Modular thermal truss plates carry heat in multiple directions. Framing around an array of flat heat pipes provides mechanical and thermal connections to other truss plates, and a base, such as a satellite, thereby supporting thermally active equipment. Walls sandwich banks of flat heat pipes and may bond to a honey comb, metal core conducting heat between multiple walls. Each bank of flat heat pipes passes heat best in one direction, and may be formed of corrugated copper sheets spaced apart by a metal mesh, such as an expanded metal or screen, also stamped or otherwise formed into a corrugated configuration. Joining methods (e.g., brazing, soldering, etc.) increase stiffness, pressure containment, and strength, by binding the two layers of metal sheet to one another.

A heat dissipation apparatus includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base. The first surface and the second surface are disposed opposite to each other. A pressing plate is configured to fasten the heat-conducting plate in the accommodation cavity. The pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, and the sealing cavity is configured to accommodate the liquid channel A liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate.

An apparatus that includes a plurality of linkage arms connected one to another by one of a plurality of joints, wherein the plurality of linkage arms has a first end and a second end, and the first end is adapted to allow for removable attachment of a cold plate from a cooling assembly in a computer server, and a coupling that reversibly connects the second end of the plurality of linkage arms to a location on the cooling assembly, wherein the coupling is adapted to allow the plurality of linkage arms to be held in place at the location on the cooling assembly. The plurality of linkage arms are adapted to move along a predefined travel pathway and adapted to be reversibly converted between at least a lowered configuration and a service configuration.

A cooling manifold positioned on an electrical or computer to provide liquid cooling for a plurality of slot-mounted electrical modules received in a corresponding plurally of module slots arranged in faceplate assembly of an electrical or computer card is described and illustrated.

A server heat dissipation system is provided, comprising a liquid cooling server cabinet comprising a cabinet body and multiple liquid cooling servers provided inside the cabinet body, wherein it is provided with a liquid cooling device to perform direct liquid cooling to the liquid cooling servers, and with an auxiliary heat dissipation device to perform auxiliary heat dissipation to the liquid cooling servers. The present invention provides high density cooling, high heat exchange efficiency, no local overheating, small space occupied, high reliability, low noise, and long life.

A heat exchanger for cooling an electronic component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

A heat exchanger for cooling an electronic component includes a heat transfer chamber containing a heated substance having a first density and a liquid coolant having a second density. The heat exchanger can also include a circulation circuit that recirculates the heated substance through the heat transfer chamber for mixing with the liquid coolant.

Methods, apparatuses, and systems for fluid connections in modular cooling systems for cooling electronic components installed in equipment racks. A cold plate is positioned adjacent to a support manifold in a mated position, where the cold plate comprises a plate connector. The plate connector comprises a plate outer sleeve and defines a central passageway. The support manifold comprises a manifold connector, which comprises a manifold outer sleeve and defines a central passageway. An outer surface of the manifold outer sleeve is positioned adjacent to an outer surface of the plate outer sleeve. A cam is rotated about a pivot pin and engages with a plate retainer to secure the cold plate against the support manifold, and the central passageway of the plate connector is connected in fluid communication with the central passageway of the manifold connector.

An electronics assembly comprising at least one circuit board substrate comprising a fluid inlet channel and a fluid outlet channel and at least one heat generating component coupled to the circuit board substrate. The at least one heat generating component is fluidly coupled to the fluid inlet channel and the fluid outlet channel. A heat exchanger is directly coupled to the circuit board substrate and comprises an inlet plenum fluidly coupled to the fluid outlet channel of the circuit board substrate and an outlet plenum fluidly coupled to the inlet channel of the circuit board substrate. A pump is fluidly coupled to the circuit board substrate and the heat exchanger.

A first electronic device may comprise a chassis and first fins. The chassis may be configured to removably couple with a second electronic device. The first fins are configured to interleave with second fins of the second electronic device in a coupled state of the first and second electronic devices. A corrugated thermal interface device comprises folded fins. The folded fins are coupled to the first fins and are also removably couplable to the second fins in the coupled state of the first and second electronic devices. Each folded fin comprises one or more lateral walls, and the corrugated thermal interface device further comprises a plurality of spring fingers coupled to and extending at least partially in a lateral direction from the lateral walls. The spring finger contacts may be contacted and displaced by the second fins in the coupled state of the first and second electronic devices.