An electrical system includes modules and a frame structure for mechanically supporting the modules successively in an arrival direction of cooling air. Each module includes a cooling element in heat conductive relation with one or more electrical components. The frame structure mechanically supports the modules so that the cooling elements are substantially in the same attitude and successively in the arrival direction of the cooling air. The cooling elements are shaped so that, when the modules are mechanically supported by the frame structure, the cooling elements conduct cooling air in a direction deviating from the arrival direction of the cooling air. Furthermore, at least a part of a flank of the heat transfer portion of each cooling element is oblique with respect to the arrival direction of the cooling air. Thus, each of the cooling elements receives a fresh portion of the cooling air.

A secure electronic equipment rack allows electronic equipment to be hung vertically to save space for deep components. This is done by providing a vertical rack apparatus with horizontal side panels on which components are mounted vertically. The side panels of the rack are shorter than the depth of the components to be mounted on, to, or within the panels, thus allowing space to be saved. The rack can be expanded based on user's equipment growth. The apparatus can be mounted on a wall or on a standard EIA relay rack. The apparatus has cable management for equipment that fits into wire channels and allows having a patch panel mounted without taking up a U space in the apparatus itself. The apparatus can include a built-in level for ease of mounting, and an integrated earth grounding stud. A secure version can include tamper resistance by adding baffling of ventilation areas, for example in both top and bottom vent patterns, and can be designed to be assembled in an overlapping fashion which allows no exposed hardware with the last piece to be assembled being the first to be removed in sequence.

A module heatsink lifter for raising and lowering a heatsink enabling insertion and removal of a module includes a fixed base; a hinge connector of the fixed based coupled to the heatsink; and an actuator mechanism to raise and lower the heatsink through rotation about the hinge connector, wherein the actuator mechanism operates from a front faceplate based on push and pull movement to raise and lower the heatsink into a raised position and a lowered position. The heatsink includes a Thermal Interface Material (TIM) on a bottom portion which creates a thermal connection with the module when the heatsink is in the lowered position. The module can include a pluggable optical module.

A module for a communications cell site includes: a mounting frame; a remote radio unit (RRU) mounted to the frame; a radio frequency (RF) signal conditioning unit mounted to the frame; and a cover mounted to the frame that covers the RRU and the RF signal conditioning unit.

Systems and methods for controlling airflow through a casing or shelf assembly are provided. An apparatus, according to one implementation, includes a mount plate configured to be attached to a side panel of a casing for housing network equipment. For example, the mount plate may include a window. The apparatus also includes one or more hinges arranged at an edge of the window of the mount plate and a baffle pivotably attached to the one or more hinges. The baffle can be arranged within a range of positions with respect to the mount plate to control an amount of airflow through the window. Within these range of positions, the baffle is configured to redirect the airflow in a front-to-back direction through the casing.

In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

A radio remote unit, including a unit body, and multiple heat dissipation fins that are disposed on a surface of the body, where an opening groove is disposed on the heat dissipation fin, and opening grooves on the multiple heat dissipation fins form a fan ventilation groove, where the fan ventilation groove is connected to ventilation channels between the heat dissipation fins, and a fan is disposed in a built-in manner in the fan ventilation groove. The fan ventilation groove formed by the opening grooves on the multiple heat dissipation fins is connected to the ventilation channels between the heat dissipation fins, and the fan is disposed, which implements that in a case in which a quantity of heat dissipation fins is unchanged, the fan performs air cooling on the radio remote unit, effectively improving a heat dissipation capability.

A disclosed apparatus for use with a conduction-cooled card assembly may include a frame comprising first and second thermally conductive portions adapted to engage respective thermal management interfaces on opposite sides of a conduction cooling frame for at least one circuit card. The apparatus may also include a passageway extending between first and second openings in the frame so as to allow cooling fluid to flow into the first opening, through the passageway, and out of the second opening. According to a disclosed method, an insert may be installed between components of a mezzanine connector so as to increase a height of the connector. In some implementations, the installing of the insert may be performed while the first and second components of the mezzanine connector are mounted on a host card and a mezzanine card, respectively, so that installation of the insert between the first and second components increases a spacing between the host card and the mezzanine card.

A cold-air bypass apparatus may include (1) a mount configured to couple the cold-air bypass apparatus to a drive-plane board housed within a storage-system chassis and (2) a baffle configured to direct a portion of an airflow through an opening in the drive-plane board from below the drive-plane board to above the drive-plane board. The drive-plane board may include (1) a front drive section that includes storage-drive connectors coupled to the drive-plane board, (2) a rear drive section that includes additional storage-drive connectors coupled to the drive-plane board, and (3) the opening located between the front drive section and the rear drive section that allows air to flow from below the drive-plane board to above the drive-plane board. Various other apparatus, systems, and methods for directing air in a storage-system chassis are also disclosed.

A secure electronic equipment rack allows electronic equipment to be hung vertically to save space for deep components. This is done by providing a vertical rack apparatus with horizontal side panels on which components are mounted vertically. The side panels of the rack are shorter than the depth of the components to be mounted on, to, or within the panels, thus allowing space to be saved, The rack can be expanded based on user's equipment growth. The apparatus can be mounted on a wall or on a standard EIA relay rack. The apparatus has cable management for equipment that fits into wire channels and allows having a patch panel mounted without taking up a U space in the apparatus itself, The apparatus can include a built-in level for ease of mounting, and an integrated earth grounding stud. A secure version can include tamper resistance by adding baffling of ventilation areas, for example in both top and bottom vent patterns, and can be designed to be assembled in an overlapping fashion which allows no exposed hardware with the last piece to be assembled being the first to be removed in sequence.