A vapor chamber that emits a non-uniform radiative heat flux. The vapor chamber may have a convection cavity that contains a working fluid and outer surfaces that have two or more emissivity regions to dissipate heat from the working fluid at non-uniform levels of radiative heat flux. The non-uniform levels of radiative heat flux may result from exposure to emissivity decreasing surface treatments and/or emissivity increasing surface treatments. The vapor chamber may be utilized in thermal management systems to protect heat-sensitive components from thermal radiation that results from heat being dissipated from a heat source. For example, the vapor chamber may be oriented with respect to a heat-sensitive component so that thermal radiation is emitted at a higher radiative heat flux away from the heat-sensitive component than towards the heat-sensitive component.

Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).

A heat dissipation foil comprises a flexible substrate, a molecular fan film and an adhesive. The flexible substrate has a working surface and an adhesive surface, opposite the working surface. The molecular fan film is on the working surface. The adhesive is on the adhesive surface.

A photovoltaic junction box comprising a diode module and a circuit board disposed in a box body, and a heat sink mounted on the outer surface of the box body. The diode module is attached to the back side of the heat sink and is electrically connected to cooper conductor. The heat sink is made of aluminum material and a heat-absorbing layer is provided inside the heat sink. The heat-absorbing layer is close to the diode module. The aluminum heat sink provides great thermal conductivity, therefore, can greatly increase the cooling capacity of the junction box. In addition, because metal material for higher temperature resistance is used instead of lower temperature resistance plastic material, the box body would not deform as easy, greatly increase the safety and reliability of the junction box.

A heat dissipation apparatus, includes: a heat spreading structure and a first surface heat dissipation structure; where the heat spreading structure at least includes a first surface and a second surface which are oppositely arranged, the first surface is connected with a package of a chip to be heat dissipated; and the first surface heat dissipation structure is formed on the second surface by a copper powder spraying process. In the present disclosure, by the copper powder spraying process, the first surface heat dissipation structure formed has a higher adhesion strength, and a morphology of the first surface heat dissipation structure can be adjusted, thereby increasing the number of vaporization core and enhancing the boiling heat exchange effect of the heat dissipation apparatus.

In one aspect, thermally managed electronic components are described herein. In some implementations, a thermally managed electronic component comprises an electronic component and a thermal management coating disposed on a surface of the electronic component. The thermal management coating comprises a graphene coating layer disposed on the surface of the component. The graphene coating layer may comprise a layer of aligned carbon nanoparticles. Moreover, the thermal management coating may further comprise an additional layer of aligned carbon nanoparticles disposed on the graphene coating layer. In another aspect, methods of applying a thermal management coating on an electronic component are disclosed. In some implementations, such a method comprises disposing a graphene coating layer on a surface of an electronic component. The graphene coating layer may comprise a layer of aligned carbon nanoparticles. Such a method may further comprise disposing an additional layer of aligned carbon nanoparticles on the graphene coating layer.

A heat dissipation foil comprises a flexible substrate, a molecular fan film and an adhesive. The flexible substrate has a working surface and an adhesive surface, opposite the working surface. The molecular fan film is on the working surface. The adhesive is on the adhesive surface.

Disclosed is a bottom housing for a dome camera having high heat dissipation efficiency. The bottom housing for a dome camera has an improved structure in which a bottom housing sub-plate made of metal is coupled to a bottom housing main body made of plastic, thereby achieving efficient heat dissipation and waterproofness and suppressing increase in manufacturing cost.

An information handling system, including a cover including a first section and a second section; a first battery cell in superimposition with the second section of the cover; a second battery cell in superimposition with the second section of the cover, the second battery cell spaced-apart from the first battery cell to define a channel therebetween; a graphene coating in superimposition with the second section of the cover; and a first portion of a graphite sheet that is i) in superimposition with a first region of the second section of the cover, ii) in superimposition with the channel defined between the first battery and the second battery, and iii) in superimposition with a first portion of the graphene coating.

Described are a shielding case, a Printed Circuit Board (PCB) and a terminal device. The shielding case includes a first shielding case body (1) and a second shielding case body (2) which are interconnected with each other, wherein the second shielding case body (2) at least partially covers an outside of the first shielding case body (1), and a heat storage material (3) is accommodated between the first shielding case body (1) and the second shielding case body (2).