A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.

A heat dissipation apparatus, a remote radio unit, a baseband processing unit and a base station are disclosed. According to an embodiment, the heat dissipation apparatus comprises a base and a plurality of first heat sink fins arranged in parallel on the base. On a top of each first heat sink fin of the plurality of first heat sink fins, a first heat dissipation component and a second heat dissipation component are sequentially arranged along the parallel direction of the plurality of first heat sink fins. The first heat dissipation component comprises a bottom plate and a plurality of second heat sink fins which are arranged at intervals along the parallel direction on a top face of the bottom plate. Each second heat sink fin has a shape of a comb having three or more comb teeth.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

Systems and methods are disclosed relating to welding-type power supplies. In some examples, the power supplies may have no vents, which may help prevent environmental contaminants from entering the power supplies. Instead, the power supplies include one or more thermal interfaces configured to conduct heat generated by internal circuitry of the power supply from the interior of the power supply to an exterior of the power supply. Additionally, the thermal interface(s) may be configured for attachment to one or more exterior heat dissipating devices.

A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.

A heat dissipation structure is disclosed that is especially well-suited for use on aerodynamic systems. The heat dissipation structure is formed within a metallic body that surrounds the heat-generating electronics. The heat dissipation structure is designed to both dissipate the generated heat and also to isolate RF cross-talk between the one or more transmitters and receivers. The heat dissipation structure includes a plurality of ring structures that extend around at least a portion of a body that houses the one or more heat-generating electrical components. The plurality of ring structures may be recessed into the body, and a first spacing between a first adjacent pair of ring structures of the plurality of ring structures is different from a second spacing between a second adjacent pair of ring structures of the plurality of ring structures.

An interconnect system includes a first circuit board, first and second connectors connected to the first circuit board, and a transceiver including an optical engine and arranged to receive and transmit electrical and optical signals through a cable, to convert optical signals received from the cable into electrical signals, and to convert electrical signals received from the first connector into optical signals to be transmitted through the cable. The transceiver is arranged to mate with the first and second connectors so that at least some converted electrical signals are transmitted to the first connector and so that at least some electrical signals received from the cable are transmitted to the second connector.

In one instance, a heat sink for thermal management of an electronic component includes a top plate and a base plate that is displaced from the top plate when in an assembled position. The base plate has a first side and a second side, and the second side is for thermally coupling to the electronic component. The heat sink also includes a plurality of fins each including a flat member formed with a plurality of pin apertures and a plurality of fastener apertures. A plurality of pins is disposed through the plurality of pin apertures. The members of the plurality of fins are spaced from one another. The top plate is coupled to a first end of the plurality of pins, and the base plate is coupled to a second end of the plurality of pins to form a secure structure. Other heat sinks are presented.

This disclosure describes systems and methods for metal foam cooling of vehicle electronic. An example apparatus may include an electronic control unit (ECU) comprising an electronic component included within a housing. The example apparatus may also include a metal foam configured to dissipate heat produced by the electronic component and also configured to facilitate electromagnetic interference (EMI) shielding for the electronic component. The example apparatus may also include an interface between the ECU and the metal foam, wherein the interface provides a connection between the ECU and metal foam to facilitate heat dissipation from the electronic component to a location outside of the housing.

Disclosed is a cooler according to various embodiments of the disclosure. The cooler may have an electronic device mounted thereon, which includes a front surface on which a display area is formed and a rear surface opposite the front surface. The cooler may include a housing including a first surface, a second surface opposite the first surface, and a third surface that surrounds an interior space between the first surface and the second surface, the first surface including a seating area on which the rear surface of the electronic device is seated and a recess area spaced apart from the rear surface of the electronic device by a predetermined gap, and a fan disposed in the interior space of the housing and including a rotary shaft formed in a direction toward the first surface from the second surface.