuming a closed position separating interior space of the data center from the exterior environment and an open position enabling free flow of interior air out to the exterior environment; and controller configured to direct the intake louvers and exhaust louvers to assume the open position when electrical power supply to the active cooling system has been interrupted. The arrangement further includes a fluid system which functions as an open loop in the normal mode and a closed loop in the backup mode.

In one embodiment, a method includes initiating a protection mode at a network device having a protective cover installed to filter airflow entering a network device, reducing one or more of a fan speed, processing functions, or power at the network device, exiting the protection mode upon removal of the protective cover from the network device, and increasing one or more of the fan speed, the processing functions, or the power to resume normal operation at the network device.

The present invention is a directed to an integrated ionic air mover that provides air flow rates through an opening within the a printed circuit board (PCB), or other similar insulating surface, to create the structure of the air mover, so that high heat generating components mounted on the PCB can be cooled. The ionic air mover has sharp and blunt electrodes with a corona discharge taking place in the air gap in between the electrodes. A directional emission of the ions creates an ionic wind the moves air through the PCB. The invention provides a low-cost structure, while achieving high electro-air flow power conversion efficiency and air-flow performance integrated into the PCB that the heat generating components are mounted on. The ionic air mover may also be surface mounted to a PCB and include a transmittal coil for wireless charging.

A cooling system for a plurality of heat-generating components in a chassis of an information handling system includes an array of fans, each fan operable to generate an airflow in a range of airflows, and a control system configured to monitor temperatures for the components and adjust a direction of one or more airflows based on the component temperatures. If a component temperature gets too high for a first fan associated with the component to cool the component, a portion of a second airflow generated by a second fan may be directed to provide additional airflow to the component such that the component is cooled without increasing the fan speed of the first fan. Adjacent fan speeds may also be adjusted to reduce losses due to differences between adjacent airflows.

Examples of a louver assembly for computer case ventilation are described. In some examples, a computer case may include a substructure with vents to allow air intake into the computer case. The computer case may also include louvers attached to the substructure. The vents may be positioned on the substructure such that the louvers occlude visibility into the computer case through the vents from every angle of view outside the computer case.

Disclosed is an electrical cabinet with associated air flow direction and heat separation control system. The cabinet has a front, rear, a first side and a second side. The front side has openings to accept flow of cool air into the cabinet and the rear side has openings for exit of warm air from the rear side of the cabinet. The front, rear, first side and second side define an interior space are configured to house heat generating electrical equipment. A frame is adjacent the rear side of the cabinet. The frame has a first frame side and a second frame side. Louvers are located adjacent the rear of the cabinet. The louvers extend between the first frame side and the second frame side. Each louver has a face positioned at an angle to direct the warm air exiting the cabinet other than perpendicular to the rear of the cabinet. A first compartment for storing heat generating equipment is positioned above or below a thermally separated second compartment for storing heat sensitive equipment.