H05K7/20418

HEAT SINK ASSEMBLY FOR ELECTRONIC EQUIPMENT
20220011056 · 2022-01-13 ·

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes fins and a mating surface positioned at a base of the fins. The TIM includes a first surface that is coupled to the mating surface of the heat sink and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a rotational cam. When the rotational cam is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the rotational cam moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

HEAT DISSIPATION STRUCTURE
20210348857 · 2021-11-11 ·

A heat dissipation structure includes primarily plural cooling fins. A flow space for air flow is defined between every two cooling fins, and at least a through-hole which is connected with the flow space is defined on each cooling fin. Therefore, the air speed can be increased, so that heat will not be accumulated easily and can be removed out rapidly, thereby improving the heat removal efficiency of the heat dissipation structure. In addition, as each cooling fin is provided with plural through-holes, the weight of entire finished product can be decreased indirectly.

HEAT DISSIPATION FROM ACTIVE DEVICES CONNECTED TO CONNECTORS
20220007493 · 2022-01-06 ·

An assembly comprising a connector board having a front side and a back side, a connector mounted to the connector board, the connector having a mating end extending outwardly from the front side of the connector board, and a heatsink extending outwardly from the back side of the connector board and aligned with the connector, the heatsink comprising a plurality of fins extending parallel to the connector board for drawing heat through the connector from the front side to the back side of the connector board.

Connector assembly

The present disclosure provides a connector assembly comprising a cage and a heat sink. The cage has a receiving space and a wall constituting the receiving space, the wall is formed with a window which is communicated with the receiving space and two latching plates which are provided to two sides of the window and extend away from the receiving space, each latching plate is integrally formed with a latching protrusion, the latching protrusion has a guiding portion and a latching portion, a protruding amount of the guiding portion from the latching plate gradually increases as a distance of the guiding portion from the receiving space decreases, the latching portion is positioned to a tip end surface of the guiding portion. The heat sink has a base plate, in a process that the heat sink is assembled to the cage, the base plate pushes against the guiding portions of the latching protrusions of the two latching plates to make the two latching plates elastically move, after the base plate passes over the guiding portions of the latching protrusions of the two latching plates, the latching portions of the latching protrusions of the two latching plates latch with the base plate.

CLIP-ON DIELECTRIC THERMAL DISSIPATION FINS

In accordance with at least one aspect of this disclosure, a system includes a heat sink. In embodiments, the heat sink can include, a fin body, having a first face and a second face, one or more fins extending vertically from the fin body, and a clip disposed on one of the first face and/or the second face configured to attach to a heat generating component of a LRU to dissipate heat energy from the heat generating component of the LRU to an ambient environment. In embodiments, the heat generating component can include a bus bar, for example.

Connector assembly with movable heat sink
11784434 · 2023-10-10 · ·

A connector assembly is provided and includes a guide shielding cage and a heat sink module. The guide shielding cage has at least one insertion space positioned inside. The heat sink module includes a heat dissipating member, a pressure applying elastic member, a lever member and a supporting elastic member. The heat dissipating member has a thermal coupling portion formed downwardly, the lever member is pivoted to the guide shielding cage, the lever member has a pushed end and a pressure applying end, the supporting elastic member upwardly and elastically supports the heat dissipating member. The heat dissipating member is capable of moving between a releasing position which is higher relative to the insertion space and an acting position which is lower relative to the insertion space and where the thermal coupling portion enters into the insertion space.

SYSTEM AND METHOD FOR MAINTAINING EFFICIENCY OF A HEAT SINK
20230332851 · 2023-10-19 ·

A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

ARRANGEMENT FOR COOLING A POWER MODULE, AND POWER MODULE

An arrangement for cooling a power module with at least one power unit in a housing is provide, the arrangement having at least one heat sink, in which the arrangement for cooling has at least one heat-sink cover, and at least a part of the power module, in particular the housing, at least a part of the heat sink and/or at least a part of the heat-sink cover are/is configured in such a way that, after attachment of the heat-sink cover, the heat sink is fixed in the housing, in particular by way of clamping, through interaction of the configuration of heat sink, heat-sink cover and/or housing. Also, a power module having such an arrangement for cooling a power module is provided.

WELDING-TYPE POWER SUPPLIES WITH EXPANDABLE THERMAL INTERFACES
20230301041 · 2023-09-21 ·

Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.

Load Vectoring Heat Sink
20230301029 · 2023-09-21 ·

A heat sink includes multiple load points and a plurality of load cell for each of the load points. Each of the load cells is configured to attach to a respective attachment point on a component and to create a tensile load between the respective attachment point of the component and a respective one of the load points of the heat sink. At least one of the load cells is configured to produce a different maximum tensile load than another load cell among the plurality of load cells.