An optical engine module comprises a casing, a light valve, a heat dissipating module, and at least three fixtures. The casing comprises at least three fixing structures. The light valve is disposed in the casing and is connected to the casing. The light valve comprises a heat interface. The heat dissipating module comprises a heat dissipating surface in contact with the heat interface of the light valve. The number of the at least three fixing structures and positions of the same correspond respectively to the number of the at least three fixtures and positions of the same. The heat dissipating module is connected to the casing by matching the at least three fixing structures and the at least three fixtures. In the optical engine module, improved stability of the heat dissipating module, preferable heat dissipating efficiency for the light valve, and thus good optical effect are provided.

An electronic system includes an electronic device and a cooling device. The electronic device includes a housing, a heat source, a heat-conducting seat, and a heat-conducting block. The housing includes a space and at least one opening in communication with each other. The heat source and the heat-conducting seat are disposed in the space and contact with each. The heat-conducting seat faces the opening. The heat-conducting block is located at the opening and is connected to the housing. The cooling device includes a pressing portion and a cooling portion. The pressing portion presses the heat-conducting block, to cause the heat-conducting block to move into the space and abut against the heat-conducting seat, so that heat of the heat source is transferred to the pressing portion. The cooling portion is connected to the pressing portion, and dissipates the heat transferred to the pressing portion.

A flow chamber, a cooling system and a method are described. The flow chamber includes an upper chamber including a top wall, an actuator, and a lower chamber. The actuator is located distally from the top wall. The lower chamber receives fluid from the upper chamber when the actuator is actuated. The top wall includes at least one cavity therein. The cooling system utilizes cooling cells including the flow chamber. The method includes driving the actuator at a frequency that directs fluid through the flow chamber.

A device via which components mounted on a carrier plate can be pressed against a heat sink that is arranged on a side or underside of a carrier plate that is not equipped with components at least in a cooling region, the device through which at least one component can be pressed on includes at least one hollow body for receiving at least one fastening body and at least one spring arm formed in an Omega shape and has, at the end thereof, a bearing face formed as a polygonal flattening for transmitting a pressing force onto the component to be cooled, where the device is further formed in one part as a plastics injection-molded part and can be installed easily and quickly (particularly automated manner) and enables a space-saving arrangement of components to be cooled, particularly whilst maintaining predefined electrical clearances and/or predefined air gaps and creepage distances.

A device and method for assembling an electrical device that includes components attached to a carrier plate and is produced in accordance with an assembly method, wherein at least one component produces dissipated power which is dissipated via a thermal connection to a heat sink.

The present embodiment relates to an electronic component assembly comprising: a housing; a heating element disposed inside the housing; a substrate disposed on the heating element; and a spacer disposed between the heating element and the substrate, wherein the substrate has a first hole coupled to the spacer, the heating element includes a first body having a second hole formed therethrough, and a connection part connected to the substrate, and the spacer includes a first protrusion coupled to the first hole, a second protrusion coupled to the second hole, and a second body disposed between the first protrusion and the second protrusion.

Particular embodiments described herein provide for an electronic device that can be configured to include a first housing, a second housing, a hinge that rotatably couples the first housing to the second housing, and a flexible heat spreader that extends from the second housing, through the hinge, and to the first housing. The hinge can accommodate deformations in the flexible heat spreader when the first housing is rotated relative to the second housing.

A cooling device for cooling a plurality of electronic components mounted on a circuit board. The device includes a contact sheet shaped for conforming to the plurality of electronic components and comprising a mating face for mating against the plurality of electronic components and a cooled face. An enclosure is mounted to the cooled face and defines a coolant transport circuit for circulating coolant liquid there thorough. A coupling may be provided for biassing the mating face toward the plurality of electronic components.

A heat dissipating structure is for conducting heat generated by a detachable module to a case module. The heat dissipating structure includes a driving component disposed on a side of the detachable module, a driven component pivotally disposed on the case module and a heat dissipating component connected to the driven component. The driving component is slidable relative to the case module along with the detachable module. The heat dissipating component is for abutting against the detachable module and the case module. When the detachable module slides relative to the case module along an installing direction, the driving component drives the driven component to pivot relative to the case module in a first pivoting direction to drive the heat dissipating component to abut against the detachable module and the case module for conducting the heat generated by the detachable module to the case module by the heat dissipating component.

An installation structure and an installation method of a plug-in switch tube is disclosed in the present invention, the installation structure comprises, a PCB board, a plug-in switch tube fixed on said PCB board, and a housing matching said PCB board and said plug-in switch tube, wherein the lower end surface of said housing is provided with a cooling liquid flow channel, and said plug-in switch tube is pressed against the side wall of the cooling liquid flow channel by an elastic pressing-piece. The installation structure according to the present invention has the advantages of small volume, excellent heat dissipation effect, simple assembly, low cost and light weight.