In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

An electrical device, comprising a device housing including a skeleton-like frame structure having a plurality of columns and/or crossbeams and at least one electrical module. The module has a module housing and is detachably mounted on the frame structure. The module housing accommodates one or more electrical components generating heat when being operated, wherein the at least one electrical module is liquid cooled and is connected to a radiator for establishing a coolant circuit. The radiator and an active ventilation means are arranged in the device housing such that the radiator is positioned in an air stream generated by the active ventilation means when the active ventilation means is operated.

A programmable AC power distribution device includes a control circuit board disposed on a connecting plate. A fixing plate is disposed in a case. The connecting plate is connected to the fixing plate through a coupling member. Thereby, the connecting plate with the control circuit board can be disassembled only by removing the coupling member. When the control circuit board is to be reinstalled, the connecting plate can be easily fixed to the fixing plate through the coupling member. The assembly and disassembly of the control circuit board can be improved effectively, thereby greatly improving the efficiency of the check and repair of the control circuit board.

Various types of electronic devices may be mounted in a chassis in order to facilitate interfacing with the devices, containing the devices, provide cooling systems which may remove heat from the electronic devices, etc. Delivering adequate cooling air flow to each electronic device in a chassis may be an important issue for the proper functioning, lifetime, or other characteristics of electronic devices contained in a chassis. Some electronic devices may be particularly challenging to cool due to various design characteristics. Other electronic devices may have other requirements that are not well served by existing chassis designs. For example, some electronic devices may benefit from additional electrical and/or thermal connections. Embodiments presented herein describe a novel design for a modular card cage accessory that may be configured to modify air flow and/or to meet particular requirements of an electronic device in a chassis, among various possibilities.

A system including an enclosure including a data storage enclosure. The data storage enclosure includes multiple storage levels and a shared cooling area. The system further includes data storage devices positioned within each of the multiple storage levels and a first and second set of air movers positioned within the data storage enclosure in the shared cooling area. The first and second sets of air movers are arranged to cool the data storage devices.

A network device is provided. The device includes a housing and a switch card, mounted within the housing and having one or more connectors. A plurality of line cards are oriented parallel to each other and orthogonal to the switch card and assembled to the one or more connectors of the switch card. The switch card has a chip, with a plurality of switches or routing paths, and the switch card and the chip couple to the plurality of line cards through the one or more connectors.

An airflow characterization system includes a first airflow sensor subsystem positioned at a first location on an airflow characterization board base and a second airflow sensor subsystem positioned at a second location on the airflow characterization board base that is different than the first location. An airflow characterization controller is coupled to the first airflow sensor subsystem and the second airflow sensor subsystem. When the airflow characterization board is positioned in a circuit board slot, the airflow characterization controller receives a first airflow signal from the first airflow sensor subsystem during a first time period and receives a second airflow signal from the second airflow sensor subsystem during the first time period. The airflow characterization controller determines a circuit board slot airflow characterization for the circuit board slot based on the first airflow signal and the second airflow signal.

A system for providing cooling to electronic modules received within a chassis. The chassis includes a cooling apparatus having ducting and a plurality of fans coupled to the ducting. The ducting includes air passageways that extend through the ducting and are configured to direct air blown into the passageways by the fans toward the modules installed in the chassis. The modules include heat sinks and the air passageways direct the air toward the fins to provide cooling to the heat sinks. The chassis includes switches coupled to the fans and configured to selectively activate the individual fans when the electronic modules are installed in the chassis.

A secure electronic equipment rack allows electronic equipment to be hung vertically to save space for deep components. This is done by providing a vertical rack apparatus with horizontal side panels on which components are mounted vertically. The side panels of the rack are shorter than the depth of the components to be mounted on, to, or within the panels, thus allowing space to be saved. The rack can be expanded based on user's equipment growth. The apparatus can be mounted on a wall or on a standard EIA relay rack. The apparatus has cable management for equipment that fits into wire channels and allows having a patch panel mounted without taking up a U space in the apparatus itself. The apparatus can include a built-in level for ease of mounting, and an integrated earth grounding stud. A secure version can include tamper resistance by adding baffling of ventilation areas, for example in both top and bottom vent patterns, and can be designed to be assembled in an overlapping fashion which allows no exposed hardware with the last piece to be assembled being the first to be removed in sequence.

A system (10) for detecting a level of dirtiness of a filter mat (20) of an airflow cooling system for telecommunications equipment, the system (10) comprising a detector (12) for detecting fluorescent or reflected light backscattered at at least one part in (22) of the filter mat (20) comprising or treated with a fluorescent or reflective material, wherein the detector (12) comprises a light source (12a) for illuminating said at least one part (22) of the filter mat (20) with sampling light, and a photosensor (12b) for detecting fluorescent or reflected light backscattered at said at least one part (22) of the filter mat (20) caused by the illumination thereof with sampling light, wherein the system (10) is configured for inferring the level of dirtiness of the filter mat (20) from the amount of detected fluorescent or reflected light.