A heat dissipation structure is disclosed that is especially well-suited for use on aerodynamic systems. The heat dissipation structure is formed within a metallic body that surrounds the heat-generating electronics. The heat dissipation structure is designed to both dissipate the generated heat and also to isolate RF cross-talk between the one or more transmitters and receivers. The heat dissipation structure includes a plurality of ring structures that extend around at least a portion of a body that houses the one or more heat-generating electrical components. The plurality of ring structures may be recessed into the body, and a first spacing between a first adjacent pair of ring structures of the plurality of ring structures is different from a second spacing between a second adjacent pair of ring structures of the plurality of ring structures.

A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.

The disclosure provides a portable electronic device, including: a housing, a heat dissipation component, a bracket, a cover structure, and a plurality of pivotal linkage rods. The housing includes a heat dissipation opening. The heat dissipation component is disposed in the housing and corresponds to the heat dissipation opening. The bracket is disposed in the housing and encloses the heat dissipation component. The cover structure is configured to move between a close position covering the heat dissipation opening and an open position exposing the heat dissipation opening. Each of the plurality of pivotal linkage rods is pivotally connected between the bracket and the cover structure, and is configured to be driven to rotate, to drive the cover structure to move between the close position and the open position.

The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.

A heat exchanger system may have a base, a mounting apparatus for attaching the base to a device, a gasket shelf for placing a gasket, a dissipation member for dissipating heat, and heat generator attachment sites for absorbing heat. A mounting apparatus may have finger-like extensions which flex and draw the base into contact with an underlying electronic device from which the system conducts heat. A base may also have an integrated heat pipe clamp attachment forming an aperture in the base into which a heat pipe may extend and may be clamped in thermal communication. The dissipation device may be a series of fins and troughs and a fan may direct air over the dissipation device to cool the apparatus.

An IC socket includes: a socket main body having an accommodating part for accommodating an IC package; a socket cover having a one-side end portion pivotally supported by the socket main body, and the other-side end portion which is located opposite to the one-side end portion and lockable to the socket main body; and a heat dissipating member mounted on the socket cover and caused to press the IC package. The socket cover includes a metal plate extending from the one-side end portion to the other-side end portion so that the thickness direction of the metal plate is parallel to the direction in which the socket cover faces the accommodating part when the other-side end portion is locked to the socket main body. The metal plate has a depression formed by bending the metal plate.

A heat dissipating antenna comprised of a low-attenuating heat spreader bonded to a high frequency antenna or antenna array.

An integrated circuit with a wireless integrated circuit chip, and a heat dissipating antenna coupled to the wireless integrated circuit chip. A method of forming a heat dissipating antenna.

A power converter for a railway vehicle includes a power converter body configured to be installed on the railway vehicle; a first radiating fin unit arranged on a front side on the power converter body for dissipating heat from the power converter body; a second radiating fin unit arranged on the power converter body on a rear side for dissipating heat from the power converter body; and an air duct that takes in air from a region other than regions in which the first and second radiating fin units are disposed while the railway vehicle is moving, the air duct extending into a fin separation space that is defined as a space between the first radiating fin unit and the second radiating fin unit so as to guide air that is taken in into the fin separation space.

A heat sink apparatus that utilizes a pivot couple and support with anchor-spring mounts to enable exertion of a uniform amount of force over the mounting surface of the apparatus that is thermally/physically coupled to a heat load. The apparatus can include a heat sink base that has a bottom side defining the mounting surface, and a top side to which a support is pivotally coupled by a pivot couple. The apparatus can include a first and second anchor that each have a first end connected to an anchor point and a second end coupled to a load surface on the support by a spring. The load surfaces can be symmetrically disposed on opposite sides of the pivot couple, which is centrally located relative to the mounting surface so that the force imparted by spring loads of the springs is evenly distributed over the mounting surface.

The present invention relates to a housing of an electric/electronic equipment, such as a luminaire, terminal box, control device, switching distributor or the like, comprising at least one lateral surface facing the surroundings. In order to improve a housing of said type in such a way that a sufficient strength of the housing is given, even with a comparatively small material thickness, and such that also additional measures for cooling can be dispensed with, a plurality of impact dampers that protrude at least from the lateral surface are arranged on said lateral surface.