A heat transfer assembly includes a heat plate coupled to a spring and to a graphite sheet. The spring is at first location corresponding to a heat source in an assembled device. The graphite sheet extends over at least a middle portion of the spring and over portions of the heat plate. The graphite sheet is coupled to a thermal pad positioned above a given surface of the heat source. The spring provides a compressive force on the thermal pad when the device is in an assembled state. The compressive force enhances thermal conductivity between the heat source and the heat transfer assembly. The heat plate may be positioned within and thermally coupled to a cover of the device. Principally by use of the thermal pad, graphite sheet, and thermal plate, heat generated by the heat source is transferred to the cover and then to the external environment.

An apparatus includes multiple thermal interface segments collectively forming a discontinuous thermal interface configured to contact a curved surface of an object. The discontinuous thermal interface is configured to transfer thermal energy to or receive thermal energy from the curved surface of the object. Each of the thermal interface segments includes a major surface that is curved. The curved major surface of each of the thermal interface segments is configured to register with the curved surface of the object and has a specified area that is based on a Hertzian contact area defined partially by the curved surface of the object. The apparatus can also include a thermal gap pad configured to be compressed between the thermal interface segments and the object.

A disclosed apparatus may include (1) a heat-emitting component, (2) a heatsink that includes a designated area thermally coupled to the heat-emitting component, (3) a plurality of springs that apply forces that support the thermal coupling between the designated area of the heatsink and the heat-emitting component, and (4) a pressure plate that concentrates the forces applied by the springs toward the designated area of the heatsink. Various other apparatuses, systems, and methods are also disclosed.

A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.

Systems and methods for detecting an incorrectly attached heat sink component on an electronic device. The system includes one or more temperature sensors secured to the electronic device and a controller unit comprising one or more processors and one or more computer-readable media, the computer-readable media having stored thereon executable instructions that are executable by the one or more processors to perform a method for detecting incorrectly attached heat sink components. The method includes receiving temperature data, calculating a thermal ramp rate, comparing the thermal ramp rate to a predetermined threshold ramp rate, and transmitting a fault signal when the calculated thermal ramp rate exceeds the predetermined threshold ramp rate.

A heat dissipation device includes a fixing bracket and a plurality of heat sinks, where the fixing bracket includes a mounting part, and a plurality of first mounting holes are provided on the mounting part; and a fixing part is disposed on each of the plurality of heat sinks, and the fixing part is inserted into the first mounting hole. A height of the fixing part above a surface of the heat sink along a direction perpendicular to the heat sink is greater than a thickness of the fixing bracket, and the fixing part fits a gap of the first mounting hole. Floating gaps are reserved for the heat sink both in a mounting direction between the heat sink and the fixing bracket and in an aperture direction of the first mounting hole, so as to reduce a risk of a damage to a chip that is not fastened with the heat sink.

A cooling system for a datacenter device is disclosed. Fins are provided between a first plate and a second plate to dissipate a first amount of heat to an environment in a first configuration of the fins. The first plate is movable relative to the second plate to expose a surface area of the fins to the environment in a second configuration of the fins.

A heat sink assembly for a cage for a field replaceable computing module includes a heat sink, a thermal interface material (TIM), and an actuation assembly. The heat sink includes a mating surface. The TIM includes a first surface that is coupled to the mating surface and a second surface that is opposite the first surface. Thus, the second surface can engage a heat transfer surface of a field replaceable computing module installed adjacent the heat sink. The actuation assembly includes a shape memory alloy (SMA) element. When the SMA element is in a first position, the second surface of the TIM contacts the heat transfer surface of the computing module. When the SMA element moves to a second position, the second surface of the TIM is moved a distance away from the heat transfer surface of the computing module.

The present disclosure relates to heat dissipation apparatus. One example heat dissipation apparatus includes a heat dissipation assembly and a bracket assembly, where the heat dissipation assembly is configured to dissipate heat for a server chip and includes a substrate and a heat sink, the heat dissipation assembly is connected to the bracket assembly, the bracket assembly includes a bracket and a plurality of first elastic structural members that are disposed on the bracket, each first elastic structural member includes a supporting portion and a connection portion, and at least one hook is disposed on the connection portion.

A thermal interface for discrete semiconductor devices (such as IGBT's) having a thermally conductive structure, a PCB populated with discrete electronic components, and each of the discrete semiconductor devices having a housing extending beyond the edge of the PCB and in a direction substantially parallel to a plane of the PCB, and a clamp bar secured to the thermally conductive structure adapted to compressively secure each housing to the thermally conductive structure and adapted to maintain thermal contact between a surface of each housing and the surface of the thermally conductive structure. A thermally conductive and electrically insulative pad is positioned between the semiconductor device housing and the thermally conductive structure. A casing enclosing the interface and PCB includes the thermally conductive structure formed on a backwall of the casing.