In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

A heat dissipation case includes a case body, a carrying frame configured to be slidably mounted on the case body, a shutter rotationally mounted on the case body, and a number of levers rotationally mounted on the case body. One end of the levers resists against the shutter. The carrying frame is configured to resist against the other end of the levers, so that the end of the levers resisting against the shutter drives the shutter to rotate and open toward the carrying frame.

An equipment shelf includes at least one power supply unit (PSU) positioned in an upper region of the equipment shelf. The equipment shelf also includes at least one battery backup unit (BBU) positioned in a lower region of the equipment shelf. An airflow path extends through the equipment shelf between the upper region and the lower region. The airflow path separates the upper region of the equipment shelf from the lower region of the equipment shelf and thermally isolates the at least one PSU in the upper region from the at least one BBU in the lower region when air flows through the airflow path. Other example equipment shelves are also disclosed.

A cooling device includes a device case that is arranged in an enclosure having a midplane, with a case front face facing the midplane. The device case includes a first fan unit for generating a flow of air from a side with the case front face to a side with a case rear face of the device case and a second fan unit, being stored at closer position to the side with the case front face than the first fan unit, for taking in part of air passing through one side in a width direction of the device case and flowing to the first fan unit and sending out the part of the air to the other side in the width direction of the device case. The air flow by the second fan unit can effectively cool circuitries at the rear side of the midplane.

An apparatus cools electronic circuitry. An enclosure surrounds the electronic circuitry and has plural surfaces. Air intake holes are disposed in at least one surface and face at least one first direction. Air exhaust holes are disposed in at least another surface and face at least one second direction different than the first direction. A heat sink is in thermal contact with the circuitry and conducts heat generated by the circuitry. When a fan operates, air is drawn from an exterior of the enclosure through the air intake holes, absorbs heat from the heat sink, and then is directed through the air exhaust holes into the exterior of the enclosure. The heat sink is further in thermal contact with the enclosure so that when the fan does not operate, heat is drawn from the circuitry to the enclosure via the heat sink and is dissipated from the exterior.

A mounting frame apparatus is provided for embedding cards within an electronics system and includes a multi-card swappable subsystem. The apparatus further includes a chassis for containing the multi-card swappable subsystem. One or more heatsinks are used for cooling cards disposed in the four-card swappable subsystem.

A system for determining and displaying in a graphical user interface one or more of air temperature, pressure, or velocity in an information technology (IT) room including an IT equipment rack comprises a processor configured to receive an input comprising airflow resistance parameters through the rack, an IT equipment airflow parameter, a heat-dissipation parameter, an external pressure, and an external temperature, to run the input through a flow-network solver that solves for airflow velocities through at least one face of the rack and a rack air outflow temperature based on the input, provide an output including the airflow velocities and the rack air outflow temperature, and generate, based on the output, a display in a graphical user interface of the system illustrating one or more of air temperatures, air pressures, or airflow velocities within the IT room.

A cooling assembly includes an air mover and a vent panel coupled to the air mover. The vent panel includes an inlet. The cooling assembly includes a vane that is rotatable around a central vertical axis of the vane between an open position and a closed position to open and close the inlet.

A chassis is disclosed that includes a first sidewall, a second sidewall and a baffle having a plurality of penetrations, a first side and a second side and configured to be inserted into the chassis between the first sidewall and the second sidewall. An air block is disposed in each penetration, wherein each air block can be selectably configured in either a closed position to prevent air flow or an open position to allow air flow.

A motor driving device includes a mounting member including a mounting hole; a fan unit configured to be fixed to the mounting member, the fan unit including a lid disposed to cover the mounting hole; a restricting member configured to restrict movement of the lid by sandwiching the lid between the restricting member and the mounting member; and a guide mechanism configured to guide an operation of the restricting member moving relative to the lid from a non-restricting position where movement of the lid is allowed to a restricting position where movement of the lid is restricted.