The invention relates to an equipment cabinet for receiving information-technology (IT) and communication-technology components which generate waste heat during operation. Here, the IT and communication-technology components draw in cooling air from the front side of the equipment cabinet for cooling and discharge this air into a hot-air region after having been heated. The air is guided out of the hot-air region and cooled by a cooling device comprising fans. Furthermore, sensors are provided for determining the pressure differential between the pressure in the hot-air region and in the surroundings of the equipment cabinet. In addition, a method is described for regulating a cooling device in an equipment cabinet of this kind.

An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system.

A power conversion system includes a housing (outer housing) and a power converter. The power converter is arranged in an internal space of the housing. An outer peripheral surface of the housing is provided with an air inlet and an air outlet. The air outlet communicates with the air inlet via the internal space of the housing and is located below the air inlet.

A cooling system of an embodiment includes a container having a first wall and a second wall intersecting the first wall; a housing accommodated in the container and including a plurality of racks juxtaposed to one another in a first direction being away from the first wall; a plurality of modules that generates heat, and is supported by the corresponding racks and placed in a row in a second direction intersecting the first direction and along the second wall; an opening through which air for cooling the modules flows into the container; and an air injection passage and an air discharge passage extending between the housing and the second wall and between the housing and an opposite side. The housing is provided with an intermediate passage extending between the injection passage and the discharge passage. The opening is juxtaposed to the injection passage in the second direction.

A rack-mounted cabinet covering structure including a first side covering and a second side covering. The first side covering may include a first tightener and a first rollable rectangular layer. The first tightener may be coupled to the first rollable rectangular layer at or near a first lateral edge. The first tightener may include a first tightener height that is less than a first sheet height between the first top edge and the first bottom edge. The second covering may include a second tightener and a second rollable rectangular layer configured to couple with the first rollable rectangular layer. The second tightener may be coupled to the second rollable rectangular layer at or near a second lateral edge. The second tightener may include a second tightener height that is less than a second sheet height between the second top edge and the second bottom edge.

Method and apparatus includes a chassis to house circuitry, the chassis having first and second surfaces and an air inlet. An airflow moving device may create an airflow in a first direction that is communicated to the chassis via the air inlet. A wall structure may have a height that extends up from a base of the wall structure in a second direction that is substantially perpendicular to the first direction of the airflow, where the base of the wall structure directly contacts the first surface and forms an elongated opening along a top surface of the wall structure and in between the second surface of the chassis. The airflow may flow over the top surface of the wall structure.

A method for measuring airflow for a plurality of computing devices may include characterizing the fan performance of a selected computing device of the plurality of computing devices to provide characterized RPM information. Each of the computing devices may include a cooling fan configured to exhaust heat into a hot aisle. Each cooling fan may include a rotor and a tachometer. The method may also include connecting the computing devices via a network, distributing computing workloads to the plurality of computing devices, and/or performing work on the computing workloads on the plurality of computing devices. Additionally, the method may include reading RPM information from the selected computing device's fan's tachometer and/or comparing the read RPM information with the characterized RPM information to determine a backpressure value for the selected computing device. The power to the selected computing device's fan may be reduced prior to reading the RPM information.

A modular networking hardware platform utilizes a combination of different types of units that are pluggable into cassette endpoints. The present disclosure enables the construction of an extremely large system, e.g., 500 Tb/s+, as well as small, standalone systems using the same hardware units. This provides flexibility to build different systems with different slot pitches. The hardware platform includes various numbers of stackable units that mate with a cost-effective, hybrid Printed Circuit Board (PCB)/Twinax backplane, that is orthogonally oriented relative to the stackable units. In an embodiment, the hardware platform supports a range of 14.4 Tb/s-800 Tb/s+ in one or more 19″ racks, providing full features Layer 3 to Layer 0 support, i.e., protocol support for both a transit core router and full feature edge router including Layer 2/Layer 3 Virtual Private Networks (VPNs), Dense Wave Division Multiplexed (DWDM) optics, and the like.

A power distribution cabinet is disclosed which includes multiple internal compartments for separating and channeling hot air generated by high heat generating components out of the cabinet without coming into contact with more heat sensitive components. The cabinet includes a baffle structure which forms an internal wall within the cabinet, which helps to form a high heat compartment and an upper compartment. The high heat compartment houses a heat generating component. Cool air is allowed to flow into a lower area of the cabinet and into the high heat compartment, and is also channeled into the upper compartment where at least one other heat generating component is located. The baffle structure channels hot air formed within the high heat compartment out toward a rear area of the equipment cabinet, while also helping to channel warm air created within the upper compartment through a top panel of the cabinet.

The invention relates to an equipment cabinet for receiving information-technology (IT) and communication-technology components which generate waste heat during operation. Here, the IT and communication-technology components draw in cooling air from the front side of the equipment cabinet for cooling and discharge this air into a hot-air region after having been heated. The air is guided out of the hot-air region and cooled by a cooling device comprising fans. Furthermore, sensors are provided for determining the pressure differential between the pressure in the hot-air region and in the surroundings of the equipment cabinet. In addition, a method is described for regulating a cooling device in an equipment cabinet of this kind.