A cooling device includes: an electronic component; a circuit board on which the electronic component is mounted; and a heat sink provided to dissipate heat to an outside of the cooling device. The cooling device also includes: a graphite sheet integrally provided on a surface of the heat sink on one side facing the electronic component; a heat conductive portion contacting both a part of the graphite sheet and the electronic component; and a shielding portion. The shielding portion is provided at a position between a portion of the circuit board where no electronic component is mounted and the graphite sheet to cover a shielded surface of the graphite sheet.

A connector includes a cage and a heat-radiation element. A top wall of the cage includes an opening, and first engaging structures extending from the top wall of the cage toward an outside of the cage at a periphery of the opening. The heat-radiation element is disposed on the cage corresponding to the opening, and first notches corresponding to the first engaging structures are disposed on side walls of the heat-radiation element. Each first engaging structure passes through the corresponding first notch to engage the heat-radiation element on the cage. The cage has a receiving cavity and supporting structure at a bottom of the receiving cavity. When a mating connector is inserted into the receiving cavity, a bottom of the mating connector is supported by the supporting structure, a top of the mating connector abuts against the heat-radiation element through the opening, and the heat-radiation element remains substantially stationary.

A power module includes a case defining an accommodation space, and a baseplate having a circuit pattern, the baseplate being coupled to the case such that the circuit pattern is within the accommodation space. The power module further includes a plurality of power elements on the circuit pattern and electrically connected to the circuit pattern, and a shielding member above the power elements to shield electromagnetic interference of the power elements, with the shielding member being grounded. Moreover, the power module includes an encapsulating material within the accommodation space, with the encapsulating material covering at least the circuit pattern and the power elements. Additionally, the power module includes a cooling member coupled to the baseplate on a side of the baseplate further from the case.

A connector assembly is provided and includes a guide shielding cage and a heat sink module. The guide shielding cage has at least one insertion space positioned inside. The heat sink module includes a heat dissipating member, a pressure applying elastic member, a lever member and a supporting elastic member, the heat dissipating member has a thermal coupling portion formed downwardly, the pressure applying elastic member is provided at a side face of the heat dissipating member, the lever member is pivoted to the guide shielding cage, the lever member has a pushed end which is used to be pushed and a pressure applying end which is used to downwardly apply a pressure to the pressure applying elastic member, the supporting elastic member upwardly and elastically supports the heat dissipating member. The heat dissipating member is capable of moving between a releasing position which is higher relative to the insertion space and an acting position which is lower relative to the insertion space and where the thermal coupling portion enters into the insertion space.

A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

An apparatus is described. The apparatus includes a bolster plate having a first fixturing element and a strap. The strap is positioned along a frame arm of the bolster plate. The strap has a second fixturing element to be fixed to a cooling mass. The strap is to diminish movement of the cooling mass along the frame arm's dimension and a dimension that is orthogonal to the frame arm's dimension. A semiconductor chip package is to be placed in a window opening formed by the bolster plate's frame arms. The cooling mass is to be thermally coupled to the semiconductor chip package.

A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

The proposed design concerns RF shielding can that has the benefits of an RF can, but without compromising the thermal design of the system.

A micro-strand transceiver device heat dissipation system includes a transceiver device chassis, at least one transceiver component located in the transceiver device chassis, and micro-strand heat dissipator elements that are each positioned in the transceiver device chassis in a spaced apart orientation from the others of the micro-strand heat dissipator elements. Each of the micro-strand heat dissipator elements include a first micro-strand heat dissipator element portion that engages the at least one transceiver component, and a second micro-strand heat dissipator element portion that extends from the at least one transceiver component. The first micro-strand heat dissipator element portion on each of the micro-strand heat dissipator elements conducts heat generated by the at least one transceiver component to the second micro-strand heat dissipator element portion on that micro-strand heat dissipator element, which allows that heat to be dissipated.

An apparatus comprising: a heat sink; a heat spreader; a printed wiring board; a resilient bias means positioned between the heat sink and the heat spreader; and at least one retainer configured to force the heat sink towards the heat spreader against the resilient bias means and configured to force the printed wiring board towards the heat spreader.