A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.

Provided is a cooling system capable of improving the cooling performances of a plurality of electronic apparatuses, of making stabilization by eliminating the variance in the cooling performances and of being improved in the handling and maintainability of the electronic apparatuses. A plurality of inner partitioning walls are provided in a cooling tank having an open space defined by a bottom wall and side walls to divide the open space, and a plurality of arrayed storage sections are defined. An electronic apparatus is stored in each of the storage sections. Each of the storage sections is formed with an inflow opening and an outflow opening for the cooling liquid. The inflow opening is formed at a bottom portion or a side surface of each storage section, and the outflow opening is formed in the vicinity of the liquid level of the cooling liquid flowing through each storage section.

A liquid cooling device for cooling at least one target component that includes: a base member to be in thermal contact with the at least one target component to be cooled by the liquid cooling device, the base member including a lower surface configured to be placed in contact with the at least one target component, the base member defining a plurality of pockets spaced apart from one another on an upper side thereof and defining a plurality of fluid conduits configured to internally circulate a cooling liquid therethrough. Each of the plurality of pockets arranged to accommodate a corresponding fluid conduit and an interconnecting channel defined by the base member and extending between two neighboring pockets of the plurality of pockets for distributing the cooling fluid from the fluid conduit of one pocket to the fluid conduit of a neighboring pocket.

A chassis includes top rails extending along a top side of the chassis, bottom rails extending along a bottom side of the chassis, a fluid inlet connected to the chassis that is configured to receive a thermal transfer fluid, and a fluid outlet connected to the chassis that is configured to discharge the thermal transfer fluid. The chassis further includes a thermal transfer fluid path extending between and fluidly coupled to the fluid inlet and the fluid outlet, wherein the thermal transfer fluid is configured to flow through the thermal transfer fluid path, and wherein the thermal transfer fluid path extends in a serpentine pattern through at least one of the top rails and through at least one of the bottom rails.

According to one embodiment, a hybrid cooling system includes a cold plate that is arranged to mount on an IT component that is mounted on a piece of IT equipment, the cold plate is arranged to receive coolant via a supply line and to return warmed coolant via a return line, the warmed coolant is produced by the cold plate when the cold plate is in contact with the IT component and heat generated by the IT component is transferred into the coolant by the cold plate; a TEC element that is arranged to couple to the IT component; and a heat sink that includes a base that is arranged to couple to the TEC element and one or more fins, the TEC element is configured to transfer at least a portion of the heat generated by the IT component into the one or more fins of the heat sink.

Examples of a silicon cold plate with an integrated PCB are described. An apparatus may include a silicon plate, one or more electrical and thermal connections, and a heat-generating device. The silicon plate may include a first side and a second side opposite the first side, a plurality of edges between the first side and the second side, one or more internal coolant flow channels therein, one or more coolant inlet ports disposed on one or more of the edges and configured to allow a coolant to flow into the one or more internal coolant flow channels, and one or more coolant outlet ports disposed on one or more of the edges and configured to allow the coolant to flow out of the one or more internal coolant flow channels. The one or more electrical and thermal connections may be disposed on the first side of the silicon plate. The heat-generating device may be disposed on the one or more electrical and thermal connections.

A network communications device includes a chassis, a plurality of modules removably inserted into a plurality of slots in the chassis. A coolant is delivered to a first group of the plurality of modules with a first flow control valve in a first cooling loop and the coolant is delivered to a second group of the plurality of modules with a second flow control valve in a second cooling loop. The network communication device further includes a plurality of sensors for monitoring a temperature in the first cooling loop and the second cooling loop and a control system for controlling delivery of the coolant to the first group and the second group, where the control system controls transmitting a signal to one of the first flow control valve and the second flow control valve to modify a flow of the coolant.

A cold plate for cooling heat-generating components, includes two plates extending parallel to each other. A core is sandwiched between the two plates to form a sandwich structure, the core including a set of passages for passing a cooling fluid from a first edge to an opposite second edge of the sandwich structure. First and second fluid-tight joining members are disposed respectively on the first and second opposite edges of the sandwich structure, the first fluid-tight joining member including at least one inlet connector and the second fluid-tight joining member including at least one outlet connector for the passage of the cooling fluid. A method for use of the cold plate in particular as a structural part of an avionics equipment item is also provided.

A cold plate has, on a surface thereof, an attachment surface for contacting a cooling object, and has, in the interior thereof, an accommodating portion that accommodates a cooling medium. The cold plate is provided with a first opening that communicates with the accommodating portion, a body-side connection pipe is connected to the first opening, a tube-side connection pipe, which has a bendable tube connected to one end thereof, is connected to the body-side connection pipe. The body-side connection pipe and the tube-side connection pipe are connected so as to be able to rotate about the pipe axis.

In one embodiment, an apparatus includes an enclosure configured for connection to a printed circuit board, a substrate within the enclosure, a plurality of components mounted on the substrate, a fluid inlet connector, a fluid outlet connector, and a plurality of flow channels within the enclosure, at least one of the components disposed in each the flow channels and segregated from other components in another of the flow channels. The enclosure is configured for immersion cooling of the components.