An apparatus is described. The apparatus includes a semiconductor chip package loading assembly having a heat sink and a first magnetic material, the first magnetic material to be mechanically coupled to a first side of a printed circuit board that is opposite a second side of the printed circuit board where input/outputs (I/Os) of the semiconductor chip package interface with the printed circuit board. The first magnetic material to be positioned between the printed circuit board and a second magnetic material. The first magnetic material is to be magnetically attracted to the second magnetic material to impede movement of the heat sink.

An electronic controller is provided and includes a printed wiring board (PWB) on which electronics are operably disposed, a power supply configured to supply power to the electronics, a heat sink and one or more thermal conductors anchored to the PWB to assume and move between first and second connection states in first and second thermal conditions, respectively. The first connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and thermally disconnected from the heat sink. The second connection states are characterized in that the one or more thermal conductors are thermally attached to the PWB and the power supply and to the heat sink.

A laser package is mounted on the printed circuit board. At least one thermal via extends through the printed circuit board, coupled to the laser package. A thermal bridge is coupled to the at least one thermal via on the bottom of the printed circuit board. A thermal paste connects the thermal bridge to a conductive ground plane on the bottom of the printed circuit board, and to a mechanical housing.

A shielding member is provided. The shielding member includes a shielding layer having flexibility, and an insulating layer stacked on the shielding layer. The shielding layer includes a nanofiber layer including nanofibers plated to have electrical conductivity and coated with an adhesive material, and conductive particles disposed in the nanofiber layer.

A multisided heat spreader includes a base, a first wall, and a second wall. A proximal end of the first wall is connected to a first end of the base. A proximal end of the second wall is connected to a second end of the base which is opposite to the first end of the base. A space is defined adjacent to a first surface of the base and between the first wall and the second wall such that the multisided heat spreader is open between a distal end of the first wall and a distal end of the second wall. The first wall and the second wall are configured to receive an electronic component in the space therebetween. A second surface of the base is configured to be attached to a heat generation component. The first surface of the base is opposite to the second surface of the base.

Tamper-respondent assemblies are provided which include a circuit board, an enclosure assembly mounted to the circuit board, and a pressure sensor. The circuit board includes an electronic component, and the enclosure assembly is mounted to the circuit board to enclose the electronic component within a secure volume. The enclosure assembly includes a thermally conductive enclosure with a sealed inner compartment, and a porous heat transfer element within the sealed inner compartment. The porous heat transfer element is sized and located to facilitate conducting heat from the electronic component across the sealed inner compartment of the thermally conductive enclosure. The pressure sensor senses pressure within the sealed inner compartment of the thermally conductive enclosure to facilitate identifying a pressure change indicative of a tamper event.

An electronic module utilizing a bathtub heatsink and single-cover design to provide improved thermal management and fault isolation while minimizing cost and complexity. The electronic module may also provide for better galvanic corrosion prevention through the utilization of a single finish on the components thereof. Further provided may be an electronic module design utilizing a single set of fasteners, which may further reduce assembly cost and complexity while further providing increase galvanic corrosion prevention.

A casing structure with functionality of effective thermal management is disclosed, which consists of a casing member, a low thermal conductivity medium, a second heat spreader, and a first heat spreader. When a user operates the electronic device, heat generated from CPU and/or GPU is transferred to the second heat spreader via the first heat spreader, and then is two-dimensionally spread in the second heat spreader. Consequently, the heat is dissipated away from the casing member to air due to the outstanding thermal radiation ability of the casing member. The low thermal conductivity medium is adopted for controlling a heat transfer of heat transferring paths from the heat source and ends to the casing member. By applying the casing structure in an electronic device by a form of a top casing and/or a back casing, an outer surface temperature of the casing member can be well controlled.

This application is directed to a passively-cooled electronic device including a housing, a plurality of electronic assemblies and a plurality of thermally conductive parts. The electronic assemblies are enclosed in the housing, and include a first electronic assembly and a second electronic assembly. The first and second electronic assemblies are disposed proximately to each other within the housing, and the second electronic assembly is substantially sensitive to heat, including heat generated by operation of the first electronic assembly. The thermally conductive parts are coupled between the first electronic assembly and the housing, and configured to create a first plurality of heat conduction paths to conduct the heat generated by the first electronic assembly away from the second electronic assembly without using a fan. At least a subset of the thermally conductive parts mechanically supports one or both of the first and second electronic assemblies.

A heat sink including a heat sink body having a heat-absorbing surface that absorbs heat transferred from a heat-generating body, and a heat-dissipating surface that externally radiates the heat; a holding member that is held against the heat-absorbing surface; and a fixation portion that is provided on the heat sink body, that fixes the holding member so as to be incapable of coming loose from the heat sink body, and that suppresses displacement in a planar direction in which the heat-absorbing surface extends.