Provided is a heat radiating apparatus for radiating heat of a heat source in air. The heat radiating apparatus includes a support member in close contact with the heat source on a first principal surface side, a heat pipe supported by the support member, and a plurality of heat radiating fins in a space that faces a second principal surface to radiate the heat transferred by the heat pipe. The heat pipe has a first line part thermally joined with the support member, a second line part thermally joined with the heat radiating fins, and a connecting part. A plurality of heat radiating apparatuses can be connected such that the first principal surfaces are successive, and each of the plurality of heat radiating apparatuses has a receiving part for receiving the connecting parts of adjacent heat radiating apparatuses in the space that faces the second principal surface.

Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit.

An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.

Provided is an electronic device that includes: a housing that includes a metallic member; a battery pack that is disposed in the housing; a substrate that is disposed in parallel with the battery pack and includes at least one heat generating source; a heat dissipation plate that is disposed to overlap with at least a portion of the battery pack and the substrate, and is formed of a metallic material. Heat generated from the heat generating source may be dissipated to the battery pack through the heat dissipation plate. The electronic device includes an efficient heat dissipation structure that also contributes to the rigidity reinforcement and slimming of the electronic device, and can prevent an electric shock accident beforehand, which may be caused by an exterior of a metallic member. Other various embodiments may be made.

In a camera, a circuit board converts light having passed through a lens into an electric signal. A connector connects the circuit board to an outside cable. A shielding conductor surrounds the circuit board. An insulating housing houses the circuit board and the shielding conductor. A connector includes inner, intermediate, and outer connectors. The inner connector includes a first outer skin conductor, and is mounted to the circuit board. The intermediate connector includes a second outer skin conductor supporting a shielding conductor, and is connected to the inner connector and the shielding conductor. The outer connector includes a third outer skin conductor, and connects an outside cable to the intermediate connector. The shielding conductor wraps the circuit board from a boundary, as a starting point, between the second outer skin conductor and the shielding conductor. The insulating housing is connected to and supported by the intermediate connector.

An electronics rack comprising a frame, a heat sink coupled to the frame, and a cage adapted to support an electronic component. The cage is movable between first and second positions toward and away from the heat sink. The rack further includes an eccentric cam operatively positioned between the frame and the cage and being rotatable to move the cage between the first and second positions. In one embodiment, the cage comprises a cooling brick movable toward and away from the heat sink when the cage moves between the first and second positions. The cooling brick can include a first heat pipe extending generally in a first direction and a second heat pipe extending generally in a second direction transverse to the first direction. For example, the first heat pipe can be embedded in a top plate and the second heat pipe can be embedded in a top cold rail.

A wearable device is disclosed according to one embodiment. The wearable device can include an eyewear body, onboard electronic components, a thermal coupling and a heat transfer device. The eyewear body can be configured for wearing by a user to hold one or more optical elements mounted on the eyewear body within a field of view of the user. The onboard electronic components can be carried by the eyewear body at a first portion of the eyewear body and can comprise a heat source that generates heat during electrically powered operation thereof. The thermal coupling can be thermally coupled to the heat transfer device at a second portion of the eyewear body. The elongate heat transfer device can be disposed within the eyewear body and can be thermally coupled to the heat source and the thermal coupling. The heat transfer device can extend lengthwise between the heat source and the thermal coupling to transfer heat from the heat source to the thermal coupling.

A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.

An electronic device may include a noise shielding device that may include: a substrate including at least one heat generating component; a metallic shield cover that is disposed on the substrate to enclose the at least one heat generating component; a metal housing disposed around the shield cover; and a heat transfer member that is configured to transfer heat emitted from the heat generating component through an opening formed at a position corresponding to the heat generating component to the metal housing, wherein the metallic shield cover includes a plurality of tension fingers that protrude at predetermined intervals and contact a bottom face of the metal housing, and noise emitted from the heat generating component is shielded by a shielding region that is formed by the tension fingers and the metal housing.

Provided are a communication system and a communication apparatus thereof, the communication apparatus includes: a bottom case and a printed circuit board mounted on the bottom case, the communication apparatus further includes a heat-conductive mounting strip, the printed circuit board being mounted on the bottom case by means of the heat-conductive mounting strip, wherein a lower end surface of the heat-conductive mounting strip is connected to the bottom case, and an upper end surface of the heat-conductive mounting strip is connected to the printed circuit board.