An electronic rack includes an array of server shelves inserted into at least some of a plurality of standard slots of the electronic rack. Each server shelf contains one or more servers and each server includes one or more processors. At least some of the processors are mounted on cold plates for liquid cooling. The electronic rack further includes a liquid manifold shelf inserted into one of the standard slots. The liquid manifold shelf includes a pair of an upstream supply port and an upstream return port and further includes one or more pairs of a downstream inlet port and a downstream outlet port. The upstream supply port is coupled to a facility liquid supply line to receive cooling liquid from an external cooling liquid source and the upstream return port to return the cooling liquid back to the external cooling liquid source. At least some of the pairs of the downstream inlet port and downstream outlet port are coupled to the cold plates of some of the server shelves to circulate the cooling liquid to provide liquid cooling to the corresponding processors. A multifunction sectional pipes are assembled for connecting the fluid loops.

An electrical device, comprising a device housing including a skeleton-like frame structure having a plurality of columns and/or crossbeams and at least one electrical module. The module has a module housing and is detachably mounted on the frame structure. The module housing accommodates one or more electrical components generating heat when being operated, wherein the at least one electrical module is liquid cooled and is connected to a radiator for establishing a coolant circuit. The radiator and an active ventilation means are arranged in the device housing such that the radiator is positioned in an air stream generated by the active ventilation means when the active ventilation means is operated.

A fluid cooling module (or system) for peripheral component interconnect express (PCIE) electronics housed within a chassis is disclosed. The system includes a mounting rail attached to a chassis, a cold/cooling plate having one or more mounting bolts attached to a side of the cold plate, the one or more mounting bolts to lock the cold plate to a fixing channel of the mounting rail to position a surface of the cold plate against a surface of the PCIE electronics, locking teeth of the fixing channels ensure a proper pressure being loaded horizontally on the PCIE electronics by the cold plate, and a fluid loop along a length of the mounting rail to circulate a fluid to the cold plate to cool the PCIE electronics.

Housing structure for PCI Express expansion electronic boards able to mechanically stabilize said PCI Express expansion electronic boards so as to guarantee the correct functioning, performance and integrity of the electric interconnection between them and the basic electronic board to which they are connected if there are mechanical stresses such as knocks or vibrations, in order to be able to use PCI Express expansion electronic boards in the automotive field, or in scenarios characterized by perturbations of the important mechanical type. The present invention also concerns an assembly method of the housing structure.

An apparatus is disclosed comprising: a chassis including an array plate, the array plate having a plurality of first openings formed thereon; a plurality of floating inserts, each of the floating inserts being disposed in a different one of the first openings; a main board having a plurality of second openings formed thereon, the main board being coupled to the array plate via a plurality of alignment pins, each of the alignment pins extending through a respective one of the plurality of floating inserts and into a respective one of the plurality of second openings; and an electronic module coupled to the main board, the electronic module including a first connector and at least one alignment socket, the first connector being coupled to a second connector that is disposed on the main board, the alignment socket being arranged to receive a given one of the alignment pins.

An example computing device includes one or more bays to receive a pluggable module, and a cold plate assembly. The cold plate assembly includes one or more cold plates to engage with the pluggable modules and transfer heat from the modules to liquid coolant. The cold plate assembly also includes a pivoting support that supports the cold plate(s) and pivots relative to the system board, and an engagement mechanism comprising a mechanical linkage with mechanical advantage attached to the pivoting support such that moving a link of the mechanical linkage causes the pivoting support to pivot between an engaged position and a disengaged position. In the engaged position, the cold plate contacts is positioned to engaged with the pluggable module, while in the disengaged position the cold plate is disengaged from the pluggable module.

A cooling manifold positioned on an electrical or computer to provide liquid cooling for a plurality of slot-mounted electrical modules received in a corresponding plurally of module slots arranged in faceplate assembly of an electrical or computer card is described and illustrated.

An apparatus is disclosed comprising: a chassis including an array plate, the array plate having a plurality of first openings formed thereon; a plurality of floating inserts, each of the floating inserts being disposed in a different one of the first openings; a main board having a plurality of second openings formed thereon, the main board being coupled to the array plate via a plurality of alignment pins, each of the alignment pins extending through a respective one of the plurality of floating inserts and into a respective one of the plurality of second openings; and an electronic module coupled to the main board, the electronic module including a first connector and at least one alignment socket, the first connector being coupled to a second connector that is disposed on the main board, the alignment socket being arranged to receive a given one of the alignment pins.

Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly are disclosed. According to an aspect, a system includes an electronic device including one or more electronic components. Further, the electronic device includes a heat-transfer conduit including a first end and a second end. The first end of the heat-transfer conduit is positioned to receive heat from the electronic component(s). The heat-transfer conduit is configured to conduct heat from the first end to the second end. Further, the system includes a cold plate assembly including a cold plate and a mechanism configured to permit movement of the cold plate. At the first position, the cold plate may contact the second end for receipt of heat from the heat-transfer conduit at the second end. At the second position, the cold plate is apart from the second end.

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.