Disclosed are a system, method, and computer-readable medium for optimizing a fan control system inside a rack system. In at least one example embodiment, the system can include a rack server with a plurality of chassis each having at least one node, each of the nodes including at least one adjustable air vent and configured for adjusting the at least one adjustable air vent based on an air flow requirement of the node. The system can further include a plurality of fans, where the plurality of fans are configured to operate based on a control signal. The system also can comprise a fan control logic board, wherein the fan control logic board is configured to receive from each node in the plurality of chassis the air flow requirements and based on the plurality of air flow requirements generate and transmit the control signal to the plurality of fans.

Disclosed are a method and an apparatus for controlling subrack fans. The method comprises: by installing multiple boards installed with high-power components in different areas of a subrack respectively, forming multiple heat dissipation air channels corresponding to the multiple boards respectively; installing a fan group comprising multiple heat dissipation fans on the subrack; dividing the fan group into multiple fan areas corresponding to the multiple heat dissipation air channels respectively, so that each fan area blows air to a corresponding board through a corresponding heat dissipation air channel; detecting temperature of each board and a rotating speed of a corresponding fan area in real time; adjusting the rotating speed of the fan area according to a detection result, so that the rotating speed of the fan area increases or decreases as the temperature of the corresponding board increases or decreases. Also disclosed is the apparatus for controlling subrack fans.

A modular hardware platform utilizes a combination of different types of units that are pluggable into cassette endpoints. The present disclosure enables the construction of an extremely large system, e.g., 500 Tb/s+, as well as small, standalone systems using the same hardware units. This provides flexibility to build different systems with different slot pitches. The hardware platform includes various numbers of stackable units that mate with a cost-effective, hybrid Printed Circuit Board (PCB)/Twinax backplane, that is orthogonally oriented relative to the stackable units. In an embodiment, the hardware platform supports a range of 14.4 Tb/s-800 Tb/s+ in one or more 19″ racks, providing full features Layer 3 to Layer 0 support, i.e., protocol support for both a transit core router and full feature edge router including Layer 2/Layer 3 Virtual Private Networks (VPNs), Dense Wave Division Multiplexed (DWDM) optics, and the like.

A sub-module cooling device of a power transmission system is proposed. Sub-modules may be arranged in a row on each of multiple layers of a frame. Heat generated by the sub-modules may be transferred to a duct through heat pipes, and the heat transferred through the heat pipes may be discharged to the outside while air coming out from an air conditioner passes through the duct. When the heat generated by the sub-modules is discharged in this manner, a cooling fan may not be required to be installed in each of the sub-modules. Air may be flown by the operation of the air conditioner and may absorb the heat generated by the sub-modules and discharge the heat to the outside.

Disclosed is an air conditioning arrangement, in particular a cooling arrangement, at least comprising a switchgear cabinet (1) that has a supporting device (4). Electric and/or electronic devices (2) that are to be air-conditioned are disposed in rows on top of and next to one another on the front side (17) of the supporting device (4), said front side (17) facing the doors of the switchgear cabinet. The disclosed air conditioning arrangement is characterized in that the devices (2) in the switchgear cabinet (1) can be at least partially air-conditioned by at least one heat sink (50), each of which forms an autonomous component.

A power cabinet, which includes a cabinet body and an electric reactor, a power unit and a switch arranged in the interior of the cabinet body. In the interior of the cabinet body of the power cabinet, the electric reactor is arranged close to a first side in the interior of the cabinet body, and the power unit and the switch are arranged on a second side in the interior of the cabinet body, opposite to the first side. Moreover, these electric reactor, the power unit and the switch are all located in a lower space. In addition, in the power cabinet, the electric reactor and power unit dissipate heat in different chambers from the switch dissipates heat.

An enclosure and a method for dispersing heat generated by an electrical component within the enclosure is provided and includes associating the electrical component with a conductive via/trace such that the conductive via/trace absorbs the heat generated by the electrical component, wherein the conductive via/trace is constructed from a heat conducting material; directing heat generated by the electrical component away from the electrical component by associating the conductive via/trace with a column having a column wall that defines a column cavity communicated with a column first opening and a column second opening, wherein the column wall is thermally conductive to receive heat flowing into the at least one of the plurality of columns; and allowing an airflow to flow through the column first opening into the column cavity and out of the column second opening, such that the airflow contacts the column wall within the column cavity.

Systems, methods and computer-readable media for reducing upstream preheat for high-density hard disk drive storage. A system can include first and second rows of storage devices installed in a storage rack, the first and second rows having a first distance between consecutive storage devices. The second row can be located behind the first row and farther away from a source of an airflow than the first row. The system can monitor a temperature associated with the second row and when the temperature rises above a threshold, the system can remove a storage device from the first row. The system can then adjust placement within the first row such that the remaining devices have a second, larger distance between each other to increase airflow to storage devices in the second row and reduce system impedance.

The temperature control cabinet includes at least one cabinet unit. Each cabinet unit includes: a subrack, where there is a placement space for placing a device inside the subrack, and there is at least one opening at a periphery of the cabinet; and a cabinet door mounted on the subrack and configured to buckle the opening, where at least two temperature control components are disposed on the cabinet door, the temperature control components are arranged in a first direction, the first direction is a direction from the top to the bottom of the subrack, each temperature control component is provided with an air exhaust vent and an air return vent, the air return vent of each temperature control component is communicated with a hot area at the top of the placement space, and the air exhaust vent of each temperature control component is communicated with the placement space.

An equipment cooling rack device, with a cooling cabinet, having a cooled area, adapted for holding multiple different heat creating structures to be cooled; a cooling structure, coupled to the cooling cabinet, and providing a first cooling coil for a left side of the rack and a second cooling coil for a right side of the rack, and orthogonal fans. The fans and coolant are controlled according to thermographic color of the cooling cabinet.